The Department of Defense's Defense Advanced Research Projects Agency (DARPA) awarded a $8,615,769 cost-plus-award-fee contract to The Pennsylvania State University, doing business as Penn State, to develop large-area, high-quality electronic-grade diamond via innovative seed cloning and tiling processes for ultra-wide bandgap semiconductors (UWBGS). The contract, which has no set-aside designation, supports DARPA's UWBGS program to create foundational, high-quality UWBG materials and electrical contacts necessary for practical UWBG electronics applications. Penn State, a public research university, has significant experience as a prime contractor and subcontractor with federal agencies like the Departments of Defense, Energy, Agriculture, Interior, and Health and Human Services, as well as with NASA, NSF, and NIH. The contract has a period of performance through July 31, 2027.
Generated 1/17/25, 9:01 AM