Cooperative Agreement 80NSSC22M0238

Ended Awarded Last action

Contract number
80NSSC22M0238
Awardee
Awarding agency
Obligated
$99,977

Award facts

Contract value 100% obligated
$99,977.09 Current and potential, with all options
Completion date 100% complete
Current and potential, with all options
Contracting staff
NAICS code
Not on record
Set-aside
No set-aside
Competition
Full and Open Competition Basic Research
Pricing
Other
Place of performance
Moscow, ID 83844, USA

Award details come from SAM.gov/FPDS.

Transactions

Action Obligated Date
Funding Only Action P00002 -$23
Other Administrative Action P00001 · Advanced flip-chip and TSV based high-temperature 3-d SIC IC packaging for venus surface exploration $0
Original award $100,000

About this award

This is a $99,977.09 cooperative agreement awarded by the Shared Services Center, a civilian federal agency, to the Regents of the University of Idaho for the development of advanced 3-D silicon carbide integrated circuit packaging for Venus surface exploration. The contract, which does not have a set-aside designation, supports the agency's program for high-temperature electronics and packaging technology to enable future robotic missions to the surface of Venus. As a prominent public land-grant research university, the University of Idaho has extensive expertise in engineering, science, and research-driven innovation, and has previously secured federal contracts and grants with agencies such as NASA, the U.S. Forest Service, and the Department of Defense.

Quick answers

Who was awarded contract 80NSSC22M0238?

80NSSC22M0238 was awarded to Regents Of The University Of Idaho by Shared Services Center (National Aeronautics and Space Administration) on August 15, 2022.

How much is contract 80NSSC22M0238 worth?

The government has obligated $99,977 on 80NSSC22M0238.

Was contract 80NSSC22M0238 competed?

The extent of competition for 80NSSC22M0238 was full and open competition.

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