Sub-Micron Die-Bonder

Added: Apr 15, 2015 4:22 pm The Air Force Test Center Operational Contracting Squadron (AFTC/PZIOA) Eglin AFB, FL intends to award a sole source firm-fixed price contract to Finetech, 560 E. German Road Suite 103, Gilbert, AZ 85297-2943 for the purchase of one (1) Finetech Fineplacer Manual Lambda Sub-Micron Die-Bonder and one (1) Bonding Force Module. Anticipated Award Date is 27 APRIL 2015. It is in the best interest of the Government to award a sole source contract.

CLIN 0001: Finetech Fineplacer Manual Lambda Sub-Micron Die-Bonder, Model A6HD, QTY: 1 EA.

CLIN 0002: Bonding Force Module, Part #FD3.1, QTY: 1 EA.

The statutory authority which permits other than full and open competition for this acquisition is 10 United States Code (USC) 2304 (c)(1), as implemented by FAR 13.106-1(b)(1). Finetech is the only known source of a die-bonder with sub-micron accuracy for flip-chipping processes. The applicable NAICS code is 334413. The size standard is defined by the U.S. Small Business Administration is 500 employees.

THIS NOTICE OF INTENT IS NOT A REQUEST FOR COMPETITIVE PROPOSALS OR QUOTATIONS. However, all responsible sources may submit a bid, proposal, or quotation which shall be considered by the agency. The Government will consider all responses received within 10 calendar days of publication. A determination by the Government not to compete this proposed contract based upon responses to this notice is solely within the discretion of the Government. Questions shall be submitted electronically to rebecca.hoppe@us.af.mil.