Sub-Micron Die-Bonder

Awarded Award Notice Posted

Solicitation number
FA2823-15-Q-8004
Agency
Air Force Test Center Air Force Materiel Command, Department of Defense
Awarded
to Finetech
Set-aside
No set-aside

Opportunity facts

Contract number
FA2823-15-P-8017 Federal contract award
NAICS code
334413 Semiconductor and Related Device Manufacturing
PSC
Not on record

Notice details come from SAM.gov. Updated .

Notice text

As posted on SAM.gov.

Added: May 18, 2015 5:50 pm

CLIN 0001: Fineplacer Manual Lambda Die-Bonder, P/N: A6HD
CLIN 0002: Bonding Force Module, P/N: FD3.1

Notice history

Notice Type Posted
Sub-Micron Die-Bonder This notice · Latest Award Notice
Sub-Micron Die-Bonder Original Award Notice

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