QA.docx
DOCX document 13 KB Posted
- Attached to
- Mask Aligner Federal contract opportunity
- Solicitation number
- W9132T20Q0061
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Other files for this federal contract opportunity
| File | Type | Posted |
|---|---|---|
| QA-2.docx | DOCX document | |
| RFQ mod-2.pdf | ||
| RFQ mod.pdf | ||
| RFQ.pdf |
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Text version
Question and Answer
Q: Which process flow is required....A or B?
A. Manual load wafer onto substrate chuck, Manual load substrate chuck into mask aligner, apply alignment and expose recipe- process automatically implemented by system software, manual unload wafer chuck from mask aligner, manual unload wafer from chuck
B. Manual Load wafer cassette in to mask aligner system, wafer is automatically by pick place system taken from cassette, aligned and mounted onto chuck via robot, automatically exposed, automatically unloaded by pick and place system from chuck and placed in output cassette
A: A
File details come from the government source that posted it. Updated .