NB6720302200363 - QAs.pdf

Page Section Para.

1 What is the wafer size?

Irrelevant to the procurement of the on-wafer probes. This procurement action covers the purchase of the wafer probes only, and is not a service contract. Wafer sizes that we plan to measure vary from individual 1 cm^2 die to 6 in wafers.

How many Die per Wafer? Irrelevant to the procurement of the on-wafer probes. This procurement action covers the purchase of the wafer probes only, and is not a service contract. The number of die per wafer vary based on the application.

How many pads per die? Irrelevant to the procurement of the on-wafer probes. This procurement action covers the purchase of the wafer probes only, and is not a service contract. The number of pads per die vary based on the application.

What is the wafer thickness? Irrelevant to the procurement of the on-wafer probes. This procurement action covers the purchase of the wafer probes only, and is not a service contract. Wafer thicknesses for our application varies from 100 um to 1 mm.

Is the wafer Silicon or other material? Irrelevant to the procurement of the on-wafer probes. This procurement action covers the purchase of the wafer probes only, and is not a service contract. Wafer materials vary from application to application, for high frequency (this procurement) III-V materials are typical.

What type of devices are these? Irrelevant to the procurement of the on-wafer probes. This procurement action covers the purchase of the wafer probes only, and is not a service contract. Devices vary by application, wafer, die.

7 Is there a die map and data sheet available (that might covermany of these questions?)

Irrelevant to the procurement of the on-wafer probes. This procurement action covers the purchase of the wafer probes only, and is not a service contract. Die maps vary based on application.

Again, this is not a service contract.

8 What is the pad metal stack up?

Irrelevant to the procurement of the on-wafer probes. This procurement action covers the purchase of the wafer probes only, and is not a service contract. Metal stack ups vary by application.

9 Do you want the bad die ink marked?

Irrelevant to the procurement of the on-wafer probes. This procurement action covers the purchase of the wafer probes only, and is not a service contract. No die will be provided for this action.

10 Do you require any aditioanl processing post test? Irrelevant to the procurement of the on-wafer probes. This procurement action covers the purchase of the wafer probes only, and is not a service contract. No die will be provided for this action.

RFQ Q&A's NB6720302200363 Question

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RFP

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QUESTION GOVERNMENT RESPONSE

Sheet1 - Table 1 - Table 1