Specification_document_19Feb16.doc

Salient Characteristics:

Physical Vapor Deposition Plasma Sputtering System

PROCESS CHAMBER:

1. D-shaped

2. 304 SS (stainless steel)

3. Minimum 18” wide x 18” deep x 20” high

4. O-ring sealed

5. Hinged lid

6. Aluminum front access door

7. Viewport with shutter and replaceable deposition shield

8. Appropriate pumping, gauging and instrumentation ports

9. Load lock or transfer vessel attachment port

10. water cooled chamber

11. air cooled re-circulation water chiller with water distribution manifold, manual turn off valves and interlocked flow switches to critical components

12. CTI-8F 1500 l/s cryo pump, water-cooled compressor and a 2-position pneumatically actuated isolation gate valve

13. 8.2 cfm dry scroll backing pump, 3 position gate valve with cryo pump capability

14. Automatic regeneration capability through touch screen controller or PC control package

15. Cryo compressor located remotely from system frame with standard 20 foot helium lines

16. Chamber base pressure < = 5 x 10-8 Torr

INSTRUMENTATION/POWER SUPPLY RACK:

1. Approx. 132” wide x 42.3” deep x 80” high

2. Stand alone instrument rack with Integrated power distribution

3. Caster wheels and leveling pads

4. Open system framework to facilitate routine maintenance

5. Power distribution center with single service drop (208VAC, 50/60Hz, 3 phase, 5-wire, 60 Amps) and emergency power off (EMO) switch

DC & RF CATHODES:

1. Five (5) total magnetron sputtering sources:

a. two (2) 2” cathodes that will accommodate 0.125 and 0.25” thick targets (one cathode with standard strength magnets and one cathode with high strength magnets for ferromagnetic materials)

b. two (2) 3” cathodes that will accommodate 0.125 and 0.25” thick targets (one cathode with high strength magnets for ferromagnetic materials and one cathode with a magnetic keeper cathode that requires no dark space shield or target clamp, contains zero o-rings and accommodates targets up to 0.375” thick)

c. One (1) 4” cathode with standard strength magnets

2. Pneumatic dome type shutters to eliminate cross-contamination between cathodes

3. Full target occlusion to eliminate the need for deposition chimneys

4. Sputtering sources installed through chamber top-plate in a sputter down configuration

5. Process pressure controls required for magnetron sputtering

CATHODE POWER SUPPLIES

1. Five (5) total cathode power supplies:

a. One (1) 300W RF power supply with automatic matching

b. One (1) 600W RF power supply with automatic matching network and control

c. Two (2) PDX500X3 1500W DC power supplies

d. One (1) 2kw Huttinger Truplasma Pulsed DC power supply

2. One cathode (TBD) dedicated to the pulsed DC supply and the other 4 cathodes will be connected to both the DC and RF supplies via multi-position switches

3. At least four (4) multi-position DC or RF switches. NOTE: RF blocking filter will be required when switching RF and DC power to the same source

SUBSTRATE BIAS/CLEANING:

1. RF/DC bias capability with appropriate darkspace shielding

2. 100W RF power supply with automatic tuning dedicated for substrate bias

3. Pneumatically actuated substrate shutter

SUBSTRATE FIXTURE WITH HEATER:

1. Substrate heater up to 800C

2. Variable speed, motor driven rotating platen (up to 20 rpm)

3. Accommodates a single substrate (up to 6” diameter, at least one holder is included)

AUTO LOAD LOCK WITH ION MILLING/ETCHING:

1. Automatic, low-profile load lock to accommodate up to a 6”wafer

2. Load lock is upgraded to accommodate sample milling or etching capability in the load lock chamber itself

3. Load lock chamber and mounting ports to accommodate a large gridded ion source, a MFC, and at least a 260 l/sec turbo pump

4. Ion source (KDC-40 4cm DC)

a. DC bias w/ filament cathode plasma ionization chamber

b. Beam current > 120mA max

c. Beam voltage 100V to 1200V max

d. Filament electron neutralizer

e. Self-aligned beam grid assembly

f. Two grid ion optics assembly w/ 4cm diameter pattern

g. KSC 1202 power supply/controller with readout

h. One channel MFC gas inlet to ion source

i. KSC 1202 auto controller

j. Pneumatic source shutter

PROCESS PRESSURE CONTROL:

1. Three (3) total gas channels for Ar, N2 and O2 sputtering

2. Reactive sputtering and co-sputtering capable

3. MKS 1179 flow controllers (0-100 sccm standard) and all required cables

4. PID upstream pressure control electronics

5. MKS 626A Baratron 100 mTorr pressure transducer

6. System vent and purge pressure regulators• NOTE: Pumping speed is regulated by the speed control turbo (or the 3-position valve when applicable) and 2 additional gas channels are quoted

7. One (1) film thickness monitor including a shuttered single crystal sensor

SOFTWARE PACKAGE:

1. User Interface application run on Windows 8 PC platform

2. Standalone real time controller executes equipment and provides uninterrupted automated process operation

3. PC with 22" full HD touch-screen monitor, keyboard with touch pad

4. PC provides supervisory interface, facilitates monitoring and manual actuation of vacuum, transfer, maintenance, and deposition process components

5. Visual display and control of System status messages, user login/logout, operation mode, and system abort

a. Vacuum Screen: Visual display of valve position, pump status and vacuum status

b. Deposition Screen: Indication of shutter position, deposition source status, source material & target life log

c. Gas Screen: Mass flow controller modes, gas valve status, pressure measurement and control display

d. Motion Screen: Display/input of position and velocity as well as control of motors

e. Cooling Screen: Water flow switch status for all cooling channels

f. Heating Screen: Temperature setpoints & control parameters, PID and Auto Tuning feature

g. Loadlock Screen: auto load/unload, pump/vent, gate valve with manual service mode-type override functions

h. Standard recipes (Pumpdown, Vent, Regen, Sample Load) included with optional user set process parameters

i. Optional Maintenance Reminder screen

j. Standard Chart Recorder (plots up to 10 signals or “pens” simultaneously) and datalogging (.csv file)

k. Graphical Recipe Builder generates a recipe via mouse or touchscreen selectable user interface components

l. Recipe Database Screen provides selection & editing of stock recipes, with copy functionality for modification of existing & saving of new recipes

m. Ability to export/import recipes

n. Programming/control via a keyboard/touch pad or pop-up window on touch screen

o. Supports multiple user accounts and password levels with custom security access for recipes and screens. Standard user security levels Users with full access can edit recipes and control interlocks. Restricted access users are limited to running certain recipes and have no control over interlocks. Individual screen access can be separately assigned to any user.

p. System event log captures all user login/logout events, all recipes executed, and system status messages

q. No software run time license or key required

DOCUMENTATION:

a. Customer drawing package (including general assembly, vacuum schematic, water flow schematic, and electrical schematics)

b. Operation manual provided in English

SYSTEM ACCEPTANCE

a. The system is verified to meet standard performance specifications prior to shipment.

b. Deposition sources will be tested with standard materials per PMF-PED-282 Standard Test Materials

c. System will be configured to achieve +/- 5% film thickness uniformity over a 6" wafer (with 5mm edge exclusion).

SYSTEM PLACEMENT, UTILITIES, AND CONNECTIONS

a. Customer is responsible for placement and connection of the system at the customer’s facility.

b. Customer is responsible to provide all required utilities including but not limited to compressed air, water, process/vent gas, electric, dedicated earth ground.

c. An installation requirements document will be provided to the customer with mechanical drawing packages and prior to system shipment.

SPARE PARTS PACKAGE:

Routine and preventative maintenance items including chamber & viewport seals, spare CF/VCR gaskets, KF/ISO centering rings, ferrules, fuses, substrate holder clips, spare heater bulbs, crystal sensor pack, mist eliminator cartridge/filter, fluid charge, etc.

WARRANTY: Minimum of a two (2) year warranty

INSTALLATION AND TRAINING:

a. Contractor will perform initial system start-up/installation (1-2 days) and training (1-2 days) once the customer verifies that all utility connections have been made and are in service.

b. Contractor will provide up to 6 hours of remote installation support for customers after equipment start up.