ENGIEERINGDATAREQUIRMENTS.pdf

REV: ENGINEERING DATA REQUIREMENTS

(ATTACHMENT “A”)

NOTE: MILITARY SPECIFICATIONS / STANDARDS WILL NOT BE FURNISHED IN THE BID SET.

1. THE FOLLOWING INSTRUCTIONS ARE FURNISHED FOR THE MANUFACTURE OF:

ASSEMBLY, PRINTED CIRCUIT BOARD

2. PART NUMBER:

201126351-30

3. NATIONAL STOCK NUMBER:

5998-01-629-5711

PREPARED BY:

JONATHAN TUCHOW

OFFICE SYMBOL:

DATE:

4/6/2020

HILL AFB FORM 462 Page 1 of 1

4. THE FOLLOWING SPECIFICATIONS/STANDARDS, ETC., WILL BE USED IN LIEU OF THE DATA INDICATED. THE

SUPERSEDED DATA WILL NOT BE FURNISHED UNLESS SO INDICATED.

5. THE SOURCES/MATERIALS IF LISTED ON THE SPECIFICATION, STANDARDS AND DRAWINGS ARE THE ONLY SOURCES/MATERIALS FOR THOSE ITEMS. ANY SUBSTITUTIONS SHALL HAVE PRIOR APPROVAL BY THE COGNIZANT OO-

ALC ENGINEERING ACTIVITY.

6. MARKING PER MIL-STD-130 IN LIEU OF FPS-3008

7. EFFECTIVE 9 MAY 2005 THE DEPARTMENT OF THE AIR FORCE ISSUED AN AIR WORTHINESS ADVISORY (M-05-01) REGARDING THE USE OF LEAD-FREE SOLDER IN ELECTRICAL AND ELECTRONIC MILITARY PRODUCTS. TO DATE, NO LEAD-FREE SOLDER FORMULATION HAS MATCHED THE RELIABILITY AND PERFORMANCE QUALITIES OF THE STANDARD LEADED SOLDERS. THEREFORE, UNTIL SUCH TIME AS A SUITABLE, RELIABLE LEAD-FREE SOLDER REPLACEMENT IS IDENTIFIED, ALL ELECTRONIC EQUIPMENT SUPPLIERS SHALL CONTINUE TO PROVIDE THE DEPARTMENT OF THE AIR FORCE WITH ITEMS WHICH MEET ALL PERFORMANCE, COMPATIBILITY, AND RELIABILITY STANDARDS PREVIOUSLY ESTABLISHED WITH LEADED SOLDERS. FAILURE TO DO SO, COULD ADVERSELY IMPACT THE

PERFORMANCE AND RELIABILITY OF WEAPON SYSTEMS AFFECTING NATIONAL SECURITY.

8. THE COMPLETED ESDC CIRCUIT CARD ASSEMBLY (P/N 201126351-30) MUST PASS ACCEPTANCE TEST PROCEDURES (ATP10001056) 20156882 AS TAILORED HEREIN. ATP10001056 INCLUDES: 1) THE SELECT-AT-TEST COMPONENT PROCEDURE, 20156882, SHALL BE COMPLETED AS PART OF THE TESTING PROCESS. A SELECT AT TEST COMPONENT REPORT (DSN1004) SHALL BE SUBMITTED WITH EACH COMPLETED CIRCUIT CARD. A TEST REPORT SIMILAR TO THE ATTACHED TEST REPORT FOR F-16 ENHANCED SIGNAL DATA CONVERTER P/N: 201126351-30 SHALL BE SUBMITTED, RECORDING THE REQUIRED THERMAL CYCLING FOR ALL DELIVERED ASSEMBLIES.SELECTION, PLACEMENT, AND TESTING. 2) VIBRATIONAL AND THERMAL TESTING. 3) FUNCTIONAL TESTING PASS/FAIL CRITERIA.

Tailoring for ACCEPTANCE TEST PROCEDURE FOR ENHANCED SIGNAL DATA CONVERTER, 20156881, Paragraph 2.2: Deleted Paragraph 2.3: Deleted Paragraph 2. RANDOM VIBRATION AND THERMAL CYCLES is applicable for QUALIFICATION UNITS ONLY

9. POTENTIAL VENDORS ARE REQUIRED TO BE ISO 9000/9001 CERTIFIED. A SURFACE-MOUNT TECHNOLOGY (SMT) SOLDER INSPECTION SYSTEM AND PROCEDURES AND AUTOMATED OPTICAL IMAGING (AOI) MUST BE IN PLACE AND

APPROVED BY THE COGNIZANT OO-ALC ENGINEERING AVTIVIY PRIOR TO CONTRACT AWARD.