E-PHI BAA attachment v5.pptx

PPTX presentation 590 KB Posted

Attached to
Electronic-Photonic Heterogeneous Integration (E-PHI) Federal contract opportunity
Solicitation number
DARPA-BAA-11-45
Issued by
Defense Advanced Research Projects Agency

About this file

Slide Summary Template

View the file

Other files for this federal contract opportunity

Other files attached to Electronic-Photonic Heterogeneous Integration (E-PHI), newest first.
File Type Posted
DARPA-BAA-11-45_E-PHI_Amendment 01_Final For Posting_24 May 11.pdf PDF
DARPA-BAA-11-45_E-PHI_Final for Posting_14Apr11.pdf PDF
Approved_Proposer_Checklist.pdf PDF

On GovTribe

Work with this file on GovTribe

  • Download the original file
  • Contacts named in this file
  • Similar government files
  • Ask GovTribe AI about this file

Text version

Prime Contractor: Title of Proposal Technical Area(s) of Proposal Mark appropriately on each slide, not on master

Performer Team:

Team Lead: Name Affiliation (Summary of Role) Subcontractor 1: Name Affiliation (Summary of Role) Sub 2: Name Affiliation (Summary of Role) N. Sub N: Name Affiliation (Summary of Role) Include Logos For All Team Members Innovative Claims/Challenges:

Innovations represented by your proposed heterogeneous integration approach(es)

Primary challenges to be overcome Schedule and Budget:

Give total cost and duration (in months) of each segment of the program, separated by key intermediate milestones.

Program Goals:

List Demonstration Type (if proposing to Technical Area III)

Description of final goal of proposed work (consider including figure(s) if appropriate)

Quantitative proposer-defined end-of-program goals

4/4/2011

Overview and Innovations

Replace box with supporting graphic(s) (processing overviews, block diagrams, etc) Resize and/or divide area as needed Summarize key heterogeneous integration process technology that will be developed and/or utilized; list integrated materials and devices to be employed Include block diagram(s) of the process flow (Technical Area I), architectures to be evaluated (Technical Area II), and/or proposed demonstration microsystem (Technical Area III) Summarize design innovations that will enable achievement of the end of program goals.

Summarize limitations/tradeoffs (e.g. process compatibility, thermal management, etc.) of proposed process, architecture, and demo circuits in your approach.

Provide details on primary challenges to be overcome Mark appropriately on each slide, not on master

Goals, Milestones, Transition Mark appropriately on each slide, not on master

Program Timeline

Key Program Milestones (Add as many milestones with quantitative descriptions as needed). Milestone spacing should be roughly to scale. Delete this text.

Milestone 1 Milestone 2 Milestone n

Show Duration → [Number of Months between each milestone]

Replace box with metrics table(s) here Resize and/or divide area as needed Describe all program metrics, including intermediate and performer-defined – use table format (see BAA metrics tables for preferred table format) Show your proposed program structure and summarize key milestones that lead to achievement of program goals (can be indicated in timeline format below) Describe potential technology transition opportunities.

image1.png image5.png

File details come from the government source that posted it. Updated .