SOW_for_FC300-done_rev3.docx

STATEMENT OF WORK FORMAT

High Force Flip Chip Bonder

PCN:

Background The GSFC Detector Development Laboratory (DDL) has a requirement to acquire a Flip Chip Bonder with high force capabilities. The system is used to mate detector arrays, components or similar devices to readout electronics or other focal plane components. The system should be suitable for bonding small parts with low force as well as larger focal plane arrays requiring high force. The system shall include all necessary software and hardware to enable precision alignment, force control and temperature control. The vendor shall provide technical support of the equipment.

Objectives The objective of this project is to procure a high force Flip Chip Bonding Tool.

Scope The scope of this work includes production and delivery of a Flip Chip Bonding tool. The Bonder, which consists a vacuum system, heaters, substrate chuck, alignment stage, bonding head/arm, a computer control system and microscope, is used to mate components with high precision and high force. This combination of alignment with high force bonding will enable large focal plane devices to be produced. The Bonding tool will enable new capabilities for improved performance of products manufactured in the DDL. With our existing low force bonder aging, and nearing end-of-life, the procurement of this tool is essential for many projects under development and in production in GSFC’s Detector System Branch. Maintaining existing capabilities in low force bonding of small components is required for many projects, and adding a high force component increases our capabilities. In particular, the equipment is needed to realize future missions such as next generation Microshutters, WFIRST and next gen TIRS, which are important to Goddard’s lines of business.

No prototypes or one-of-a-kind systems will be considered. The unit must be a production model with at least 5 similar units working in the field. The following milestones are expected.

a) Design of the Tool at the vendor location.

b) Approval of the design by the GSFC technical representative, communicating requirements to GSFC for installation including electrical power needs, gasses vacuum and other utilities as required.

c) Construction of the Tool at the vendor facility.

d) Crating and Shipping of the unit to GSFC where the vendor’s personnel shall install it.

e) Installing, demonstrating, and training, of approximately three GSFC personnel, on all functions of the Tool at GSFC.

f) Acceptance testing of the Tool at NASA.

Tasks or Requirements The Supplier shall provide a new Flip Chip Bonding tool. The Supplier shall insure that the Tool is equipped with the following equipment and meet the following requirements prior to Acceptance of System:

High Accuracy Flip Chip Bonder Tool Requirements

1. A brand new unit is required; no used equipment or accessories, listed below, are acceptable.

2. Meets current industry standard (semi S2) requirements for safety including the use of Emergency Off (EMO) panic buttons. Shielding, and interlocks for hazardous areas protecting the user and maintenance personal from high voltages, pneumatics, and moving parts and the tool from potential service failures.

3. Tool Requirements to meet the Government Need

3.1. The tool shall include semi-automatic operation capable of the following.

3.1.1. Post bond accuracy of +/- 0.5 um

3.1.2. Automatic loading of components from trays

3.1.3. Automatic alignment within +/- 0.1 um

3.2. The tool shall include a Frame with granite support structure and passive dampers for vibration control.

3.3. The alignment stage shall accommodate large substrates up to 300 mm in size and have position accuracy with 10 nm resolution with stage travel > 100mm.

3.4. The Bonding Arm shall be capable of applying force from 1 to 4000 Newtons. The force measurement shall have an accuracy of better than 2% of the applied force and include a 1 Newton touchdown sensor. The arm shall include Motor controlled leveling +/- 0.12 degrees with resolution 4.7 uradian or better.

3.5. The microscopes shall allow for top and bottom overlay viewing simultaneously of substrate and part. The microscope shall be able to accommodate substrates up to a thickness of 5mm.

3.6. An Autocollimator function shall be utilized for leveling, using a spot size of 8mm and capable of sensitivity 10 uradian/pixel.

3.7. The tool shall include an Automatic Alignment function that utilizes pattern recognition.

3.8. The tool shall be capable of handling a chip thickness up to 6mm but shall also allow up to 9 mm by modification of system parameters or tooling thickness.

3.9. The tool shall be capable of handling a substrate thickness up to 6mm but shall also allow up to 7.5 mm by modification of system parameters or tooling thickness.

3.10. An optical levelling system shall be included for low reflectivity components. This system shall employ 2 to 16 different focus points. It shall include a confocal system with a spot diameter of 6 microns or smaller with measurement resolution of 0.05 um or smaller.

3.11. A surface imaging system shall be included in the tool capable of measuring an array of points across a part and generating a 3D representation of the part. In addition this system shall be capable of creating a topography map of both chip and substrate prior to bonding.

3.12. The tool shall include software to assure full automatic calibration of the machine, allow for motorized autocollimation and sub pixel analysis vision system.

3.13. The tool shall include a 100 mm bonding head, with force measurement in the bond arm, having temperature control from 1-450 C with 5% uniformity and 1C resolution.

3.14. The tool shall have a 200 mm heated substrate chuck, having temperature control from 1-450 C with 5% uniformity and 1C resolution. In addition this chuck shall have Four (x4) M5 threaded holes on the baseplate for use as mounting holes to secure parts to the chuck.

3.15. In addition, the following components shall be included to meet the government requirements.

3.15.1. Bonding Tool (Quantity 2)

3.15.1.1.1. 105 mm Flat, Optically polished bonding tool

3.15.1.1.2. Silicon Carbide

3.15.1.1.3. 5.5 mm thick

3.15.1.1.4. Flatness < 1um

3.15.2. Bonding Tool (Quantity 1)

3.15.2.1.1.1. 200 mm Flat, Optically polished bonding tool

3.15.2.1.2. Silicon Carbide

3.15.2.1.3. 5.5 mm thick

3.15.2.1.4. Flatness < 1.2um

3.15.3. Large Field of View

3.15.3.1.1. Additional Camera with large FoV: 50 x 50 mm

3.15.4. Process Module Ionizers for ESD protection over the process area and component storage area

3.15.5. Internal Laminar Flow

3.15.5.1.1.1. HEPA filter 99.99% filtration of particles 0.3 m

3.15.5.1.1.2. Vertical Laminar flow at 600 m^3/h

3.15.6. Spare Parts Kit

3.15.6.1.1.1. Consumables coverage for two years of operation

3.15.7. Calibration Kits

3.15.7.1.1.1. Parallelism 50 mm Mirror

3.15.7.1.1.2. Reticle 50 mm

3.15.7.1.1.3. Quartz Test Chips with vernier scale

3.15.7.1.1.4. Force Sensors for calibration of tool at low, medium and high force ranges

3.15.7.1.1.5. Temperature Sensor for calibration of tool

3.15.7.1.1.6. 105 mm SiC bonding head calibration tool

3.15.7.1.1.7. 205 mm SiC bonding head calibration tool

3.15.7.1.1.8. 105 mm special thick SiC bonding head calibration tool

4. Computer and Tool interface

4.1. The Tool shall include a computer interface for control of the system and logging of all process parameters. The computer shall run Windows 10 operating system.

4.2. The Tool interface shall allow access to recipe creation and editing, display current conditions of facilities such as vacuum levels and gas pressures, access process data logging.

5. Tool Diagnostics and Logging

5.1. The Tool shall incorporate a comprehensive internal hardware diagnostics system encompassing all subsystems, complete with hardware/software self-test executed at user request. All faults, errors, and unusual conditions shall be logged by the control system.

5.1.1. Process data and parameters shall be logged as a function of time by the Tool software diagnostics system.

6. Facilities

6.1.1. The Tool and all required facilities shall be specified at the time of award and GSFC shall be notified of these requirements.

6.1.2. Exterior surface parts shall be clean and free of grease or dust and compatible with operation in a Class 100 cleanroom environment.

7. Installation and Training

7.1.1. The price of the system will include installation at GSFC. Installation will include a demonstration that the tool is within compliance with the specifications.

7.1.2. The price of the system must include delivery of the tool to Goddard Space Flight Center.

7.1.3. At the completion of installation and demonstration, the successful contractor will provide on-location training at GSFC.

8. Documentation and Warranty

8.1.1. Two (x2) full sets of all written documentation shall be provided on cleanroom paper. This will include user manuals or equivalent as well as copies of any software, and any manuals for the software included with the system. This documentation should be received by GSFC with the system hardware.

8.1.2. The contractor will offer the GSFC at least the same warranty terms, including offers of extended warranties, offered to the general public in customary commercial practice. Warranty terms must be included in the system price. The period of warranty will begin upon acceptance of the system.

The Supplier shall install the system on-site at GSFC’s Detector Development Laboratory or another, designated, laboratory in Code 553 control and provides operator training of the system. Together with GSFC technical personnel, the Supplier shall review the system, demonstrate and confirm that the system functions properly based on the specifications above.

Supplier shall provide a Warranty of at least 12 Months (Parts and Labor), guaranteed to meet factory specifications.

Installation and training shall be performed by a factory trained technician at NASA/GSFC.

The technical merit of the Suppliers’ proposal will be evaluated in terms of by how much they exceed the technical specifications listed in this statement of work.

Deliverables or Delivery Schedule Deliver complete specified (as described above) system. Set up and install all components at GSFC Detector Development Laboratory.

1. Demonstrate system with specified performance/acceptance criteria (described above). Acceptance of system will be conditional upon successful demonstration of functions.

1. Provide user training for equipment operation.

1. Equipment warranty on parts and labor for at least one year.

1. Operational manuals and maintenance manuals with circuit schematics and layouts.

1. Spare parts.

Delivery Schedule Within 10 months after receipt of order.

Government-Furnished Equipment and Government-Furnished Information No Government-furnished equipment (GPE) and Government-furnished information (GFI) will be required

Security The Supplier Representative who will be installing the DRIE and Training NASA personnel must be a US Citizen.

Place of Performance The Construction of the Tool shall be performed at the Supplier’s facilities.

The Installation and Training shall be performed at NASA/GSFC, Greenbelt, Maryland.