Flip_Chip_Bonder_Statement_of_Work.pdf

PDF 274 KB Posted

Attached to
High Force Flip Chip Bonder Federal contract opportunity
Solicitation number
80GSFC19P0005
Issued by
National Aeronautics and Space Administration Goddard Space Center

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Statement of Work for the High Force Flip Chip Bonder

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File Type Posted
SOW_for_FC300-done_rev3.docx DOCX document

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