Texas Microsintering LLC received a $305,000 Phase I Small Business Innovation Research (SBIR) award from the National Science Foundation's Directorate for Technology, Innovation, and Partnerships (CFDA 47.084) effective October 1, 2025, through September 30, 2026. The project focuses on developing microscale selective laser sintering (μ-SLS), an advanced 3D printing technology designed to manufacture custom metal interconnect structures for semiconductor packaging. This additive manufacturing process uses a digital micromirror device to pattern laser energy and fuse metal nanoparticles into three-dimensional interconnects directly from digital specifications, eliminating the need for expensive custom tooling and lithography processes.
The primary deliverable is a viable, cost-effective additive manufacturing process for low-volume, high-mix semiconductor applications that reduces production timelines and costs for specialized chip interconnects. The technology addresses critical market needs in defense electronics, medical devices, and scientific research by enabling rapid prototyping and development of custom semiconductor components. The awardee's business strategy centers on licensing the proprietary technology to equipment manufacturers to ensure broad market adoption, leveraging the process's unique combination of speed, precision, and flexibility to establish competitive advantage while strengthening domestic semiconductor manufacturing capabilities.