Project Grant 2505353

Award Date 4/1/25
Completion Date 3/31/26
Dollars Obligated $305K
Federal Grant Program
47.084
Assistance Type
Project Grant
Place of Performance
Hillsboro, OR 97124, USA
Similar Awards
This National Science Foundation (NSF) Technology, Innovation, and Partnerships (CFDA 47.084) Project Grant award of $275,000 to United Semiconductors, LLC supports the development of two critical hardware components for in-space manufacturing of advanced semiconductor materials: A Universal Crystal Growth Capsule designed to leverage microgravity conditions during crystal growth, enabling high-throughput production of high-purity semiconductor crystals. A novel Wafer Dicing Tool to...
This $274,915 Small Business Innovation Research (SBIR) Phase I award from the National Science Foundation's (NSF) Technology, Innovation, and Partnerships (CFDA 47.084) program supports the development of a novel additive manufacturing technique for fabricating multifunctional ceramic monoliths with internal flow structures. The project aims to advance a dry powder pressing additive manufacturing process that can deposit multiple functional materials with high lateral precision, densify...
This $275,000 Small Business Innovation Research (SBIR) Phase I award from the National Science Foundation (NSF) Technology, Innovation, and Partnerships (CFDA 47.084) program supports the development of a RISC-V and FPGA pipeline-coupled heterogeneous compute microprocessor architecture and emulation software tools. The project aims to revolutionize computer architecture by shifting from traditional instruction-based computing to flexible content computing, executing application software as...
This National Science Foundation (NSF) Technology, Innovation, and Partnerships (CFDA 47.084) Project Grant award provides $274,995 to Tiptek, LLC, a small business focused on advanced semiconductor and nanotechnology research and development. The funding supports a Small Business Innovation Research (SBIR) Phase I project to improve semiconductor nanoprobe technology used for diagnosing electrical faults in cutting-edge computer chips. The project aims to develop a novel additive...
This National Science Foundation (NSF) Technology, Innovation, and Partnerships (CFDA 47.084) Phase I Small Business Innovation Research (SBIR) grant of $275,000 awarded to Fourier LLC aims to advance the development of thermoformable technical ceramics for thermal management solutions in electronics. The project seeks to mitigate key technical challenges to enable the commercial adoption of this innovative ceramic technology, including improving material robustness, establishing scalability...
This Cooperative Agreement award from the National Science Foundation (NSF) Technology, Innovation, and Partnerships (TIP) program (CFDA 47.084) provides $1,184,000 in funding to Sangtera Inc. to develop a small form-factor precision stage to enable high-volume manufacturing of next-generation high-performance computing devices utilizing 3D stacked chiplets. The project aims to design, fabricate, and characterize a prototype precision stage that can achieve 100 nm positioning precision and 1...
This National Science Foundation (NSF) Technology, Innovation, and Partnerships (CFDA 47.084) Phase I Small Business Innovation Research (SBIR) project provides $305,000 in funding to Main Engineering LLC to develop a high-precision time-to-digital converter (TDC) chip. The TDC chip is designed to enable picosecond (trillionth of a second) timing accuracy for applications in nuclear physics research, light detection and ranging (LIDAR), and medical imaging. The project aims to create a...
Crystal Sonic Inc. received a $275,000 Small Business Innovation Research Phase I project grant from the National Science Foundation under the Technology, Innovation, and Partnerships program (CFDA 47.084). The grant supported the development of a new approach to lower the cost of advanced semiconductor manufacturing through the use of acoustic energy to precisely cut and lift off thin semiconductor devices from their host substrates without waste. By enabling substrate reuse, this...
This $275,000 Small Business Innovation Research (SBIR) Phase I award from the National Science Foundation (NSF) Technology, Innovation, and Partnerships (TIP) program (CFDA 47.084) supports Prhobe Inc.'s development of an innovative logistics tracking system. The project aims to revolutionize logistics and transport management by providing real-time visibility at the serial number level through the integration of wireless technologies including RFID, UWB, and cellular. The system will attach...
This SBIR Phase I award from the National Science Foundation's (NSF) Technology, Innovation, and Partnerships (TIP) program, with a total funding amount of $274,985, is focused on developing an artificial intelligence (AI) system to accelerate semiconductor production using physics-embedded lithographic foundation models. The project aims to alleviate design and manufacturing complexities associated with the shift to extreme ultraviolet (EUV) lithography in semiconductor manufacturing, which...

This $304,507 Small Business Innovation Research (SBIR) Phase I project, awarded by the National Science Foundation (NSF) under the Technology, Innovation, and Partnerships (CFDA 47.084) program, focuses on developing an innovative technology for fast and precise transfer of ultra-thin semiconductor chips during manufacturing. The project aims to address the challenges of handling and transferring these fragile ultra-thin dies, which are critical building blocks for emerging mobile and flexible electronics applications. Key components of the technology being developed include a vacuum-activated, patterned stage to enable collective delamination of dice from the dicing tape, and a pattern-sensitive, individually addressable head for electromagnetic pick-and-place of the released dice. This technology has the potential to increase the U.S. footprint in the advanced semiconductor chip assembly and packaging equipment market by improving yield and reducing costs associated with handling ultra-thin semiconductor devices.

Generated 4/8/25, 3:52 AM