This Project Grant award from the National Science Foundation (NSF) Engineering program (CFDA 47.041) provides $235,000 in funding to the University of Connecticut (UConn) to conduct research related to a novel manufacturing process called "form-fuse" that can create geometrically-conformal electronics. The research aims to understand the key physical mechanisms that drive the electrical performance of this process, which has the potential to enable advanced electronics for critical applications in industries like aerospace, automotive, and biomedical. Specifically, the project will involve experiments to characterize the impact of the polymer's thermomechanical history on electrical performance, establish physics-based models to reveal the deformation mechanisms that impact conductivity, and develop techniques for scalable process design. This fundamental research is expected to create the scientific foundation for more cost-effective manufacturing of high-performance conformal electronics through the form-fuse approach.
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