This Project Grant award from the National Science Foundation's (NSF) Integrative Activities (IA) program, CFDA 47.083, provides $393,500 to the University of Cincinnati to acquire an advanced direct write lithography (DWL) instrument. This equipment will enable the fabrication of micro/nanostructures across diverse planar and non-planar substrates, accelerating research and education in areas such as microelectronics, semiconductors, quantum electronics, photonics, BioMEMS, vacuum electronics, and energy harvesting devices. The DWL tool will also support the university's semiconductor workforce development efforts through the Ohio-Southwest Alliance on Semiconductors and Integrated Scalable-Manufacturing (OASIS) program, which trains engineers and technicians. The award period runs from September 1, 2024 to August 31, 2027. No sub-awards are planned under this grant.
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