The Massachusetts Institute of Technology (MIT) received a $185,595 Project Grant award from the National Science Foundation (NSF) Division of Civil, Mechanical, and Manufacturing Innovation on July 1, 2021 to support research titled "EAGER: TRANSFER BY CONTACT USING ADHESION ENGINEERING FOR INTEGRATION OF TWO-DIMENSIONAL MATERIALS INTO FUNCTIONAL DEVICES." The award is part of NSF's Engineering (ENG) program (CFDA #47.041), which seeks to improve quality of life and economic strength through fostering innovation and excellence in engineering research and education. Specifically, MIT will conduct research under this award to develop techniques for integrating two-dimensional materials into functional devices using contact transfer and adhesion engineering. The research is intended to support the ENG program's goals and will be completed by August 31, 2022.
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