This Cooperative Agreement award by the National Science Foundation (NSF) under the Technology, Innovation, and Partnerships (TIP) program (CFDA 47.084) provides $500,000 in funding to Lumina Instruments Inc. to develop innovative glass inspection technology for advanced semiconductor packaging.
The project aims to create a highly sensitive process control technology to perform full surface inspection of large glass substrates (300 mm) for defects as small as 300 nm in diameter. This technology will address key glass inspection challenges faced by the semiconductor industry, leading to substantial improvements in yield for semiconductor packaging companies. The broader commercial and societal impact includes enhancing the U.S. semiconductor industry by enabling the production of higher-quality electronic products like smartphones, laptops, and 5G components that will be more affordable and widely available to consumers. Additionally, the project will support American jobs, national security, and the global competitiveness of the U.S. semiconductor industry.
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