This is a firm fixed-price purchase order awarded by the National Aeronautics and Space Administration (NASA) Shared Services Center to Set North America, LLC, a manufacturing and services organization, to provide a software upgrade for FC150 and FC300 flip chip bonders. The contract has a ceiling value of $30,875.00 and a completion date of October 25, 2024. The software upgrade will enable manual pre-alignment capabilities and force sensor calibration updates on the respective bonders, which...
This firm fixed-price purchase order for $61,405.76 was awarded by the Shared Services Center of the National Aeronautics and Space Administration (NASA) to JB Technical Support Service LLC, a self-certified small disadvantaged business, to provide an extended warranty for a FC300 flip chip bonder located at the Goddard Space Flight Center. The contract covers maintenance and support services for this specialized aerospace equipment through August 6, 2024. This sole-source award was made under...
This is a firm fixed-price purchase order awarded by the National Aeronautics and Space Administration (NASA) Goddard Space Flight Center to JB Technical Support Service LLC, a self-certified small disadvantaged business, for $143,210.33. The contract is for the procurement and onsite installation of new electronics for NASA's FC150 flip chip bonder, including a new controller, screen, and temperature regulators. This contract is not associated with a larger vehicle and does not have a set-aside...
The National Aeronautics and Space Administration (NASA) Goddard Space Center awarded a firm fixed price purchase order to F & K Delvotec Inc., a foreign-owned for-profit organization, to procure a wire bonder capable of fully automatic wire bonding of devices at a high rate. The system must be capable of ball bonding and wedge-wedge bonding, both 45 degree and 90 degree, and be convertible by the end user between different types of bonding. The potential value of the contract is...
This is a 2-year firm fixed price purchase order contract awarded by the National Aeronautics and Space Administration's (NASA) National Shared Services Center (NSSC) to JB Technical Support Service LLC, a self-certified small disadvantaged business, for preventative maintenance on NASA's FC150 and FC300 flip chip bonders located at the Goddard Space Flight Center. The contract has a ceiling value of $45,300.00 and will run from April 30, 2025 to April 29, 2027. No set-aside was used for this...
This $31,270 firm-fixed-price purchase order was awarded by the Shared Services Center of the National Aeronautics and Space Administration (NASA) to JB Technical Support Service LLC, a self-certified small disadvantaged business, for maintenance of FC150 and FC300 flip chip bonders. The contract has an ultimate completion date of April 30, 2025. JB Technical has previously provided maintenance, extended warranties, and preventative upkeep for NASA's and the Department of Commerce's flip chip...
<p>This is a firm fixed-price purchase order contract awarded by the Goddard Space Center, a civilian agency, to F & K Delvotec Inc., a for-profit foreign-owned company, for a bonder machine bondhead, gold ball bond head, pattern recognition software, and digital generator. The total ceiling value of the contract is $147,742.34, and the ultimate completion date is August 30, 2015. The contract is not associated with a set-aside program.</p>
<p>The National Aeronautics and Space Administration (NASA) Shared Services Center awarded a Firm Fixed Price Purchase Order to Tresky Corp, a for-profit organization, for a DIE-ATTACH (DIE BONDER) MACHINE. The contract, which did not have a set-aside designation, was awarded on April 6, 2018 with a potential value of $124,698.00 and a completion date of August 17, 2018. The place of performance is Morganville, Marlboro, NJ, USA.</p>
<p>This is a $21,420.00 firm fixed-price purchase order awarded by the National Aeronautics and Space Administration (NASA) Shared Services Center to Silitronics Solutions Inc., a minority-owned, woman-owned manufacturer of goods. The contract is for the performance of fiber alignment and bonding of fiber array units (FAUs) and photonic integrated circuits (PICs). The award does not have a set-aside designation, and the period of performance extends through August 25, 2025.</p>
This is a purchase order contract awarded by the National Aeronautics and Space Administration (NASA) Shared Services Center to Avnet Inc., a distributor of electronic components, enterprise computer and storage products, and embedded subsystems. The contract is for the delivery of Field Programmable Gate Arrays (FPGAs) in support of NASA's Navigation Doppler Lidar (NDL) program, which is located at the NASA Langley Research Center. The contract has a firm fixed price of $180,000.00 and a...
This is a firm fixed-price purchase order awarded by the National Aeronautics and Space Administration (NASA) Goddard Space Flight Center to Set North America, LLC, a for-profit limited liability company, for the purchase of a flip chip bonder with high force capabilities. The contract, valued at $1,481,861.00, does not have a set-aside designation and was awarded on May 24, 2019 with a completion date of August 31, 2022. The flip chip bonder will provide new capabilities to support the manufacture of advanced detector systems for future NASA missions, including the ability to accurately align and bond large focal plane arrays requiring high force between 1 to 4,000 Newtons. Set North America, LLC was identified as the only vendor capable of meeting the specific technical requirements. The contract was awarded through a sole-source procurement under the authority of 10 U.S.C. 2304(c)(1) and FAR 6.302-1.