Purchase Order 1333ND21PNB680052

This is a $5,358,861 cost-plus-fixed-fee contract awarded by the Defense Advanced Research Projects Agency (DARPA) to Intrinsix Corp., a for-profit electronics design services firm, to provide integrated circuits in the form of single-function chiplets to support DARPA's CHIPS platform. The contract, which does not have a set-aside designation, was awarded on September 14, 2017 and is scheduled for completion on September 13, 2020. Intrinsix has previously received SBIR awards from DARPA for...

This is a Small Business Innovation Research (SBIR) Program Phase I contract awarded by the National Aeronautics and Space Administration (NASA) to Microelectronics Research Development Corporation (Micro-RDC), a for-profit organization, for the development of a radiation-hardened double data rate (DDR) embedded macro. The objective is to create a cost-effective and quick-turn integrated circuit (IC) digital fabric capable of meeting the demanding requirements of space-based electronic control...

This is a two-phase Small Business Innovation Research (SBIR) program contract awarded by the National Aeronautics and Space Administration (NASA) to Genesic Semiconductor Inc., a minority-owned small business. The $125,000 Phase I contract aims to develop integrated silicon carbide (SiC)-based analog and digital circuits, including SiC power metal-oxide-semiconductor field-effect transistors (MOSFETs), to enable a monolithic, highly integrated gate driver circuit. Key goals include...

This is a firm fixed price purchase order contract awarded by the Defense Microelectronics Activity (DMEA), a component of the Department of Defense, to Interconnect Systems International, LLC (doing business as Bittware), a subsidiary of Koch Industries Inc. The contract is for the design, validation, and manufacture of custom overmolded multi-chip module (MCM) devices known as "Rhinestone" in a ball grid array or quad-flat no-lead package. The contract has a ceiling value of...

This is a $238,458 cost-plus-fixed-fee contract awarded by the Defense Advanced Research Projects Agency (DARPA) to Ozark Integrated Circuits Inc., a small business specializing in custom analog and mixed-signal integrated circuits and microelectronics for extreme environments. The contract is for the packaging and testing of lateral SiC integrated circuits capable of operating at 800°C, which has applications in areas such as space exploration, hypersonic systems, directed energy weapons, and...

This is a firm fixed-price definitive contract awarded by the Defense Logistics Agency (DLA) Land and Maritime to the Canadian Commercial Corporation (CCC) for the procurement of a Microcircuit, Hybrid item with the National Stock Number (NSN) 5962-01-491-4669. The contract has a total potential value of $360,570.00 and a completion date of May 28, 2024. The original solicitation was a pre-solicitation notice to identify interested parties for the requirement, which is restricted to the approved...

This is a firm fixed-price purchase order contract awarded by the Defense Logistics Agency (DLA) Land and Maritime to Semiconductor Logistics Corp, a small business contractor based in Santa Fe Springs, California. The contract is valued at $249,760.00 and involves the delivery of 280 units of NSN 5961013337298 TRANSISTOR, with a completion date of May 30, 2025. The contract was awarded on October 11, 2024, under a total small business set-aside. Semiconductor Logistics Corp is an independent...

The Department of Defense Washington Headquarters Service awarded a $340.2 million other transaction order contract to the National Security Technology Accelerator, doing business as Strategic & Spectrum Missions Advanced Resilient Trusted Systems, for Rapid Assured Microelectronics Prototypes, Commercial Ramp-C. Performance will take place in Santa Clara, California through December 2023. This award is likely associated with DOD's Commercial Solutions Opening program vehicle and aims to...

This is a firm fixed price purchase order contract awarded by the Shared Services Center, a civilian agency, to 3D Plus U.S.A., Inc. for the delivery of 8 MB EEPROM memory chips. The contract has a ceiling value of $14,670.00 and a completion date of June 21, 2025. The award was made on May 22, 2025 with no set-aside designation. 3D Plus U.S.A., Inc. has previously provided space camera systems, NAND flash memory, NOR flash memory, SDRAM memory, evaluation boards, and other electronic components...

The U.S. Defense Microelectronics Activity (DMEA) has awarded a $6,687,500.00 firm-fixed-price contract to Microchip Technology Inc. to address obsolescence issues for microelectronic components certified to the MIL-PRF-19500 standard. The contract, which runs through March 31, 2026, requires the vendor to design, fabricate, assemble, build, test, evaluate, verify, validate, and/or procure these critical microelectronics and operate the necessary facilities. This award was not set aside for...