updates to Oxford inductively coupled plasma etch and atomic layer deposition systems
Closed Pre-Solicitation Posted
This opportunity was awarded. See the award notice from .
- Solicitation number
- AMD-SS19-16
- Agency
- National Institute of Standards and Technology Department of Commerce
- Responses due
- Set-aside
- No set-aside
Opportunity facts
- NAICS code
- 334516 Analytical Laboratory Instrument Manufacturing
- PSC
- Not on record
- Place of performance
- 100 Bureau Drive Gaithersburg, Maryland 20899, United States
Notice details come from SAM.gov. Updated .
Notice text
The United States Department of Commerce (DOC), National Institute of Standards and Technology (NIST), Acquisition Management Division (AMD) intends to negotiate a firm fixed price purchase order, on a sole source basis, with Oxford Instruments America Inc, 300 Baker Ave, suite 150, Concord, MA 01742-2204, upgrades to the control systems of three (3) inductively coupled Plasma etch and atomic layer deposition systems. The statutory authority for this sole source acquisition is FAR 13.106-1(b) by the authority of FAR Part 13.5 Simplified Procedures for Certain Commercial Items.
The proposed acquisition is to obtain updates to the control systems on three of its existing Oxford inductively coupled plasma etch and atomic layer deposition systems. The current systems were manufactured in 2008. Recent improvements in the PLC and loading systems will extend the lifetime, improve performance for users, and resolve ongoing problems such as wafer positioning repeatability, data logging, log exporting, and limitations of operator and maintenance features. In addition, the existing systems will be functionally identical to the newly installed Oxford PlasmaPro system. An upgrade to the PLC and wafer loading systems will bring the operation and maintenance features up to date on a current software platform.
The Oxford Instruments Plasma Lab 100 and FlexAL platforms operate with a proprietary control and load lock system that is not available from any vendor other than the OEM. Critical parameters for successful etch processes such as gas flow, radio frequency power, chamber pressure, and the timing of switching each function on and off in relation to the other operate under a proprietary control scheme. No other control system can be substituted.
The North American Industry Classification System (NAICS) code for this acquisition is 334516 and the size standard is 1,000 employees.
No solicitation package will be issued. This notice of intent is not a request for competitive quotations; however, all responsible sources interested may identify their interest and capability to respond to this requirement. The Government will consider responses received by 12:00 p.m. Eastern on June 18, 2019. Inquiries will only be accepted via email to tracy.retterer@nist.gov and forest.crumpler@nist.gov . No telephone requests will be honored.
A determination by the Government not to compete the proposed acquisition based upon responses to this notice is solely within the discretion of the Government. Information received will normally be considered solely for the purpose of determining whether to conduct a competitive procurement in the future.
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Notice history
| Notice | Type | Posted |
|---|---|---|
| X20 PLC upgrades to two RIE and one ALD Oxford system | Award Notice | |
| updates to Oxford inductively coupled plasma etch and atomic layer deposition systems | Pre-Solicitation |
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