J065--Leica Biosystems BOND-MAX Processing Module John D Dingell VA Medical Center
Closed Special Notice Posted
- Solicitation number
- 36C25024Q0045
- Agency
- Veterans Integrated Service Network 10 Veterans Health Administration, Department of Veterans Affairs
- Responses due
- Set-aside
- No set-aside
Opportunity facts
- NAICS code
- 811210 Electronic and Precision Equipment Repair and Maintenance
Notice details come from SAM.gov. Updated .
About this opportunity
This Special Notice from the Department of Veterans Affairs announces the intent to negotiate a sole source contract with Leica Microsystems Inc. for preventive maintenance services for a BOND-MAX Processing Module owned by the agency. Only Leica Microsystems Inc. and its exclusive regional dealers networks are authorized to provide the factory-trained service engineers required to maintain this specialized equipment.
The notice seeks to award a firm fixed price contract to Leica Microsystems Inc. for a period of three years with three option years to extend. The preventive maintenance services include regular upkeep and repairs to ensure proper function of the agency's BOND-MAX Processing Module. Interested parties must demonstrate within their responses by October 30, 2023 clear evidence that competition would be advantageous to the government to be considered. Eligibility is limited to Leica Microsystems Inc. as the OEM or their exclusive regional representatives.
Notice text
Notice of Intent to Sole Source Requirement
The Department of Veterans Affairs, VA Healthcare System, Network 10 Contracting Office intends to negotiate a sole source contract for preventive maintenance service for BOND-MAX Processing Module Preventive Maintenance under Simplified Acquisition Procedures and the authority of FAR Part 6.302-1, Only One Responsible Source for the following services listed below. The associated NAICS code for this is 811210. The vendor will be Leica Microsystems Inc.
Description of services:
SERVICE: Service contract to provide preventive maintenance for Government owned BOND-MAX Processing Module equipment purchased from Leica Microsystems Inc. Only Leica and its Exclusive Regional Dealers networks are the only authorized source of factory trained service engineers.
A firm fixed price contract with three (3) option years is anticipated to be awarded. It is the Government's belief that only the proposed candidate possesses the required capabilities to successfully meet this requirement. It is the Government's intention to solicit and negotiate with only this source.
This notice of intent is not a request for competitive proposals. It is not a solicitation or request for offers.
Any response to this notice must show clear and convincing evidence that competition would be advantageous to the Government. Responses must be received NLT 1:00 PM EST on 10/30/2023. No telephonic inquiries will be accepted. All responses must be e-mailed to the contracting officer.
Attachments
| File | Type | Posted |
|---|---|---|
| 36C25024Q0045.docx | DOCX document |
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