A-10 Circuit Card Assemblies
Closed Solicitation Posted
This opportunity was awarded. See the award notice from .
- Solicitation number
- SPRHA423R0022
- Agency
- Aviation Defense Logistics Agency, Department of Defense
- Responses due
- Set-aside
- No set-aside
Opportunity facts
- NAICS code
- 334412 Bare Printed Circuit Board Manufacturing
Notice details come from SAM.gov. Updated .
Notice text
8 versions
Update #8 · Latest ·
Amd 0007: Update CLIN structure, clauses and provisions and extend closing to 12/21/23
Amd 0006: extends closing to 6/12/23
Amd 0005: extends closing to 5/12/23
Amd 0004: Update provisions, clauses and delivery schedules for all CLINs.
Amd 0003: extends closing to 4/14/23
Amd 0002: updates inspection, acceptance and QA requirements for CLINs.
Amd 0001: extends closing to 3/10/23
This acquisition is only open to approved source(s): Southwest Research Institute (CAGE 26401).
Parties intereseted in becoming qualified, please see Manufacturing Qualification Requirements document under Attachments.
Technical Data Package (TDP) is available under Attachments, Links.
Update #7 ·
Amd 0006: extends closing to 6/12/23
Amd 0005: extends closing to 5/12/23
Amd 0004: Update provisions, clauses and delivery schedules for all CLINs.
Amd 0003: extends closing to 4/14/23
Amd 0002: updates inspection, acceptance and QA requirements for CLINs.
Amd 0001: extends closing to 3/10/23
This acquisition is only open to approved source(s): Southwest Research Institute (CAGE 26401).
Parties intereseted in becoming qualified, please see Manufacturing Qualification Requirements document under Attachments.
Technical Data Package (TDP) is available under Attachments, Links.
Update #6 ·
Amd 0005: extends closing to 5/12/23
Amd 0004: Update provisions, clauses and delivery schedules for all CLINs.
Amd 0003: extends closing to 4/14/23
Amd 0002: updates inspection, acceptance and QA requirements for CLINs.
Amd 0001: extends closing to 3/10/23
This acquisition is only open to approved source(s): Southwest Research Institute (CAGE 26401).
Parties intereseted in becoming qualified, please see Manufacturing Qualification Requirements document under Attachments.
Technical Data Package (TDP) is available under Attachments, Links.
Update #5 ·
Amd 0004: Update provisions, clauses and delivery schedules for all CLINs.
Amd 0003: extends closing to 4/14/23
Amd 0002: updates inspection, acceptance and QA requirements for CLINs.
Amd 0001: extends closing to 3/10/23
This acquisition is only open to approved source(s): Southwest Research Institute (CAGE 26401).
Parties intereseted in becoming qualified, please see Manufacturing Qualification Requirements document under Attachments.
Technical Data Package (TDP) is available under Attachments, Links.
Update #4 ·
Amd 0003: extends closing to 4/14/23
Amd 0002: updates inspection, acceptance and QA requirements for CLINs.
Amd 0001: extends closing to 3/10/23
This acquisition is only open to approved source(s): Southwest Research Institute (CAGE 26401).
Parties intereseted in becoming qualified, please see Manufacturing Qualification Requirements document under Attachments.
Technical Data Package (TDP) is available under Attachments, Links.
Update #3 ·
Amd 0002: updates inspection, acceptance and QA requirements for CLINs.
Amd 0001: extends closing to 3/10/23
This acquisition is only open to approved source(s): Southwest Research Institute (CAGE 26401).
Parties intereseted in becoming qualified, please see Manufacturing Qualification Requirements document under Attachments.
Technical Data Package (TDP) is available under Attachments, Links.
Update #2 ·
Amd 0001: extends closing to 3/10/23
This acquisition is only open to approved source(s): Southwest Research Institute (CAGE 26401).
Parties intereseted in becoming qualified, please see Manufacturing Qualification Requirements document under Attachments.
Technical Data Package (TDP) is available under Attachments, Links.
Update #1 ·
This acquisition is only open to approved source(s): Southwest Research Institute (CAGE 26401).
Parties intereseted in becoming qualified, please see Manufacturing Qualification Requirements document under Attachments.
Technical Data Package (TDP) is available under Attachments, Links.
Attachments
| File | Type | Posted |
|---|---|---|
| SPRHA423R0022_______0007.pdf | ||
| SPRHA423R0022_______0006.pdf | ||
| SPRHA423R0022_______0005.pdf | ||
| SPRHA423R0022_______0004.pdf | ||
| SPRHA423R0022_______0003.pdf | ||
| SPRHA423R0022_______0002.pdf | ||
| SPRHA423R0022_______0001.pdf | ||
| CPP.pdf | ||
| SPRHA423R0022.pdf | ||
| EDR_All.pdf | ||
| Pkg_SOW.pdf | ||
| MQR.pdf | ||
| EDL_All.pdf |
Show all 13
Notice history
| Notice | Type | Posted |
|---|---|---|
| A-10 Circuit Card Assemblies | Limited / Sole Source Justification | |
| A-10 Circuit Card Assemblies | Award Notice | |
| A-10 Circuit Card Assemblies | Solicitation | |
| A-10 Circuit Card Assemblies | Pre-Solicitation |
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