Requirements Document (Molecular Beam).docx

DOCX document 44 KB Posted

Attached to
Molecular Beam Federal contract opportunity
Solicitation number
W911QX-22-Q-0129
Issued by
Department of the Army Materiel Command Army Contracting Command Aberdeen Proving Ground

About this file

This requirements document outlines the need for a Molecular Beam Deposition (MBD) / Molecular Beam Epitaxy (MBE) system. The U.S. Army Research Laboratory requires one MBD/MBE system to be delivered including an MBE chamber, pumping system, manipulator, in-situ control equipment, multi-pocket electron beam evaporator, MBE sources and cells, LN2 cooling system, installation and training. The system must integrate with a Scienta Omicron 2RDC research chamber and accommodate 4-inch silicon wafer substrates up to 1000 degrees Celsius. Delivery must be made in accordance with the specified requirements, with inspection and acceptance occurring within seven days of delivery.

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Text version

Requirements Document 13 July 2022

C.1 Objective

The U.S. Army Research Laboratory (ARL) has a requirement for the supplies outlined in Section C.2. The Contractor shall provide all supplies as outlined in Section C.2.

C.2 Requirements

C.2.1 The Contractor shall provide all supplies outlined below:

One (1) Molecular Beam Deposition (MBD) / Molecular Beam Epitaxy (MBE) system that shall include the following key features:

· Up to four (4) inch (100 mm [millimeters]) max substrate capability and ability to accommodate smaller samples on a holder.

· Main substrate material shall be silicon.

· Standard substrate temperatures used in semiconductor MBE and e-beam evaporation growth.

· Shall connect to a Scienta Omicron 2RDC (system of two-conjoined radial distribution chambers) research chamber and be compatible with the 2RDC and other process and analysis equipment attached to the 2RDC. For example, for coordinated processing and wafer transfer through the 2RDC among equipment components.

· Footprint subject to design requirement, nominally 2300±200 mm in the loading direction and 1600±200mm transverse to the loading direction.

The MBD/MBE system shall furthermore include these (bold) components and their (bulleted) features:

MBE Chamber

· Vertical cylindrical deposition chamber with about 500-600 mm internal diameter and top flange for high quality thin film growth.

· Essential ports for:

· Titanium sublimation pump (TSP), turbo and one other pump (e.g.: Ion-pump etc.).

· Standard source flanges: for effusion cells and other sources.

· Port for linear substrate shutter.

· Port for liquid nitrogen (LN2).

· Cooling plate for substrate cooling.

· Additional ports/flanges for Quartz micro balance, reflection high energy electron diffraction (RHEED), quadrupole mass analyzer (QMA), beam flux monitor. Bayard-Alpert (BA-Ionization gauge), view ports, and other typical applications.

· View ports equipped with shutters to avoid coverage of the windows. The UHV (ultra-high vacuum) system shall be fully bakeable.

· Top-flange with integrated LN2 (liquid nitrogen) cooling shroud and flange for substrate manipulator.

· System frame, water cooling panel, bakeout cover, fan heaters, Blind flanges, view ports, screws and gaskets etc. The bakeout system shall allow chamber bakeout up to 180°C.

· Manual gate valve between MBE chamber and buffer chamber.

· Adapter flange tube to connect the MBE chamber to the existing central handling chamber of the Omicron UHV (ultra-high vacuum) system.

· Transfer-fork to allow wafer transfer.

Pumping System

· Turbo molecular pump including controller, cables, etc.

· Oil-free Scroll Pump - Edwards, or similar, ultimate pressure 0.05 mbar (millibar).

· Ion getter pump (IGP) and controller for IGP, including bake-able cables.

· TSP titanium sublimation pump (TSP) with 3 Titanium filaments, nominal pumping speed >1000 l/s (liters per second).

· LN2 cooled shroud with vacuum insulated adapters VB A-5 type, for TSP pump.

· Controller for TSP, including bake-able cables.

Manipulator

· Substrate manipulator for four (4) inch wafer with tungsten heater mounting flange.

· Tantalum wafer holder for substrate transfer:

· Water cooled ceramic bearings and magnetically coupled feedthrough for continuous rotation (0-30 RPM [revolutions per minute]).

· Thermocouple type C.

· Max Si (silicon) wafer temp. of 1000°C.

· Provision to deal with direct sample heating.

· Programmable Manipulator Control Unit:

· DC-Power Supply control range 0-5 Volts, manual current limit LED (light emitting diode) display for voltage and current.

· PID (proportional, integration, and differentiation functions) Controller channel with individual temperature display.

· X/Y (longitudinal/transverse relative to system loading) travel +/- 8 mm.

· Z-travel (height range) 50 mm.

· Azimuthal rotation +/- 180 degrees.

In-situ control equipment

· RHEED system, electron source, 15 kV power supply with beam blanking and remote control for focusing and positioning of the electron beam. Screen on lead glass with viewport and view port shutter shall be included.

· RHEED data acquisition and oscillation evaluation software including camera shielding and cables.

· Quartz microbalance with cables and controller.

· Beam Flux Monitor .

· Quadrupole mass analyzer 1-200 amu (atomic mass units) high sensitivity, Pfeiffer Vacuum or similar.

· Heated viewport with manual shutter. This viewport may be used for pyrometer

· UHV Bayard-Alpert (BA-Ionization [hot-filament style] gauge) ion gauge with tungsten filament (UHV BA-W), twin filament ion gauge for pressure measurement, high sensitivity with minimum pressure (p) reading less than 3x10-11 mbar (millibar), including controller.

· Cold-cathode pressure gauge atm to minimum pressure of 10-3 mbar (millibar) for pre-vacuum line.

Multi pocket electron beam evaporator

· Fully UHV compatible construction bakeable.

· Hearth liners.

· E-beam evaporation source: tungsten and titanium.

Sources, cells, and cracker

· MBE sources for indium, aluminum, gold, bismuth, tungsten, and titanium.

· View port with shutter for view into e-beam crucible.

· Effusion cells: indium, aluminum, gold, and bismuth.

· Valved Thermal Cracker Source for Sb (antimony):

· DC (direct current) power supply for reservoir, valve, and injector.

· PID controller channel.

· Cables for power and thermocouple.

· Motorized valve control unit.

In-situ Flux Control for e-beam evaporator

· Crossbeam QM (quadrupole mass) analyzer 1-200 amu (atomic mass units) including cables and control.

· Water cooled shielding shroud of the crossbeam QMA (quadrupole mass analyzer).

· Direct feedback control channel with PID regulation for the e-beam evaporator implementation effort.

MBE Control System

· MBE growth process software including hardware interface control of:

· Substrate manipulator (temp. rotation, shutter).

· Effusion cells (temperature, shutter).

· 2 valved sources cracker sources.

· Ion Gauges- pyrometer input - flux measurement (for beam flux monitor)- interfaces and hardware as needed.

· Required cables. PC (computer) for MBE process control software.

· Shutter control unit with cables.

LN2 cooling system

· Cooling system needed because instrument will not be connected to phase separator.

· Vacuum insulated LN2 tube (fore line) for MBE system.

· Vacuum insulated LN2 tube (output), 3m length KF25 or A5 connector type on MBE side, open tube on the other (LN2 coolant source) side.

· LN2 flow Regulating valves .

· Filling level regulation control unit.

· SPS compatible interface. With KF 25 type flange connector.

· LN2 can: with 200 - 2 bar pressure compatibility, with trolley container for liquid nitrogen (transportation only with open flange), maximum overpressure: 2 bar indicator of filling status, including automated pressure built-up regulation 0.2 to 2 bar for continuous LN2 flow adjustment.

Other

· Shipping, packing, and shipping insurance.

· Installation, warranty, and acceptance testing

· Onsite training.

· Universal Power Supply (UPX).

· All needed connections to Scienta Omicron 2RDC research chamber.

Template Last updated 09/10/2019

C.3 Packaging and Logistics

C.3.1 The Contractor shall deliver all supplies in accordance with the delivery requirements defined.

C.3.2 The Government will inspect the supplies and will accept or reject the items no later than seven (7) days after delivery.

C.3.3 Preservation, Packing, and Packaging shall be of a standard commercial type providing for damage-free shipment to destination.

C.3.4 The Contractor shall enclose a generated packing list which contains the contract number and part number of each item, provided within each package.

C.4 OPSEC Paragraphs

C.4.1 For contractors that do not require CAC but require access to a DoD facility or installation. Contractor and all associated sub-contractors employees shall comply with adjudication standards and procedures using the National Crime Information Center Interstate Identification Index (NCIC-III) and Terrorist Screening Database (TSDB) (Army Directive 2014-05/AR 190-13), applicable installation, facility and area commander installation/facility access and local security policies and procedures (provided by government representative), or, at OCONUS locations, in accordance with status of forces agreements and other theater regulations.

C.5 Distribution Statement

DISTRIBUTION STATEMENT A.

Approved for public release. Distribution is unlimited.

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