DetailedSpecification.pdf

Xactix® e2 Xenon Difluoride (XeF2) Release Etch System –

Technical Specification

1. The US Army AMRDEC Protection Technology Laboratory has a requirement for one

(1) Xactix® e2 Xenon Difluoride (XeF2) Release Etch System. The required Xactix system includes the following:

Part # Description

a) XETCH-E2-SYS-

SOFT1

Single wafer Xactix Xactix® e2 System for XeF2 MEMS etch release (base configuration) for up to 6 inch wafers.

Configured with advanced recipe package. Installation

NOT included.

b) E-INSTALL System installation support by SPTS and/or local representative (2 days on site) – Includes functionality overview, maintenance procedures.

c) SCOPE Microscope option

d) IMAGING Imaging upgrade

e) E-LID-MET Thin metal lid with viewport

f) 300654 Tip seal for pump

This equipment is to be used in the execution of the laboratory’s mission relative to failure analysis in electronics and electronic devices and design and implementation of micro-electro-mechanical (MEMS) systems.

2. The following performance characteristics are required:

a. The system shall provide pulsed delivery of xenon difluoride gas, using a single expansion chamber, to a reaction chamber capable of holding a wide variety of samples up to a 6” wafer.

b. Physical Characteristics

i. Chamber shall be optimized to hold parts up to 6” wafers.

ii. Dry vacuum pump proven to hold up to XeF2 shall be included.

c. Control: The system shall be computer controlled with a graphical user interface and shall provide following capabilities.

i. Recipe storage. Process parameters logged for each etch.

ii. Set Cycle Time, Number of Cycles, XeF2 Pressure from software user interface.

iii. Mix XeF2 with Nitrogen. Set pressure for nitrogen from software user interface.

iv. Define pause time between cycles from software user interface.

v. Set pump down pressure for chamber and expansion chambers when etching with XeF2 from software user interface.

vi. Plots process chamber pressure on GUI and records pressures in log file.

vii. Interactive GUI for recipe definition, storage and editing.

viii. Interactive GUI for configuring system operating variables.

ix. Automated pressure gauge recalibration.

x. Leak-back test utility for expansion chamber and process chamber.

xi. Automated system characterization to minimize over shoot and undershoot of XeF2 pressure in expansion chamber.

xii. During etch process chamber pressure shall be sampled at regular intervals, plotted in the GUI and stored for later review.

d. Inspection:

i. The system shall provide the ability to view entire surface of sample (up to 6” wafer) while it is being etched through a transparent process chamber lid and shower head.

ii. Binocular microscope and stand for viewing samples in the chamber while etching.

iii. Digital camera integrated with and controlled by the control software to periodically capture images

1. Image capture and analysis software to run on separate computer to avoid conflict with process control.

2. Ability to take a picture at a set interval of time.

3. Ability to define the time in each pulse in which to take a picture

e. Safety: The system shall provide following features:

i. Multi-user software interface with password protected access for each user.

ii. Password protected access to maintenance software.

iii. Built in, retractable fume hood with hardware interlock which automatically prevents venting process chamber to atmosphere when fume hood is retracted

iv. Hardware interlock automatically shuts off all valves with loss of vacuum.

v. Hardware interlock automatically closes XeF2 source when process chamber is near atmosphere.

vi. Hardware interlocks automatically shut off all valves with loss of extraction on gas box or fume hood.

vii. Exhausted gas box.

viii. Built in leak check after changing XeF2 source bottles.

ix. Automated nitrogen purge of connections to XeF2 source bottles before and after changing XeF2 source bottles.

x. Software guided XeF2 source bottle change procedure.

xi. Software controlled process chamber load/unload nitrogen purge.

f. System shall also provide below features:

i. CD drive allows writing CDs for transferring etching log data and picture from camera option.

g. Warranty

i. One year parts and labor.