Technical Support SoW_V1.pdf

Background

The search for bio‐signatures in the atmosphere of planets in the habitable zone around M‐ stars will be a high‐priority science goal of future space missions. The mid‐infrared (mid‐IR) band between 6 and 15 microns is probably the best available band for this science, because the band contains spectral lines of methane, ozone, and nitrous oxide. The coexistence of those chemical species in a planet's atmosphere would be a very strong indicator for life on that planet. Mid‐IR transit spectrometers on future space missions such as Origins Space Telescope

(OST) will be the instruments of choice to detect these bio‐signatures in exoplanets around M‐ dwarfs.

Current mid‐IR detectors based on impurity band conduction (IBC) devices (such as Si:As detectors) do not have the required stability to be well suited for the study of exoplanets. The proposed development of an Ultra‐Stable Mid‐Infrared Detector Array for Space‐Based

Exoplanet Transit (MIRASET) Spectroscopy will use Transition Edge Sensor (TES) detectors that are known to be intrinsically very stable and have the required detector parameters (sensitivity, dynamic range) for space based mid‐IR transit spectroscopy that can be easily met with existing devices. No new detector developments are re‐quired. The MIRASET project’s goals are to develop a spectrometer with the required sensitivity for the detection of atmospheric bio‐ signatures in habitable‐zone planets around M‐dwarfs and also includes the development of a high‐accuracy calibration system.

Requirements

The Contractor shall provide systems engineering and assembly integration and test (AI&T) support to the MIRASET project in support of science instrumentation life‐cycle engineering activities to include trade studies, analysis, design, integration and testing of the detector assembly unit.

The Contracrtor will report directly to the Principal Investigator (PI) while performing the following duties.

Develop detector assembly integration procedures. The contractor shall develop assembly procedures for the detector assembly based on existing engineering documentation and specifications. The procedures shall address handing, integration and testing activities.

Ultra‐sensitive electrostatic sensitive devices (ESD) management. The Contractor shall manage ultra‐sensitive Electrostatic Sensitive Devices (ESD) within a class 1000 clean room environment. All contractor personnel shall have clean room certificates of compliance training. Required experience also must include a history of following all guidance and regulations.

Package Integration: The Contractor shall place and install major test package components in correct orientation and location per design drawings and assist in the performance of full functionality testing of the package, using existing GSFC facilities and equipment when directed.

a. The Contractor shall use GSFC die attach machine to place and integrate SQUID read out read out and amplifier chips onto printed circuit boards per GSFC provided drawings.

b. The Contractor shall perform wire bonding activities using specified wire (i.e.

0.00125” diameter, 99.9% Al, 0.01% silicone) to integrate read out electronics to detector arrays and any devices needed for testing and calibration when directed.

c. In the eventuality that a new detector assembly package is created or a new read out is identified, the Contractor shall design, fabricate and assemble new cabling or harnesses as directed. The Contractor shall be familiar with different

AWG wire as well as its composition (i.e. manganin wire, NbTi Copper Clad wire, bare copper wire, etc.)

Package testing: The Contractor shall test the detector package under high vacuum conditions and at ultra‐low cryogenic temperatures using GSFC provided facilities and detector read out electronics when directed. The Contractor shall analyze the acquired data as required.

Deliverables

• Detector assembly integration procedures.