STATEMENT OF WORK.pdf

STATEMENT OF WORK

1. Objective/Requirements

Code 553, Detector Systems Branch has a need for packaging support in the form of wire-bonding, wafer dicing, flip-chip bonding, assembly and other related packaging activities. The Detector Development Lab (DDL) supports many projects across GSFC and most of them need back-end packaging support. In addition, the Packaging Group supports work external to the DDL adding to the workload. The packaging group also supports multiple flight projects which needs to have backup personnel capable of performing flight specific processes. The Packaging Group does not currently have back-up support for wire bonding or wafer dicing. To keep up with demand, Code 553 needs to increase the workforce with a packaging engineer familiar with packaging processes listed above.

2. Characteristics, Scope, and Specs

The contractor shall perform the following duties:

Provide senior level engineering labor, to be agreed upon by the government.

Provide entry level engineering labor, to be agreed upon by the government.

Maintain the required training to work in labs associated with the Packaging

Group.

Submit written reports of work performed on a weekly basis.

Train and become proficient in wire-bonding with Code 553 equipment. Provide wire-bonding support for projects as needed and directed by the Packaging Group Lead.

Train and become proficient in wafer dicing with Code 553 equipment. Provide wafer dicing support for projects as needed and directed by the Packaging Group Lead.

Train and become proficient in flip-chip bonding (or other die attach) with Code 553 equipment. Provide wire-bonding support for projects as needed and directed by the Packaging Group Lead.

Train and become proficient working alongside Code 553 personnel in support of flight projects and RnD projects in the areas of documentation, following work instructions and other lab protocols.

Provide support for projects as needed and directed by the Packaging Group Lead in areas of assembly, cleaning and inspection or other packaging related activities.

Provide support for projects as needed and directed by the Packaging Group Lead in areas of computer aided design (CAD).

3. Place of Performance GSFC, Building11 S007, S014, S026. Building30 009H and 200.

4. Period of Performance Work shall be performed from December 1st, 2022 through December 31st, 2023.