Statement of Work.docx

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Attached to
Infrared Microscope Federal contract opportunity
Solicitation number
1333ND25QNB680169
Issued by
Department of Commerce National Institute of Standards and Technology

About this file

This Statement of Work details the National Institute of Standards and Technology's (NIST) requirement for an advanced infrared microscope for the Physical Measurement Laboratory. The microscope must image defects at buried interfaces on silicon wafers and chips, operating in both infrared and visible light spectrums with specific technical capabilities, including automated image recording, stitching, and focal height adjustments. Key requirements include objectives operating in IR and visible light (5x, 10x, 20x, 50x), two cameras (one cooled IR camera and one color camera), motorized XY stage with 100mm range, and Windows 11 computer control.

The solicitation (Number: 1333ND25QNB680169) seeks a new, commercial-off-the-shelf system with no experimental or prototype components. Delivery is required within 10 weeks after receipt of order (ARO) to NIST's Gaithersburg, MD location. Payment terms are net 30 days, with 100% payment upon installation and acceptance. The government will conduct performance tests and evaluations to verify system specifications, with stronger consideration given to systems offering higher IR imaging resolution, sensitivity, image contrast, and advanced software analysis capabilities.

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1333ND25QNB680142 RFQ.docx DOCX document

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Statement of Work Infrared Microscope

I. BACKGROUND OF PROPOSED ACQUISITION:

The Physical Measurement Laboratory at NIST develops advanced microfabricated sensors for a broad range of applications. As part of this work, a microscope is needed to image defects at buried interfaces on silicon wafers and chips. The microscope shall image infrared light (IR) at wavelengths for which silicon is transparent, operating in reflection and transmission. The microscope shall also operate in the visible and be capable of automatically recording multiple images of adjacent areas of a wafer and stitching them into one image. The system shall also be capable of automatically taking multiple images as different focal heights.

The system will include the microscope, objectives operating in the IR and visible, one color camera operating in the visible and a second camera for the IR, a motorized XY stage and motorized focus, one or more illumination sources for the visible and IR, the ability to easily switch between IR and visible imaging, software to operate the system, as well as all cables and accessories required to operate the system.

II. Minimum Requirements The Contractor shall provide a system that meets all technical specifications identified below. All items must be new. Used or remanufactured equipment will not be considered for award. Experimental, prototype, or custom items will not be considered. The use of “gray market” components that are not authorized for sale in the U.S. by the Contractor is not acceptable. All line items shall be shipped in the original manufacturer’s packaging and include all original documentation and software, when applicable.

Line Item 0001:

Description: Infrared Microscope Quantity: One (1) Requirements:

1. Imaging infrared light (brightfield) in transmission and reflection from silicon wafers

2. Imaging visible light (brightfield) in transmission and reflection

3. Imaging visible light in darkfield at specific magnifications

4. Image recording in the IR and color image recording in the visible

5. Polarization control for imaging

6. Illumination in the IR and visible

7. Removable filter for blocking IR during visible imaging

8. The ability to switch between IR imaging and visible imaging quickly and without installing different components other than filters in easily accessed holders.

9. Motorized stage, focus and nosepiece

10. Physical control (e.g. knob or joystick) for manual adjustment of motorized motion

11. Integrated software that

a. Controls imaging

b. Controls automated motion of x, y and focus.

c. Stitches multiple images together

d. Combines images taken at different focal heights to give images with larger depth of focus

12. Computer to control system

Minimum technical specifications for the microscope

1. Objectives that operate in the IR: 5x, 10x, 20x, 50x, and include correction for a layer of silicon up to 1.2 mm thick above the interface being imaged. Correction is only required at 20x and above.

2. Objectives that operate in the visible: 5x, 10x, 20x, 50x. May be the same as the above.

3. One objective that operates in the visible in brightfield and darkfield at 20x.

4. Slider and/or illumination sources for darkfield operation in the visible

5. Two cameras to allow imaging in the IR and visible.

6. One cooled IR camera with Greater than 50% quantum efficiency between 1000 nm and 1600 nm wavelength, frame rate at least 60 fps, number of pixels at least 0.3 mega pixel, 14 bit

7. One color camera with at least 2.9 megapixels and a frame rate greater than 15 fps at full resolution

8. Motorized nosepiece to accommodate all objectives

9. Motorized XY sample stage with at least 100 mm of range, positioning repeatability ≤ 0.2 µm, and accuracy of ± 1µm or better.

10. Motorized focus adjustment

11. Controller for motorized axes

12. Physical controls (e.g. knob or joystick) for manual adjustment of motorized motion

13. Sample holder for 100 mm wafers and smaller chips in transmission and reflection

14. Windows 11 computer to control system

15. Breath shield

Stronger consideration will be given to a system that offers

1. Higher imaging resolution in the IR for structures buried beneath 0.5 mm silicon

2. Higher sensitivity and image contrast in the IR for structures buried beneath 0.5 mm silicon

3. Greater image analysis capability and accuracy in software (e.g. image metrology, or ability to combine images from different methods)

4. Software that controls nosepiece in addition to x, y, and focus.

III. Delivery:

Delivery shall be FOB Destination (or equivalent terms, such as INCOTERMS Delivered Duties Paid) are required and shall occur not later than (NLT) 10 weeks ARO

FOB Destination means: The contractor shall pack and mark the shipment in conformance with carrier requirements, deliver the shipment in good order and condition to the point of delivery specified in the purchase order, be responsible for any loss of and/or damage to the goods occurring before receipt and acceptance of the shipment by the consignee at the delivery point specified in the purchase order; and pay all charges to the specified point of delivery. The contractor shall deliver all Line Items to:

The National Institute of Standards and Technology 100 Bureau Drive, Building 220 Gaithersburg, MD 20899-1640

Acceptance/Inspection: In addition to the inspection and acceptance terms articulated in 52.212-4, the Government reserves the right to perform such performance tests and evaluations as defined below to verify specified system performance. Such tests and evaluations, if performed, shall be conducted within the environment that the system is to be operated. The Contractor has the right to be present during the tests and evaluations, if performed, at the Contractor’s expense.

Warranty: N/A

Payment Terms: The Contractor shall be paid, in accordance with Net 30-day payment terms, upon receipt and acceptance of a proper invoice, in accordance with the following schedule:

1. 100% after installation and acceptance by the TPOC of fully installed system. The Government anticipates inspection will occur upon:

a. After the testing procedures set forth in this document have been completed

File details come from the government source that posted it. Updated .