SOW.pdf
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- Attached to
- EMCCD camera system Federal contract opportunity
- Solicitation number
- 1333ND25QNB030278
About this file
This Statement of Work (SOW) details NIST's requirement for procuring a specialized optical emission spectroscopy (OES) system for semiconductor research. The system comprises three key components: an electron multiplication charge coupled device (EMCCD) camera, an imaging spectrograph, and control/data analysis software. The system must have ultra-low noise characteristics, high quantum efficiency (particularly in the 200-400 nm spectral range), and capability for high-precision time stamping to synchronize detector data with other instrumentation.
The solicitation requires delivery of one of each system component to NIST's Gaithersburg, MD location within 12 weeks after receipt of order (ARO). Specific technical requirements include a back-illuminated EMCCD sensor with UV enhancement coating, pixel format of at least 1024x1024, quantum efficiency specifications across multiple wavelengths, and software that supports automated data acquisition and metadata tracking. The system will be used for the CHIPS RF Waveform and Rapid Frequency Comb Diagnostics for Plasma Etching Project to improve semiconductor manufacturing process efficiencies through advanced optical diagnostics.
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| CSS 1333ND25QNB030278.pdf | ||
| Self_Attestation_Common_Form_FINAL_508c (1).pdf |
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STATEMENT OF WORK
Title: Detector and spectrograph for optical emission spectroscopy
Lab: MML/646
I. BACKGROUND INFORMATION
The semiconductor supply chain is global, specialized, and interconnected. Chipmakers do business with thousands of individual suppliers that provide the highly complex materials and tools used to produce semiconductors. To address the lack of full visibility into the semiconductors markets supply chain and R&D ecosystem gaps NIST will conduct the measurement science, or metrology, critical to the development of new materials, packaging, and production methods in chip manufacturing.ௗ
The CHIPS RF Waveform and Rapid Frequency Comb Diagnostics for Plasma Etching Project (5.04) was undertaken to identify methods to improve efficiencies of plasma etching processes. One aspect of this project involves development and application of in situ optical diagnostics capable of characterizing plasma chemistry, including dilute species. One optical technique that meets the needs of this project is optical emission spectroscopy (OES). To perform OES measurements, Group 646.05 needs to procure a detector, a spectrograph, and control/data analysis software. Since dilute species will emit weak signals in (low pressure) plasma etch processes, the detector must have ultra-low noise characteristics as well as a high gain and the spectrograph must be designed with high light collection efficiency while being capable of achieving good spectral resolution. In addition, since many species of interest emit radiation in the ultraviolet to visible spectral range, the detector and spectrograph need to be sensitive in the 200 nm to 700 nm spectral range, while maximizing detector quantum efficiency in the 200 nm to 400 nm range. Also, since the area between the electrodes in the chamber will need to be imaged to characterize spatial uniformity in the plasma, the detector needs to be a camera with an approximately square sensor area and the spectrograph needs to be designed for imaging with a large focal plane area and low optical aberrations. Additionally, high-precision (1 microsecond) hardware time stamping is needed to synchronize detector data with other instrumentation and measurements.
Finally, a single software interface for the camera and the spectrographs is required to fully control and automate spectral data acquisition with the output data files containing complete experimental metadata for traceability and reproducibility. To meet the requirements of these measurements, an electron multiplication charge coupled device (EMCCD) camera, a moderate-focal length, imaging spectrograph, and a control/data analysis software package are needed.
II. PURPOSE
To purchase a EMCCD camera system, an imaging spectrograph, and a control/data analysis software package suitable for high sensitivity OES measurements in the 200 nm to 700 nm spectral range for the MML/646 lab. The Contractor shall deliver a quantity of one (1) of each, inclusive of FOB Destination delivery.
III. MINIMUM REQUIREMENTS
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The Contractor shall provide a system that meets all technical specifications identified below. All items must be new. Used or remanufactured equipment will not be considered for award. Experimental, prototype, or custom items will not be considered.
The use of “gray market” components are not acceptable. All line items shall be shipped in the original manufacturer’s packaging and include all original documentation and software, when applicable.
Line Item 0001: Camera Description: The camera incorporates an electron multiplication charge coupled device (EMCCD) sensor chip and electronics used to control the camera and to digitize the sensor signal Quantity: One (1)
A. Technical Specifications, camera
a. Sensor type: Back-illuminated, electron multiplication CCD
b. Sensor coating: UV enhancement coating
c. Chip size: greater than or equal to 13.3 mm by greater than or equal to
13.3 mm
d. Pixel Format: greater than or equal to 1024 pixels by greater than or equal to 1024 pixels
e. Pixel Dimensions: less than or equal to 16 microns by less than or equal to 16 microns (square)
f. Quantum Efficiency at 200 nm (at 300 K): greater than or equal to 35 %
g. Quantum Efficiency at 300 nm (at 300 K): greater than or equal to 35 %
h. Quantum Efficiency at 400 nm (at 300 K): greater than or equal to 70 %
i. Quantum Efficiency at 500 nm (at 300 K): greater than or equal to 80 %
j. Quantum Efficiency at 600 nm (at 300 K): greater than or equal to 80 %
k. Quantum Efficiency at 700 nm (at 300 K): greater than or equal to 80 %
l. Digitization: greater than or equal to 16 bits
m. Selectable between CCD or electron multiplication CCD mode of operation
n. Electron multiplication gain: 1 to greater than or equal to 1000x
o. Sensor readout noise in EMCCD mode at 5 MHz (without electron multiplication): less than or equal to 30 electrons (root mean square)
p. Sensor readout noise in EMCCD mode at 30 MHz (without electron multiplication): less than or equal to 130 electrons (root mean square)
q. Sensor readout noise in CCD mode at 100 kHz: less than or equal to 5 electrons (root mean square)
r. Sensor readout noise in CCD mode at 1 MHz: less than or equal to 5 electrons (root mean square)
s. Spectra readout rate, full vertical bin: greater than or equal to 1000 frames per second (1 millisecond time resolution)
t. Spectra readout rate, full chip (1 × 1 binning): greater than or equal to 25 frames per second
u. Dark current at −55 degrees C: less than or equal to 0.04 electrons/pixel/second
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v. Thermo-electric cooling with minimum sensor temperature of less than or equal to −65 degrees C (in 20 degrees C air)
w. Hardware time stamping on each frame with a precision of 1 microsecond or better
x. Window type: Single wedged window
y. Window seal: Permanent vacuum with all metal seals and window brazed to vacuum chamber (no epoxies to be used)
z. Built in shutter
aa. Data transfer interface: High-speed interface such as USB 3.0 or Gigabit ethernet
Line Item 0002: Spectrograph Description: The spectrograph is designed for imaging and incorporates a multiple-grating turret with all grating positions filled a mounting port for securing the EMCCD camera to the spectrograph Quantity: One (1)
A. Technical Specifications
a. Astigmatism-corrected imaging optical system
b. Czerny-Turner or Schmidt-Czerny-Turner configuration
c. Operating Range of internal optics (gratings excluded): 185 nm or shorter wavelength to 1000 nm or longer wavelength
d. Aperture Ratio: f/4.6 or faster
e. Magnification: approximately 1.00
f. Focal Length: 0.3 m or longer
g. One (1) entrance port with computer-controlled, motorized slits
h. Entrance slits are adjustable from no larger than 10 microns to at least 12 mm
i. One (1) array detector exit port
j. Focal Plane Dimensions: at least 20 mm wide by at least 20 mm high
k. Motorized grating turret with computer-controlled digital wavelength scanning mechanism (no sine bar)
l. Grating turret rotates about the grating turret axis
m. Mechanical Scan Range: 0 to at least 1400 nm
n. Nominal Drive Step Size: no larger than 0.002 nm/step
o. Accuracy: ± 0.2 nm or better
p. Repeatability: ± 0.015 nm or better
q. One (1) interchangeable grating turret holding at least three (3) gratings with all gratings mounted and aligned
r. One (1) grating with a groove density of 150 groove/mm and a 300 nm blaze
s. One (1) grating with a groove density of 300 groove/mm and a 300 nm blaze
t. One (1) grating with a groove density of 600 groove/mm and a 300 nm blaze
u. Resolution: 0.1 nm or better (at 546 nm, 10 micron wide slits, 20 micron wide CCD pixels, 600 gr/mm grating)
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v. Internal entrance slit shutter
w. Mounting flange for EMCCD camera configured such that the camera focal plane and spectrograph focal plane can be made to overlap
x. Computer interface: USB
Line Item 0003: Software Requirements Description: The vendor-supplied software is loaded onto a NIST-supplied computer and used to control the camera and spectrograph on which the camera head is mounted Quantity: One (1)
A. Technical Specifications
a. Out-of-the-box spectroscopic and imaging data acquisition and analysis software compatible with 64-bit Windows 10
b. Software selectable CCD or EMCCD mode of operation
c. Software selectable amplifier gain/sensitivity
d. Software selectable sensor readout rates
e. Software selectable sensor temperature
f. Software selectable internal and external triggering capabilities
g. Software selectable electron multiplication gain from 1 to 1000x
h. Software can control the camera and spectrograph in a fully-integrated package (plug-and-play)
i. Software can automate repetitive data acquisition to collect an arbitrary number of frames, an arbitrary number of times, each acquisition batch initiated by an external trigger
j. Software can perform automated naming and timestamping of repetitive data acquisition sequences
k. Software can save and load the complete set of experimental conditions used for a given measurement, including all camera parameters and all spectrograph parameters
l. Software can save data files containing complete metadata associated with a given acquisition, including camera parameters, spectrograph parameters, per-frame acquisition timing information, and post-processing history
m. Software can record hardware timestamps for each frame to a resolution of 1 microsecond
n. Software can perform automatic wavelength calibration by controlling the grating position and constructing wide-coverage calibration profiles
o. Software can produce wide spectral range data by controlling the grating position and stitching the resulting spectra
IV. SCHEDULE OF DELIVERABLES
Deliverable
Number Description Quantity Due Date
Place of Delivery 1 EMCCD camera system 1 No later than
12 weeks ARO NIST (Gaithersburg)
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2 Spectrograph 1 No later than
NIST (Gaithersburg)
3 Camera control and data collection software
1 No later than
NIST (Gaithersburg)
PLACE OF PERFORMANCE
a. All work shall be completed at the Contractor’s facility.
b. Equipment will be delivered to 100 Bureau Dr. Building 221, Gaithersburg, MD
20899.
PERIOD OF PERFORMANCE
12 weeks ARO.
V. DELIVERY TERMS
Delivery shall be F.O.B Destination (or equivalent incoterms, such as DDP) and shall occur in accordance with the delivery due dates provided in the below table.
FOB Destination means: The contractor shall pack and mark the shipment in conformance with carrier requirements, deliver the shipment in good order and condition to the point of delivery specified in the purchase order, be responsible for any loss of and/or damage to the goods occurring before receipt and acceptance of the shipment by the consignee at the delivery point specified in the purchase order; and pay all charges to the specified point of delivery.
The contractor shall deliver all Line Items to:
National Institute of Standards and Technology Shipping and Receiving 100 Bureau Drive, Building 301 Gaithersburg, MD 20899 C/O/ POC/COR Dr. James E. Maslar, 221/A320
INSPECTION & ACCEPTANCE
In addition to the inspection and acceptance terms articulated in the specific FAR clause that allows the Government reserves the right to perform such performance tests and evaluations as defined below to verify specified system performance. Such tests and evaluations, if performed, shall be conducted within the environment that the system is to be operated. The Contractor has the right to be present during the tests and evaluations, if performed, at the Contractor’s expense.
Performance Tests:
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1. Performance tests involve confirming that the software controls the EMCCD and spectrograph and data transfer from the EMCCD to the control computer.
2. Performance tests involve acquiring time-resolved analyte spectra and background spectra in CCD and EMCCD modes.
NIST may choose at its discretion to forego this part of acceptance testing.
A visual inspection of the equipment will be performed by the NIST POC to identify surface defects or any form of indication that any equipment was damaged during transport to NIST. The Government shall have sole discretion to require repair or replacement of damaged and/or nonconforming supplies at no cost to the Government. The Government at any time prior to acceptance shall reject the equipment due to defects and/or nonconformance. The vendor is responsible for latent defects discovered any time after final inspection. However, the extent of its liability shall be prorated over the useful life of the equipment.
Ownership of the equipment shall transfer to NIST upon acceptance by the Government.
The Government will test, inspect, and accept or reject the equipment within ten (10) business days of the receipt of the equipment unless otherwise indicated above. The Government reserves the right to conduct quality assurance testing to confirm that a given instrument(s) meets the manufacturer’s and/or the Government’s performance specifications. It is anticipated that the equipment will meet all manufacturer’s specifications and/or the Government’s performance specifications identified in the most recent operations and maintenance manual for each piece of equipment and/or in this document.
VI. WARRANTY
The contractor shall warranty the entire system for a period of a minimum of twelve (12) months after receipt of the equipment and shall be in accordance with terms in FAR 52.212-4. The contractor shall warranty the window vacuum seal for a period of a minimum of five (5) years. Warranty shall commence upon acceptance of the system by the Government.
VII. PAYMENT SCHEDULE
The Contractor will be paid, in accordance with the payments clause in the contract and as otherwise noted in this document, upon receipt of a proper invoice.
1. 100% after installation and acceptance by the POC of fully installed system, AND
2. After the successful completion of the testing requirements set forth in this document under section set forth in this document, AND
3. After successful demonstration by the instrumentation that it performs in accordance with the requirements set forth in this document.
NOTE: Partial shipments and partial invoices will not be accepted, unless
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Proposed payment schedules shall be submitted with vendor’s response to the RFQ for consideration.
VIII. CYBERSECURITY PRIVACY REQUIREMENTS
NIST seeks a solution that provides security and privacy protection consistent with requirements defined by applicable federal laws, regulations, policies, and standards (e.g., the Federal Information Security Management Act (FISMA), OMB Circular A-130, and FIPS Publication 200). The solution provider (including subcontractors) may meet these requirements through various means, including but not limited to FedRAMP authorization, current third-party assessments (e.g., SSAE, PCI), and/or responses to NIST special publication control set SP 800-171. ௗ
Minimally Acceptable Controls
System security plan describing physical, technical, and administrative controls implemented to protect systems and sensitive personally identifiable information
(SPII).
IT management processes to establish and manage secure configuration baselines including routine patching for all operating systems and applications.
Access to SPII is restricted to those with a need to know. Personnel with access to SPII have background investigations performed (e.g. criminal, financial etc.), and are trained on secure handling of SPII.
Access Controls for SPII meet or exceed industry best practices for access and identification control including, but not limited to, connectivity to servers and databases, multi-factor authentication for remote accesses for administration, secure configurations for any devices accessing the system, and strong physical security for any place where the data is accessed.
The solution supports multifactor authentication for users and/or supports integration with customer federation services for Single-Sign capability.
Processes for scanning on a continual basis for vulnerabilities and proper configurations for all aspects of the system, as well as processes for timely mitigation of findings.
Auditing and Incident Response processes including customer notification of suspected or actual incidents and logging with sufficient information to perform forensics on any incident. Processes for notifying and providing appropriate mitigations, including but not limited to credit monitoring services, for subsidy applicants in the event of suspected or actual incidents.
SPII is encrypted in transit using TLS 1.2 or better and encrypted at rest in all places the SPII is stored. All encryption algorithms and modules are FIPS 140- 2/140-3 validated.
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If unable to meet any of the requirements listed above, the solution provider may provide details of mitigations or alternative protections in place to ensure the appropriate handling and protection of SPII.
If the solution provider provides services to other Federal agencies, provide a general description of the security risk management approach and client point of contact.
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