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SYSTEM SPECIFICATIONS AND FEATURES

Photonic Curing System: 150mm High Energy (39 J/cm²)

1. Self-contained integrated photonic curing system incorporating:

a. 1 – Lamp Assembly with 150mm flash lamp and automated sample cooling

b. 1 – PC-based Control System with 17.5” multi-touch screen and keyboard

i. >12 process control variables with multiple integrated performance simulators

ii. Integrated thin film stack creation tool and thermal stack simulator

iii. Automated logging and retrieval of machine history

iv. Exportable time-temperature pulse history

v. Exportable machine conditions can be viewed on cloud version of SIM for collaboration, or exported to production tools

c. 1 - Power Supply 500V 1.5KW

d. 2 - Lamp Driver – 500V

e. DI water conditioning and recirculating system with integrated heat exchanger for Lamp Cooling

f. Translation stage with automated synchronized linear motion and adjustable vertical positioning

g. Automated NIST traceable energy output calibration with statistical process measurement

2. Included lamps: One (1) 150mm broad spectrum Flash Lamp and Flow Tube (installed).

3. Installation and Training Services, IF PURCHASED

Engineer(s) will provide at the customer facility:

a. Installation Service, including inspection of installation facility prior to shipment

(required)

b. Safety Training

c. Tool Overview

d. Process Training

Photonic Curing System EXPANDED DETAIL

1. Description

The system is a state-of-the-art photonic curing laboratory research tool for processing high temperature materials on low-temperature substrates such as paper or polymers. Applications include drying and/or sintering. The tool can be tuned to do so without damage to underlying temperature-sensitive substrates.

The tools use patented processing based on proprietary flash lamps. The tool is a single integrated module for stand-alone laboratory use.

2. Technical Specifications Estimated

a. Max radiant energy delivered (J/cm2) 39

b. Peak radiant power delivered (kW/cm2) 4.5

c. Effective max linear processing speed (ft/min)* 100

d. Curing dimension per pulse (L x W in mm)** 75 x 150

e. Max area cured per sample (L x W in mm) ** 300 x 150

f. Pulse length range (microseconds) 25 – 100,000

g. Pulse length increment (microseconds) 1

h. Minimum pulse spacing (microseconds) 20

i. Max pulse rate * 8 Hz

j. Pulse Modes (3) 1) Single pulse

2) Uniform multi-pulse

3) Arbitrary multi-pulse

k. Output spectrum (nm) 200 -1500

l. Uniformity of exposure (point to point) *** +/- 3% or better

Notes:

* Dependent on pulse conditions ** Including edge affected area *** Excludes edge affected area All specifications provided are best current engineering estimates. Final values may be shifted somewhat based on engineering changes.

SIM Thermal Simulation Model o Simulation software was developed to aid in the determination of suitable process conditions for an arbitrary sample set of the user’s creation. The simulation can also be used as a design aid for the user, to determine the thermal profile in a user-specified material stack.

o SIM includes:

Built-in library of material thermophysical property values Ability to completely customize thermophysical values for user-specific material Ability to customize absorption coefficient Ability to benchmark results via the included bolometer and photo-diode

3. Advanced Design Features and Capabilities

In addition to the performance specifications, the system includes several unique capabilities that allow the user to attain optimized processing and performance of materials for a wide range of applications. The tools are designed around the following concepts:

Safety Features Exposure Parameter Settings and Control Monitoring Output and Capturing Data

a. Safety Features

Operator safety is the key consideration in the design of the system. Recognizing the likely range of materials to be used, and the expected range of user skills and backgrounds, the tools are designed and built with multiple redundant safety features.

Fully CE compliant (additional information regarding specific directives is available) Safety interlocks on strobe head with operator lockout Flash operations are stopped if sample drawer is opened Obscured light path for no stray emissions Status indicators on-screen Seals and gaskets o The tool is built with an enclosed area to contain and manage any sample processing by-products, as well as on-board filtration. Sample drawer and processing space is isolated from exterior and from lamps and rest of cabinet via seals and barriers to minimize leakage.

o Customers must consult with their environmental and safety experts to ensure adequate precautions are taken for the processing of materials and for handling any potential outgassed materials.

On-board HEPA-filtration of process exposed environment.

Output flow can be plumbed to the facility’s main fume ventilation/exhaust system via optional side port Air and inert gas supply feeds for process area or included process chamber

b. Exposure Parameter Settings and Control

With over 10 separate control parameters available, the system allows precise shaping of the thermal profiling in the materials and substrates to be processed. Special capabilities such as pulse-shaping allow even narrow process windows to be expanded and optimized for any given material combination.

Overall pulse setting control via the multi-touch screen interface o For maximum controllability and uniformity, the pulse intensity is user configured via the newest generation of our advanced multi-touch software interface. Intensity control, pulse shaping, pulse width, overlap, processing speed and pulse operation modes are easily adjusted on-screen.

Peak power delivery is the dominant factor in the ability to create the thermal gradients in the target materials. The ability to create thermal gradients is the basis of photonic curing.

On-screen pulse intensity voltages are adjustable in single-volt increments anywhere within the voltage range.

On-screen pulse length adjustment from 25s - 100,000s o The pulse length can be user-selected at any value within the indicated range

Pulse-shaping capability for custom micro-pulse structures o Because of the capability of delivering fully-developed independent pulses as short as 25 microseconds, combined with the very fast pulse delivery rate, the user can construct arbitrary pulse shapes composed of sub-pulses or micro pulses. This is advantageous for use in thicker depositions or in depositions with significant organic residual material which would result in damaged films with normal pulse delivery.

The exposure uniformity of this area is very high – better than 3% point-to-point within the uniform cured area. Uniformity of process energy is critical to achieve quality results.

Accessories are available from vendor which significantly reduce UV transmission (<350nm), for processing materials which are especially sensitive to UV.

Control and interface o The user inputs are entered using the included HMI. Over 10 independent exposure parameters can be adjusted by the user by utilizing the computer interface.

Adjustable convective boundary gas flow over samples.

o The photonic curing process is a thermal/heat/energy transfer process, wherein the primary mode of energy delivery to the materials is radiative. Yet, the conductive and convective forms of thermal energy transfer are also very significant in controlling the resulting thermal profile.

Vendor has determined that the ability to apply a convective cooling mode to the sample surface can be an effective means of removing excess thermal energy from the system after processing with a pulse sequence. This convective energy removal can in some cases prevent material damage.

o This gas flow helps maintain cleanliness of the strobe head window.

c. Monitoring Output and Capturing Data For R&D, it is not just the results that matter, but also understanding how those results were achieved. Accordingly, the system tool is specifically designed and built with integrated versatile data ports and integrated signal processing for included and optional instrumentation. Additionally, the user has the option of designing and implementing their own custom instrumentation to suit the needs of their projects.

Instrumentation connections include:

o Thermocouple ports x2 (Type J, Type K) o Vacuum Port o Inert Gas Port o USB Data Port o TTL Trigger Signal on BNC for triggering external data acquisition equipment o AC Power Outlet, C13, 110V/220V* @5A

* Outlet voltage is the same as the input power of the machine, so system powered by 110V will have 110V available from this outlet

Bolometer sensor for energy measurement as well as integrated DAQ card for on-screen display of data.

o Energy delivery is the key performance attribute of the System tool, and is the defining feature of creating the transient, non-equilibrium thermal gradients in the target materials that defines photonic curing.

o The bolometer accurately measures and provides a means to calibrate energy output from the flash lamps. Accurately and directly measuring the energy allows the results of testing on the tool to be quantitatively modelled (using SIM), allows the results from different tests on the same specific tool to be relatable between different System models up through large-scale global production implementations of System tools. The bolometer is standard with every system.

Real-time measurement of optical lamp output o The tool has a built-in lamp output detector for the lamp, which collects the lamp intensity profile for each pulse and displays the output on the user interface screen. To achieve the very fast response times needed to fully capture the flash events, special data acquisition cards were designed and developed by Vendor.

LED indicator to monitor sample stage motion and position.

d. Additional Features, Design Elements, and Capabilities Water-cooled lamp o Water-cooling is 10x more effective than air cooling and allows for enhanced lamp lifetime and higher peak power delivery.

Quick-access flash lamps, easily changed without the use of tools.

Built-in magnetic strap sample holder system with incorporated high-strength magnets Direct applicability from development to production o Because of the pulse control capabilities as well as other design features also found in the full-production tools, the exposure conditions developed in stand-alone use can be applied directly to production web use. Little or no redevelopment of pulse conditions is normally needed for reapplying the tool from development use to high-speed production use.

Ability to benchmark results via the included bolometer and photo-diode

4. CE Certification

The system is manufactured to the following standards:

EMC Directive (2004/108/EC), Emissions: EN 61000-6-4:2007, EN55011:2007+A2:2007, EN61000-3- 2:2006, EN61000-3-3:1995 +

A2:2005 & EN61000-3-11:200

Immunity: EN 61000-6-2: 2005, EN 61000-4-2:1995+A1:1999+A2:2001, EN61000-4-3:2006, EN61000-4-4:2004, EN61000-4-5:2005, EN61000-4- 6:2006, EN 61000-4-8:1993+A1:2001, EN61000-4-11:2004

Low Voltage Directive (2006/95/EC), EN 61010-1: 2001

Machinery Directive (2006/42/EC).

Annex 1 of 2006/42/EC, EN ISO 14121-1, EN 60204-1

Photonic Curing System SAFETY

Operator safety is the key consideration in the design.

Recognizing the likely range of materials to be used, and the expected range of user skills and backgrounds, the tools are designed and built with multiple redundant safety features.

CE Certification

Safety interlocks on access panels and sample drawer

Obscured light path for stray emission reduction

On-screen status indicators

Sample drawer and processing space are isolated from machine exterior, from lamps, and the rest of the cabinet to minimize exposure to sample process by-products

Enclosed strobe head reflector core provides reduction of NOx and O3

HEPA filter for exhausting process by-products

Output flow can be plumbed to the facility’s appropriate ventilation/exhaust system via optional adaptor port.

Air and inert gas supply feeds for process area or included process chamber.

Shrouded EMO button and emergency stop system

Consult with your EHS experts to ensure adequate precautions are taken for the processing of materials and for handling any potential process sample outgassed materials