Attachment_A_Technical_Compliance_Matrix.docx

(Attachment A) Technical Compliance Matrix for Loadlock, Throttle Valves and Software Upgrades

Offerors shall complete the table below. The first column describes the minimum requirements. In the second column, state whether the device exceeds, meets, or not meet the minimum requirements. In the third column, describe how it exceeds or meets the minimum requirements and explain where this capability is documented, such as in a brochure (with page number), on a specific webpage (with URL), or by a photograph, engineering drawing or any other data (provide).

Ratings: E-Exceeds Requirements M-Meets Requirements D-Does Not meet requirements

(E,M,D) How Your System Meets or Exceeds Minimum Requirements and How Documented

1. SYSTEM CONFIGURATION: S/N 49064

a. The loadlock system and throttle valve shall upgrade a Denton Vacuum Discovery-550 sputtering tool.

b. In order to accommodate the loadlock, a circular hole of diameter approximately 200 mm needs to be opened in the side of the sputtering chamber and a mating flange welded in place.

c. The loadlock shall be equipped with a motorized manipulator arm to transfer a wafer placed on a carrier plate into and out of the sputtering chamber.

d. The transfer sequences and sputter deposition process shall be completely automatic and consist of the following steps: pump down the loadlock to a suitable transfer pressure; open the gate valve; transfer the wafer carrier plate into the sputter chamber using a motorized manipulator; retract the loadlock manipulator; close the gate valve; pump down the sputter chamber to its base pressure; run the sputter deposition process; open the gate valve, transfer the carrier plate back into the loadlock; close the gate valve; and vent the loadlock to atmospheric pressure.

e. The loadlock and transfer mechanism shall be compatible with the existing sputtering tool features, including wafer heating to 400 ⁰C, carrier plate rotation, and wafer RF bias.

f. The throttle valve shall have an inside diameter of 6 inches

2. CONSTRUCTION: S/N 49064

a. The loadlock chamber shall be made of electro-polished 304L-series stainless steel.

b. The throttle valve shall be made of electro-polished 304-series or 316-series stainless steel

3. WAFER TRANSFER: S/N 49064

a. The loadlock shall be capable of accepting and transferring one wafer at a time, with wafer diameters of 75 mm, 100 mm, and 150 mm. Wafers shall be transferred by means of a carrier plate fitting the existing rotating platform in the sputter chamber.

4. PUMPING SYSTEM: S/N 49064

a. The loadlock chamber shall be capable of reaching a vacuum of 6.6 Pa (5 x10-2 Torr) in ≤ 5 minutes.

b. The loadlock may make use of the existing pumps on the sputter system

c. The loadlock shall be equipped with the following:

i. Software-controlled, electro-pneumatic high vacuum gate valve between the loadlock chamber and the sputter chamber;

ii. Software-controlled, electro-pneumatic roughing valve;

iii. Software-controlled, electro-pneumatic vent valve;

iv. Vacuum gauge on the loadlock chamber interfaced to the sputter tool system controller; and

v. A quick-access-type loadlock door with viewport (minimum diameter 50 mm).

d. The throttle valve shall be capable of regulating the chamber pressure from 0.013 Pa (0.1 mTorr) to 13 Pa (100 mTorr)

5. SOFTWARE: 49064

a. The loadlock software shall integrate seamlessly with the existing sputtering tool software and the programmable logic controller.

b. The software shall be capable of an automated, unattended process sequence as described in section 1.d above from wafer-in to wafer-out.

c. The software shall provide the following options:

i. Manual operation of loadlock and sputter tool;

ii. Automatic operation of loadlock and sputter tool: auto-pump, auto-vent and auto-deposition;

iii. Operation of the sputter tool without use of the loadlock; and

iv. Abort button to stop any process step.

d. The throttle valve controller shall integrate seamlessly with the existing sputtering tool software and the programmable logic controller.

6. SOFTWARE: S/N 43814

a. The software shall be capable of an automated, unattended process sequence as described in section 1.d above from wafer-in to wafer-out.

b. The software shall be substantially the same as installed in S/N 49064.

c. The software shall provide the following options:

i. Manual operation of loadlock and sputter tool;

ii. Automatic operation of loadlock and sputter tool: auto-pump, auto-vent and auto-deposition;

iii. Operation of the sputter tool without use of the loadlock;

iv. Abort button to stop any process step;

7. THROTTLE VALVE: S/N 43814

a. The throttle valve shall have an inside diameter of 8 inches.

b. The throttle valve shall be made of electro-polished 304-series or 316-series stainless steel.

c. The throttle valve shall be capable of regulating the chamber pressure from 0.013 Pa (0.1 mTorr) to 13 Pa (100 mTorr).

d. The throttle valve shall be integrated into the new control software.

8. TRAINING

a. The vendor shall provide on-site operation and maintenance training following installation.

9. DELIVERY AND INSTALLATION

a. The delivery and installation of the system in the CNST NanoFab clean room shall be completed in less than 3 months ARO.

10. WARRANTY

a. The system shall have a warranty of one year for parts and labor starting on the date of acceptance at the customer site. This warranty shall include phone support within 1 business day and on-site support within 2 business days.