SATPC0032525 Tab 04 4 SOW.pdf
PDF 166 KB Posted
- Attached to
- MultiPrep Precision 12" Polishing System Federal contract opportunity
- Solicitation number
- 80NSSC23844796Q
About this file
This document outlines the statement of work for a precision polishing system procurement. The National Aeronautics and Space Administration Shared Services Center is seeking a dual axis, micrometer-controlled polishing system capable of parallel polishing, angle polishing, and site-specific polishing of a variety of materials. Key requirements for the system include digital measurement indicators to quantify material removal in real time, rigid Z-indexing for predefined sample orientation, automatic sample oscillation and rotation, variable load and platen speed control, fixturing for mounted and unmounted samples, integrated fluid dispenser for automatic abrasive and lubricant application, and a minimum two year warranty. The equipment must be delivered within 4-6 weeks and installed at NASA Glenn Research Center in Cleveland, Ohio.
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Other files for this federal contract opportunity
| File | Type | Posted |
|---|---|---|
| SATPC0032525 Tab 07 Capability Statement SAM.gov.pdf |
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Text version
Statement of Work & Specifications
1. Objective/Requirements
Precision Polishing System – a programmable precision polishing system that allows for semiautomatic sample preparation on a variety of materials for microscopic evaluation on mounted or unmounted samples. Capable of performing parallel polishing, angle polishing, and site-specific polishing - or a combination of the preceding polishing methods.
2. Characteristics, Scope, and Specs
Polishing System Requirements:
- Dual axis, micrometer-controlled angular positioning of the sample (pitch and roll): +10° / -2.5° range (0.02° increments) relative to the abrasive plane
- Digital measurement indicators to quantify material removal from sample in real time, which can be set for unattended polishing operations (with minimum 1 μm resolution)
- Rigid Z-indexing for predefined geometric orientation throughout the grinding/polishing process
- Precision spindle design that indexes the sample perpendicular to the platen, and can rotate simultaneously
- Automatic sample oscillation, adjustable sweep with 6 speeds
- Automatic sample rotation with 8 speeds
- Variable load control to at least 600 g
- Variable platen speed: to at least 350 RPM / Variable Oscillation of sample: for optimized use of entire grinding/polishing disc area
- Polishing head capable of handling a wide assortment of sample holders and fixtures for holding/handling unmounted samples
- Fixturing for holding mounted and unmounted samples
- High-torque motor
- Both clockwise and counterclockwise platen rotation
- Timer for count-up or countdown operation
- Electronic coolant control with adjustable valve
- Retractable coolant nozzle for sample/bowl cleaning
- Integrated Fluid Dispenser (with at least dispensing options) for fully automatic application of abrasive polishing suspensions and lubricants o Peristaltic pump o Pump reverse after each cycle to prevent dripping/contamination
- Emergency shut-off switch
- Minimum two (2) year warranty
- On-site training
- Process development support
3. Place of Performance Equipment to be installed at NASA Glenn Research Center, 21000 Brookpark Rd, Cleveland, OH 44135
4. Period of Performance Delivery of equipment is expected within 4 – 6 weeks ARO.
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