SALIENT CHARACTERISTICS-BGA SMD Rework Station Model SV550.docx

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Attached to
Ball Grid Array Federal contract opportunity
Solicitation number
FA488722Q0062
Issued by
Department of the Air Force Air Education and Training Command

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Solicitation - FA488722Q0062.pdf PDF

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SALIENT CHARACTERISTICS

· Rework Station with Split-Vision alignment for removal, placement and soldering of Ball Grid Array (BGA) and Surface Mount Devices (SMD) circuit boards.

· Standard fits boards up to 24".

· Place components from 6mm to 50mm.

· 1200 watt component heater (Top Side)

· 800 watt component heater (Bottom Side)

· 6-zone 3600 Watt IR under heater

· Powerful cross flow fans cool the bottom heating area rapidly with stable speed.

· Color optical system with functions of split vision, zoom in/out and micro-adjust.

· Auto focus and software operation camera.

· Standard resolution vision system with LCD monitor.

· Fully self-contained with PLC control. No need for external air.

· Plug in and ready to use.

· System power: 220 VAC single phase 50/60 Hz

· One year parts warranty.

· Lifetime technical support.

· Includes freight

· Includes 1 day on-site set-up and operational training

· Accessories:

· 7 piece nozzle set (5 for upper heater; 2 for lower heater).

· 5 different size component pick up tubes

· Universal reball fixture with standard stencil set

· 2 jars of solder balls

· 1 jar of tacky flux 75 gram

File details come from the government source that posted it. Updated .