Copy_of_QandA_Final.pdf

QUESTION ANSWER

The +/- 2% and 1% uniformities are very stringent to the point where measurement techniques, process controls, and thickness come into play about reaching them. For this reason, I would like to define the rate of the deposition, the thickness or the deposition and how the end user plans on measuring the thickness of the film.

NASA GSFC will deposit 3000-5000 Angstroms of Au (on a Ti sticking layer 20 A) at a rate of

5A/sec, pattern with wetetch, and use a stylus profilometer to confirm the thicknesses.

Are they able to generate these uniformities as of now?

NASA GSFC has achieved the uniformity requirements in the past.

When they define magnetic impurities can we assume that the material they will be using is free of these impurities because this would be the primary route these impurities would be included.

NASA GSFC uses Au with 5N purity. The impurities in the material should be taken into account in any measurement of impurity levels.

When it states wafer temperature measurement, is this ok for one wafer to be measured or will this be needed for all 12 wafers? Temperature measurement is mentioned in the background for information purposes only.

What is the need for a wafer temperature measurement? Is there a worry for overheating, do they need to maintain a certain temperature?

We expect wafer temperature to remain below 100 C for the typical Au deposition.

However, the substrate can take 150 C before there are overheating issues.

For the 6 and 8 inch options are they looking for 12 wafers to be possible or just for single wafers?

The expectation is that the system will be designed for the 12 4” wafers and less 6 or 8” wafers will fit in the same space. We would expect more than one wafer of the larger size for such a chamber configuration.

Can we get an extension to go over these answers with our design team. Offers are due by no later than May 12, 2017 at 4:30 PM EST.

I need some clarification fot tender requirements. In the second page wrote: “Of particular importance is the elimination of all sources of potential magnetic contamination during the ion cleaning, through use of non-magnetic materials in the ion source housing and in the path between the ion source and the wafers. To enable cleaning of the system, two sets of non-magnetic removable shields shall be provided. These shields shall protect the chamber walls and door from deposition and etch and the shields shall be comprised of non-magnetic material (such as Al or Ti). For example, non-magnetic stainless steel is not acceptable because it can be eroded into ferromagnetic materials by the ion clean, creating iron and other contamination in the chamber.” Does it mean not only removable shields, but also ion source housing can’t be made be non-magnetic stainless steel?

The shields and ion mill housing need to be constructed of materials without magnetic elements in them. (So non-magnetic stainless will still erode Fe, which is magnetic).

Acceptable materials would be Al or Ti (where trace amounts of magnetic impurities are fine) Vendor should list choice of alloy selected for these specialty items (e.g., Al6061).

HIGH UNIFORMITY ELECTRON-BEAM DEPOSITION SYSTEM - SOLICITATION # NNG17620010Q