01814_SPECIFICATIONS.doc

SPECIFICATIONS

Automatic Wire Bonding Station Background

The National Institute of Standard and Technology’s (NIST) Quantum Electromagnetics Division requires equipment to enable NIST to more easily make electrical connections to micro-fabricated devices. NIST uses fine (25-50 micron) aluminum or gold wires that are attached to the devices with a specialized wire bonder. NIST currently operates manual wire bonders. NIST routinely makes hundreds to thousands of wire bonds per assembly. For these high wire bond count devices, manual wire bonder operator error and fatigue can significantly reduce yield. An automatic wire bonding station will greatly increase reliability of finished devices.

Technical Specifications

NIST requires an automatic wire bonding station appropriate for a research environment. The station must be capable of wedge bonding aluminum and gold wire 25-50 micrometer (1.0-2.0 mil) diameter. The station must be capable of 45-degree wedge bonding. It is strongly preferred that 90 degree (deep access) wedge bonding is also supported. The station must be capable of ball bonding gold wire 25-50 micrometer (1.0-2.0 mil) diameter. The station must be capable of ribbon bonding gold and aluminum ribbon 25x50 to 25x125 micrometer (1x2 to 1x5 mil). The motorized x-y travel must be greater than 90 mm by 90 mm ( 3.5 in by 3.5 in). It is strongly preferred that the x-y travel be at least 125 mm by 125 mm (5.0 in by 5.0 in). The motorized z travel must be greater than 10 mm (0.4 in). The motorized theta travel (rotation) must be in total 360 degrees. The station must be able to accommodate parts up to 50 mm (2.0 in) thick with motorized theta travel. The station must be able to accommodate parts up to 120 mm (4.7 in) thick with manual theta travel. The station must have a pattern recognition system for alignment. The station must have a controller that can store and recall bonding routines. It is strongly preferred that bond location information is stored in an editable or importable format. The controller must be able to store multiple chips in the bonding routines.

Delivery The automatic wire bonding station shall be delivered within 3 months ARO.