SOW.doc

Statement of Work

High Speed Anti-Radiation Missile (HARM) Built-In Test (BIT) Oscillator Procurement

1. SCOPE

This Statement of Work (SOW) defines the fabrication of the Built-in Test (BIT) oscillator (Part Number (P/N) 704AS9831), clarifies changes from the original specification, the associated functional testing and lot acceptance criteria and contract data requirements list (CDRLs). Manufacturing processes, military specifications and standards originally sited have been changed or canceled as well as deficiencies identified from field are addressed. The design has been through a full qualification process; however, the production line has been shutdown and BIT oscillators have not been produced for a sustained period of time. Manufacturing processes on a new production line can come into question; therefore, process controls have been incorporated to ensure the quality/reliability of the final product. To verify the quality/reliability a Production Reliability Acceptance Test (PRAT) program has been incorporated.

The original design build utilized tin (Sn) plating as a means of corrosion protection; however, this material and plating process is prone to formation of tin whiskers over time. Tin plating of the interior of the BIT oscillator housing shall not be allowed and an alternate method of corrosion protection must be utilized.

The original build utilized RMA flux followed by a vapor degrease process. QQ-S-571 soldering processes in accordance with(IAW) MIL-STD-2000 (J-STD-001). Process may be adjusted to comply with J-STD-001; however, the use of no-clean flux is prohibited and surface level cleanliness is critical due to the long term storage. Previous requirement does not call out for conformal coating. The use of Pb-free lead finishes generally contains Sn in the finish. Therefore, the formation of tin whiskers must be risk mitigated. All electronic board assemblies shall be conformal coated. Process shall be tailored to ensure the vertical surfaces of the leads are adequately coated to preclude shorting lead to lead or lead to trace on the circuit board assembly.

2. REFERENCE DOCUMENTS

A full technical data package was not available to the Navy. However, those drawings which are available are identified with a description of the information available.

3. REQUIREMENTS

The BIT Oscillator design has been incorporated into the existing HARM weapons system. All qualification processes have validated an effective working design. All performance, design, and test requirements are addressed in the BIT Oscillator Assembly Specification, Enclosure I. Package envelope is defined in drawing 704AS9831 and contained in Enclosure II. Specifications and standards utilized in the original specification have changed over time and have been replaced, canceled or are now for guidance only. Identification of these changes and alternatives that exist have been addressed in Enclosure I, BIT O Specification; AS5019.

4. QUALITY ASSURANCE PROVISIONS

Due to the sustained time that a production line has not produced a BIT Oscillator; Environmental Stress Screening (ESS), Acceptance Test Procedure (ATP) and a series of PRAT are being imposed to re-establish product reliability and to ensure final product quality. These requirements can be adjusted by the procuring activity once a trend can be established. Specific details of screening and acceptance testing are addressed in the BIT Oscillator specification, AS5019; in Enclosure I.

5. PREPARATION FOR DELIVERY

Packaging and marking of the end items are addressed in Section 5 of Enclosure I.

6. ACRONYMS