XPS_CIP_SOW.docx
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- Request for Information - XPS Microprobe Federal contract opportunity
- Solicitation number
- N00167-15-T-0051
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Minimum Specifications X-ray Photoelectron Spectroscopy (XPS) Scanning Microprobe for Materials Diagnostics The required capabilities are as follows:
Line Item 1. XPS Scanning Microprobe System
1. Monochromatic aluminum anode Kα X-ray source with the following characteristics:
0. A source defined raster scanned and micro focused monochromatic x-ray beam down to ten (10) micrometer (µm) spot size that allows for complete survey spectra for elemental identification and quantitative analysis, high energy resolution spectra in the scanned or snapshot detection mode for detailed chemical analysis, multi-element sputter depth profiles, line scans, and images.
0. Ability to move the x-ray beam up to 1 mm deflection for multi-point analysis without movement of the sample stage.
1. Optical imaging for defining and documenting analysis area.
1. Scanning X-ray beam induced secondary electron imaging for defining sample analysis area.
1. Ultra-high vacuum (UHV) chamber achieving pressures less than or equal to 5 x 10-10 Torr.
1. A combination of titanium sublimation pumps, turbo molecular pumps and oil-free dry pumps must be used to achieve the UHV chamber pressure of less than or equal to 5 x 10-10 Torr.
1. Sample transfer intro-chamber for sample out-gassing equipped with a pressure gauge. The intro chamber must achieve a pressure of less or equal to 5 x 10-8 Torr.
1. High transmission electrostatic energy analyzer input lens for providing energy resolution < 0.5 electron volt (eV) on the Ag 3d5/2 photoemission line.
1. Dual beam (low energy electrons combined with low energy argon ions) charge neutralization capabilities for accurate determination of binding energies. The energy of the argon ions must be below the threshold for sputtering.
1. Automatic sample alignment to analyzer and incoming x-ray probe
8. Ability to perform this automatically at each analysis point and/or each sample down to ten (10) micrometer (µm) spot size.
1. Automated and high precision multi-sample stage with the following characteristics:
9. 5 Axis motorized stage.
9. 0-90° sample tilt for angle resolved XPS.
9. Must accommodate and perform all XPS functions on varying sample types (films, powders, polymers, conducting and non-conducting material) with sample thicknesses up to ten (10) millimeter (mm).
9. Sample rotation (compucentric) for depth profiling to enable sampling at a fixed point on the sample.
9. Must have sample heating and cooling capabilities from -120 oC to +500 oC with the ability to have complete stage motion.
1. Monatomic Argon (Ar+) ion gun with neutral filter capable of producing ions from 200 to 5000 volts (V) for sputtering and depth profiling.
1. The C60 (carbon-based fullerene) cluster source with 20kV or greater acceleration potential for sputtering and depth profiling of organic and inorganic films simultaneously.
11. The carbon-based source cannot contain hydrocarbon species
11. The carbon-based source must be capable of sputtering alternating layers of inorganic and organic films by having sputtering rates that are as close as possible for organic and inorganic films.
11. The carbon-based source must have an interface resolution that is as close as possible to that of monoatomic Argon.
1. A sample transfer vessel, which allows the transfer of air sensitive samples from a remote location (such as an argon filled glove box) to the XPS system without exposure to ambient conditions.
1. System must have oil free rough pumps as back up for all turbo molecular pumps attached to the system.
Line Item 2. Software
1. Computer to operate XPS system
14. Quantity one (1) with an operating system of Windows 7 or better.
1. Data Analyses Software:
15. Must be compatible with Windows 7.
15. Must control sampling stage and X-ray source.
15. Equipped with software capabilities to perform the following qualitative and quantitative routines:
2. Peak identification and quantitative composition determination
2. Peak deconvolution (or peak fitting) with option for different types of fitting (e.g., Gaussian, Gaussian-Lorentz, etc.) and background subtraction including Shirley type.
2. Smoothing and differentiation
2. Multi-point sample analysis.
2. A minimum of 3 software licenses is required to allow installation on the system computer and two other computers.
Line Item 3. Instructional manual(s) which describe system design and operation for all components to be procured in Line Item 1 (see CDRL A001).
Line Item 4. Instructional manual(s) for the data acquisition and analysis software to be procured in Line Item 2 (see CDRL A002).
Line Item 5. Delivery and Installation
1. Delivery:
16. The Contractor shall deliver the XPS system to Room 350 on the third floor of Building 60, of the Naval Surface Warfare Center, Carderock Division, 9500 MacArthur Boulevard, West Bethesda, MD 20817.
1. Installation:
17. Within two (2) weeks from delivery of the XPS system, the Contractor will be notified by the Government Technical Point of Contact (TPOC) for scheduling of installation into Room 350, Building 60.
17. The Contractor shall demonstrate to the TPOC that the XPS system is fully functional after the system has been installed in Building 60, Room 350 and that it meets the specifications listed above.
Line Item 6. On-Site Training
1. The Contractor shall perform a minimum of (3) days (24 hours) of on-site training demonstrating that all system performance requirements are met including system pressures, resolution at the Ag 3d5/2 photoemission line, optical imaging capability, secondary imaging capability, mapping angle capability, angle resolved capability, depth profiling with monoatomic argon and C60 cluster capabilities, and temperature range of the cooling/heating stage. The Contractor shall ensure the training takes place within three (3) weeks of the installation.
Line Item 7. Trouble Shooting
1. For a minimum of 12 months of the Government’s ownership of the XPS system, the Contractor shall provide technical support to answer questions regarding operation, hardware troubleshooting, software operation via telephone or email during normal business hours. The contractor shall ensure technical support is provided within two (2) business days of original contact date.
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