PWS_19-9D8_Probe_Card_Adapter_11Feb2019_POapproved.pdf

PERFORMANCE WORK STATEMENT (PWS)

DMEA 19-9D8

11 February 2019 PE: Kevin Hartmann, DMEA/MEBA, (916) 999-2718 COR: Allen Wong, DMEA/MEBA, (916) 231-1642

1.0 SCOPE:

1.1 TITLE: Prober Card Adaptor

1.2 APPLICABILITY: The probe card adaptor (PCA) shall interface with the ElectroGlas 4090μ and Accretech UF2000 Automated wafer probers.

1.3 BACKGROUND: DMEA/MEBA has 2 ElectroGlas probers that use these probe card adaptor that was procured from Protos Electronic in 2004. These probe card adaptors are beginning to wear out with broken/missing pins and other mechanical parts missing and we cannot procure the spare parts for the repair as the previous supplier is no longer in business and parts obsoleted.

1.4 PURPOSE: Design and manufacture three (3) sets of probe card adaptors to replace current stock. Each set of probe card adaptors shall include one (1) interface board; one (1) adapter assembly unit; One (1) ring assembly unit.

2.0 REFERENCED GOVERNMENT PROVIDED RESOURCES: None

3.0 REQUIREMENTS:

3.1 GENERAL REQUIREMENTS:

3.1.1 RESERVED

3.2 PROGRAM MANAGEMENT: None

3.3 TASK REQUIREMENTS:

3.3.1 Interface Board: The contractor shall deliver three (3) interface boards with the following requirements

3.3.1.1 50 ohms +/- 10% characteristic impedance, line width shall be dependent on current draw of DUT indicated with a range of 80-100 mA line length matching – 150ps per inch – approximate value for delay on a PCB line length matching is not a hard requirement and shall be considered an objective.

3.3.1.2 Board material shall be made of FR4 or equivalent

3.3.1.3 Provide 256 signals and 256 shield pins on the interface board for use with RNC’s 6 inch 512 pin probe card part number CRE512-384-50 or equivalent. The 256 signals shall be using the odd numbered pins on the probe card.

The even numbered pins are the associated shields.

3.3.1.4 The interface board shall use 3M 34 pin connector part number 2534-6002UB or equivalent. Sixteen (16) connectors shall be used for a total of 256 channels (layout illustrated in figure 1). The row on the key side of the connector shall be signal, the other row shall be shield. The center pins, 17 and 18, are not connected as signal these pins shall be used for power, ground, and edge sensor. (Connector pins illustrated in figure 2)

3.3.1.5 Provide dedicated power, ground, sense lines, and edge sensor through the unused pins 17 and 18 on the interface board connectors. There are 5 power rings: A, B, C, D, E. There are 2 rings for an edge sensor: ES-A, ES- B and there is a GND plane. For power, ground, and edge sensor, connect both pins 17 and 18 of a connector to the given ring. For sense lines, connect one pin of a connector to the sense line. Table 1 identifies which connectors are assigned to a given ring.

3.3.1.6 The contractor shall provide all schematic, layout and Gerber files required to manufacture the interface board and shall provide build of material and pin list (A001)

Figure 1: Connector Layout

Figure 2: 3M Connector Layout

Table 1: Pin List Power Rings Connector Pin Power

Ring Connector Pin Power

Ring

1 17 E 9 17 GND

1 18 E-Sense 9 18 GND

2 17 E 10 17 GND

2 18 E 10 18 GND

3 17 ES-B 11 17 B

3 18 GND 11 18 B-Sense

4 17 ES-A 12 17 B

4 18 GND 12 18 B

5 17 D 13 17 A 5 18 D-Sense 13 18 A-Sense 6 17 D 14 17 A 6 18 D 14 18 A

7 17 C 15 17 GND

7 18 C-Sense 15 18 GND

8 17 C 16 17 GND

8 18 C 16 18 GND

3.3.2 Adapter Assembly Unit: The contractor shall deliver three (3) adapter assembly for the interface board with the following requirements

3.3.2.1 Mechanism to compress probe card against pogo tower. This mechanism shall include alignment pins that mate to the alignment holes on the 512 probe card. These alignment pins will align the probe card to the pogo tower.

The assembly shall interface the probe card with the probe card interface board. The assembly shall make connections with all 512 pins on the probe card with a continuity measurement to be less than 2 ohms. Bottom tray to hold probe card and tray is compressed against tower with screws. This hardware shall be positioned below the prober ring carrier. The hardware will not protrude from the adapter. In order to change probe cards the user will have to remove the adapter from the prober and invert the adapter.

3.3.2.2 The adapter assembly unit shall accommodate a probe card with a thickness of 0.125”.

3.3.2.3 The adapter assembly unit shall an opening to accommodate the probe card rings of 3.750”

3.3.2.4 The adapter assembly shall have a total stack height of 1.650” from the top of the ring to the bottom of the assembly

3.3.2.5 The contractor shall provide schematic, Mechanical Drawings and BOM (A001)

3.3.3 Ring Interface Unit: The contractor shall deliver three (3) ring interface units for the assembly unit with the following requirements

3.3.3.1 Anodized aluminum ring with theta slots to fit a standard 9.5” ElectroGlas RC-2 Ring carrier. The interface ring unit shall have dimensions that are illustrated in figure 3, the measurements are in inches.

Figure 3: Ring interface Unit dimensions

3.3.3.2 The contractor shall provide schematic, Mechanical Drawings and BOM (A001)

3.3.4 Delivery: The contractor shall delivery three (3) sets of new probe card adaptors under this PWS, including the each item specified in paragraph 3.3.1.6, 3.3.2.5, and 3.3.3.2. The deliveries shall be made to:

Name: Kevin Hartmann Address: 4234 54th Street McClellan, CA 95652-2100

3.4 PROGRAM Summary: None

4.0 POINTS OF CONTACT:

DMEA/ MEBA/ Project Engineer Name Kevin Hartmann Address: 4234 54th Street McClellan, CA 95652-2100 Voice: (916) 999-2718 E-Mail: kevin.hartmann@dmea.osd.mil

DMEA/ MEBA/ Contract Officer Representative Name Allen Wong Address: 4234 54th Street McClellan, CA 95652-2100 Voice: (916) 231-1642 E-Mail: allen.wong@dmea.osd.mil