09110-Salient_Characteristics_for_PATS-70A_Marvin_Test_COTS.docx

Salient Characteristics for PATS-70A Marvin Test Solutions, Inc. Brand Name or Equivalent Items The following brand name or equivalent items are to be procured for the PATS-70A production effort:

All vendor items in the table above, along with other vendor items, have been integrated together into a system which is environmentally qualified by testing to meet the MIL-PRF-28800F, Class 1 and Class 2. This system has also been Electro-Magnet Interference (EMI) qualified by testing to meet MIL-STD-461E. Any equivalent items submitted will need to be integrated into the system and have met these same criteria or standards of testing.

-70A Upgrade Kit Salient Characteristics The salient characteristics for software, hardware and construction of the -70A Upgrade Kit includes several subassemblies for the kit. The following is the salient characteristics of the subassemblies:

Subassembly Ethernet Routing Circuit Card Assembly Salient Characteristics The salient characteristics for software, hardware and construction of this subassembly are:

· Fabricate per IPC-6011/6012 (Latest Revision) Class 2

· Boards shall be free of chips cracks foreign matter, and defects which would impair the mechanical or electrical insulating and conducting properties.

· Solder all connections in accordance with (IAW) IPC-J-STD-001. Lead free solder is not acceptable.

· Workmanship and inspection to be performed IAW IPC/WHMA-A-620B.

· IAW IPC-HDBK-830 mask connectors J1, J2, J3, J4, J5 and J6 and apply conformal coating to both sides of Circuit Card Assembly (CCA).

Subassembly Ethernet Switch Circuit Card Assembly Salient Characteristics The salient characteristics for software, hardware and construction of this subassembly are:

· Software Specifications:

· Extensive software development and integration has been completed and developmentally and operationally tested. The qualifying vendor item must be able to load and run the following firmware because of the software Application Programming Interface (API) calls being initiated.

· Load Firmware Version MILTECK-919 (standalone) dev-build by yoram@Hulk_Virtual.Home 2015-07-07T17:24:29+03:00 Config:config_904_912_918_919.mk Dated 2015-07-07T17:21:29+03:00

· Minimum Qualifying Design:

· Cyber Security:

· Compliant with Infrastructure L3 Switch STIG (Security Technical Implementation Guide)

· Ethernet Ports:

· Managed 8 x switched 10/100/1000 ports

· Networking

· Spanning Tree (802.1d), RSTP (802.1w) and multiple Spanning Tree (802.1S) for fast recovery rings

· Security via Radius Authentication 802.1x, Port Security, Port Mirroring

· Multicasting (IGMP Snooping), GARP, GMRP, and GVRP Broadcasting and flooding Control up to 8K Groups.

· 802.1q Tagged based VLAN up to 4K VLAN groups.

· QoS Multi-Layer Classifier, 802.1p, ToS/DSCP traffic classification. WFQ, Strict Queuing.

· Bridge support for Q-in-Q.

· L3 static routing

· Link Aggregation 802.3AD.

· WEB, CLI, Telnet Management.

· I/O Connector:

· Samtec ERM8-050-09.0-L-DV-TR. Shall mate with Samtec ERF8-050-07.0-S-DV-K-TR

· Performance:

· 26.8 Mpps wire speed forwarding rate

· 20 Gbps maximum forwarding bandwidth

· 8K MAC address

· Standards Compliance:

· IEEE 802.1x MAC based Authentication

· IEEE 802.1Q Vlan Tagging

· IEEE 802.1P QoS

· IEEE 802.1S Multiple STP

· IEEE 802.1W Rapid STP

· IEEE 802.1AD Link Aggregation

· IEEE 802.1X

· Power:

· Voltage Input: 6-36VDC

· Power Consumption: 8W Max Power

· Electromagnetic:

· MIL-STD-461E Electromagnetic compatibility

· CE-102, CS-114, CS-115, CS-116, RE-102, RS-103 (when installed in an appropriate chassis)

· Environmental:

· MILSTD-810F/G/GM:

· Random vibration (514.5I)

· Bench Handling (516.6VI)

· High Temperature(501.5I,II)

· Low Temperature (502.5I)

· Humidity (507.5II)

· Air Pressure (500.5I,II)

· Blowing Rain (506.5I)

· Immersion (512.5I)

· Salt Atmosphere (509.5I)

· Blowing Dust (510.5I)

· Loose Cargo Vibration (514.6II)

· Wind Analysis (when installed in an appropriate chassis)

· Operating Temperature:

· -40 °C to +85 °C (-40°F to +185°F) Cold Start-Up

· Storage Temperature:

· -45°C to +85°C (-49°F to +185°F)

· Physical:

· Dimensions: 107mm (L) x 48(W) x 5(H), including connectors & hardware

· Weight: 52g

· Installation:

· 6 x mounting holes for board to board mounting

· Cooling:

· No moving parts. Passive cooling.

· Qualifying vendor items shall meet MIL-PRF-28800F Class II Performance Specifications Subassembly Display Signal Routing Assembly Salient Characteristics The salient characteristics for software, hardware and construction of this subassembly are:

· Fabricate per IPC-6011/6012 (Latest Revision) Class 2

· Boards shall be free of chips cracks foreign matter, and defects which would impair the mechanical or electrical insulating and conducting properties.

· Solder all connections in accordance with (IAW) IPC-J-STD-001. Lead free solder is not acceptable.

· Workmanship and inspection to be performed IAW IPC/WHMA-A-620B.

· IAW IPC-HDBK-830 mask connectors J1, J2, J3, J4, J5 and J6 and apply conformal coating to both sides of Circuit Card Assembly (CCA).

Case, Portable Automatic Test Set Salient Characteristics The salient characteristics for software, hardware and construction of the above item 20156670 are:

· Technical Specifications:

GENERAL REQUIREMENTS

PXI CHASSIS REQUIREMENTS

ADDITIONAL REQUIREMENTS

· Panel Connectors:

J7

Fire Wire

· Environmental Requirements:

· 5 to 85 ± 5 percent in the temperature range of 30 to 40 °C (86 to 104 °F)

· 5 to 60 ± 5 percent in the temperature range above 40 °C (104 °F)

· not controlled below 10 °C

· Aspergillus flavus (USDA-QM380)

· Aspergilus versicolor (USDA-QM 432)

· Penicillium funiculosum (USDA-QM474)

· Chaetomium globosum (USDA-QM 459)

Crush Resistance

1,000 pound load

High Current Relay Card Salient Characteristics The salient characteristics for software, hardware and construction of the High Current Relay Card are:

· Software Specifications:

· Extensive software development and integration has been completed and developmentally and operationally tested. The qualifying vendor item must be able to load and run the following firmware because of the software Application Programming Interface (API) calls being initiated.

· FPGA Firmware Version 0xA004

· Operational Specifications:

· Size: Single Slot 6U PXI

· Weight: 16 Oz.

· Connectors: 50-pin D-Sub type

· Relay Format: 45 SPDT Form C

· Relay Contact Resistance: 0.1 Ohms Initial

· Contact Life at Low Level: 10x10 Typ at 28 VDC @0.5A: 5x10 Typ

· Switchable Current: 7A(DC) / 7.5 A(AC)

· Contact Carry Current: 7A

· Operate Time: 10 mS (Max)

· Release Time: 10 mS (Max)

· Power Requirements:

· Operating Voltage: +5VDC

· Power Consumption:

· +3.3V: 100 mA

· +5V: 70 mA per channel; 3A (Max)

· Driver Output:

· Driver Channels: 9 Open Collector

· Current: 500 mA sink per driver

· Environmental:

· Operating Temperature: 0 °C to +70 °C

· Storage Temperature: -20 °C to +85 °C

· Vibration: 9G at 10-55 Hz

· Shock ½ Sine: 100G for 6 mS Digital Multi-Meter Card Salient Characteristics The salient characteristics for software, hardware and construction of the Digital Multi-Meter Card are:

· Software Specifications:

· Extensive software development and integration has been completed and developmentally and operationally tested. The qualifying vendor item must be able to load and run the following firmware because of the software Application Programming Interface (API) calls being initiated.

· Firmware Version B.b.1 with FPGA Firmware Version C.07

· Hardware:

· Inputs: Hi, Lo, Hi Sense, Lo Sense; Floating and isolated from ground; External Trigger

· Input Connectors: Four (4) banana, 7-pin DIN

· Format: PXI, 3U Single Slot, Hybrid Slot Compatible

· DMM and Digitizer Measurement System Features

· Resolution: 22 Bits (DMM), 16 Bits (Digitizer / DAQ)

· DMM Sampling Rate (VDC, IDC & R Measurements): Selectable PLC Rate, 0.01 to 10; PLC can be set to 50 or 60 Hz.

· DMM Reading Rate (VDC, IDC & 2WR (< 10 M)):

· 50 Readings/Sec @ 6.5 Digits, 60 Hz (1 PLC)

· 500 Readings/Sec @ 5.5 Digits, 60 Hz, (0.1 PLC)

· 2500 Readings/Sec @ 4.5 Digits, 60 Hz, (0.01 PLC)

· 3500 Readings/Sec @ 3.5 Digits, 60 Hz, (0.002 PLC)

· Digitizer (DAQ) Clock Rate:

· Programmable to 3 MHz

· Range: (3 MS/s)/N, N=1 to 2^16

· Accuracy: 100 PPM

· DAQ Measurement Functions: AC/DC Voltage and Current Measurements, Frequency

· Digitizer Memory: 8192 Samples

· DMM Memory: 1K Samples

· DMM Measurement Characteristics:

· Input Range: 100 nV to 300 V

· VAC Input Range: 3 uV to 425 V (Peak), 300 VRMS 10 Hz to 100 KHz AC Coupled

· VDC/VAC Input Impedance:

· > 10 G Ohm (0.1, 1, and 0 VDC Ranges)

· 400 pF Shunt Capacitance

· 10 MOhm for other AC/DC Ranges

· 400 pF Shunt Capacitance

· Maximum Input (Volt-Hertz):

· 8 x 10E7 V x Hz Common Mode Input

· 8 x 10E7 V x Hz (Across Hi or Lo Input relative to earth ground)

· Input Isolation: CATII 300V

· Input Overvoltage Protection: 250 V for current input, 300 V CATII for all other inputs

· Noise Rejection:

· VDC: 90 DB, NMRR; 140 DB CMRR 15 Reading/s, 1 PLC, 6.5 Digit, 10 V Range VAC: 70 DB, CMRR

· IDC Input Range: 10 nA to 2 A

· IAC Input Range 3 uA to 2 A RMS, AC Coupled, 10 Hz to 5KHz

· AC/DC Input Current protection: 2 A, 250 V, Fast Blow, Sand Filled, 1.5KA Breaking

· Resistance Range: 0.1 mOhm to 100 MOHM

· Resistance Measurement Configuration: Selectable, 2-wire or 4-wire

· Burden Voltage (Maximum):

· Current Range Voltage:

· 20mA < 0.2 V

· 100mA < 0.1 V

· 1 A < 0.5 V

· 2A < 1.0 V

· Triggering:

· Triggering Source:

· Function: Start Measurement

· Source: PXIBus, software, continuous, external input (DIN Connector), Timer

· Trigger Output Modes

· Functions Start of Measurement, End of Measurement

· Trigger can be routed to the PXIBus or the DIN Connector

· Trigger Input Voltage Range: 3.3V CMOS, 5 V Tolerant

· Minimum Trigger Input Pulse Width: 50nS for PXIBus, 250 uS for External DIN Input

· Trigger Input Impedance: 4.75K OHM

· Trigger Input Edge: Selectable, Positive or Negative

· AC Measurement Performance:

· Digits: Reading Rate Signal Bandwidth

· 6.5 0.25 S/s 1 Hz to 300 KHz

· 6.5 2.5 S/s 10 Hz to 300 KHz

· 6.5 25 S/s 100 Hz to 300 KHz

· 6.5 100 S/s 400 Hz to 300 KHz

· 5.5 1 K S/s 20 KHz to 300 KHz

· Power Requirements

· +12 VDC 25 mA (Max)

· -12 VDC 16 mA (Max)

· +3.3 VDC 255 mA (Max)

· +5 VDC 2.3 A (MAX)

· Environmental and Physical Specifications

· Safety: Complies with IEC 61010-1, CAT II 300 V, Pollution Degree 2

· EMC: Complies with EN61326-1

· Temperature Range:

· Operating: 0 °C to +50 °C

· Extended Operating Range: -20 °C to +70 °C

· Storage: -20 °C to +70 °C

· Relative Humidity:

· Operating: 80% at 40 °C

· Storage: 95% at 40 °C

· Connectors:

· Four (4) Banana Jacks:

· Hi: Voltage, 2 W Ohm

· Lo: Voltage, Current, 2 W Ohm

· Sense Hi: Current, 4 W Ohm

· Sense Lo: 4 W Ohm

· 7-pin DIN: Trigger In, Trigger Out, Trigger GND

· Qualifying vendor items shall meet MIL-PRF-28800F Class II Performance Specifications FPGA Card Salient Characteristics The salient characteristics for software, hardware and construction of the FPGA Card are:

· Software Specifications:

· Extensive software development and integration has been completed and developmentally and operationally tested. The qualifying vendor item must be able to load and run the following firmware because of the software Application Programming Interface (API) calls being initiated.

· First FPGA Firmware Version 0xB003

· Second FPGA Firmware Version 2015-03-26_PATS70A_DTL_Interface

· Minimum Qualifying Design Materials:

· Single Slot 3U PXI

· 80 I/O Signals, Direct is configurable by software

· TTL or LVTTL, 5 V Tolerant Inputs

· Overvoltage Input Protection Range: -0.5 to 6.5 V

· Ruggedized and conformal coated

· Qualifying Vendor Items shall meet MIL-PRF-28800F Class II Specifications

Programmable Low Power Resistive Module Salient Characteristics The salient characteristics for software, hardware and construction of the above item Programmable Low Power Resistive Module are:

· Software Specifications:

· Extensive software development and integration has been completed and developmentally and operationally tested. The qualifying vendor item must be able to load and run the following firmware because of the software Application Programming Interface (API) calls being initiated.

· FPGA Firmware Version 0xA003

· Minimum Qualifying Design Materials:

· Single Slot 3U PXI

· 4-Channel Programmable Resistors, 2 Ohm to 128 KOhm, 2 Ohm Resolution

· 0.5 A maximum current per channel

· 200 V maximum voltage per channel

· Operating Temperatures: 0 – 55 °C

· 20 to 95% non-condensing humidity

· 0.5 W maximum power per channel

· 25-pin male mating connector

· Ruggedized and conformal coated

· Qualifying Vendor Items shall meet MIL-PRF-28800F Class II Specifications Precision DC Source Salient Characteristics The salient characteristics for software, hardware and construction of the above item Precision DC Source are:

· Software Specifications:

· Extensive software development and integration has been completed and developmentally and operationally tested. The qualifying vendor item must be able to load and run the following firmware because of the software Application Programming Interface (API) calls being initiated.

· FPGA Firmware Version 0xA010

· Minimum Qualifying Design Materials:

· Single Slot 3U PXI

· Operating Temperature: 0 – 55 °C

· Eight high-density discrete outputs

· Three programmable voltage rails at 14-bit resolution

· 500 mA maximum total current output

· -10 to +32 VDC Output

· 50 Ohm minimum output load

· Ruggedized and conformal coated

· Qualifying Vendor Items shall meet MIL-PRF-28800F Class II Specifications