EDR_CUI.pdf

REV: ENGINEERING DATA REQUIREMENTS

(ATTACHMENT “A”)

NOTE: MILITARY SPECIFICATIONS / STANDARDS WILL NOT BE FURNISHED IN THE BID SET.

1. THE FOLLOWING INSTRUCTIONS ARE FURNISHED FOR THE MANUFACTURE OF:

CIRCUIT CARD ASSEMBLY (F-16)

2. PART NUMBER:

2215250-004

3. NATIONAL STOCK NUMBER:

5998013998597WF

PREPARED BY:

Kacey Abbott

OFFICE SYMBOL:

416 SCMS/GUEAA

DATE:

FEB. 28, 2023

HILL AFB FORM 462 Page 1 of 1

4. THE FOLLOWING SPECIFICATIONS/STANDARDS, ETC., WILL BE USED IN LIEU OF THE DATA INDICATED. THE SUPERSEDED

DATA WILL NOT BE FURNISHED UNLESS SO INDICATED.

5. THE SOURCE/MATERIAL IF LISTED ON THE STANDARDS, SPECIFICATION AND DRAWINGS ARE THE ONLY SOURCE/MATERIALS FOR THOSE ITEMS. SUBSTITUTIONS SHALL HAVE PRIOR APPROVAL BY THE COGNIZANT ENGINEERING ACTIVITY.

6. DEVIATIONS FROM SPECIFICATIONS IDENTIFIED IN CONTROL DRAWINGS ARE NOT AUTHORIZED WITHOUT PRIOR APPROVAL

BY ENGINEERING.

7. UNIQUE IDENTIFICATION (UID) SHALL BE APPLIED TO EACH PART PER MIL-STD-130 (IN LIEU OF FPS-3008). THE UID SHALL BE A MACHINE-READABLE INFORMATION (MRI) MARK. THE MRI SHALL BE ACCOMPANIED BY A HUMAN-READABLE INFORMATION (HRI) MARKING WHICH IS LIMITED TO 16 ALPHANUMERIC CHARACTERS INCLUDING THE VENDOR CAGE (FSCM) OF THE CONTRACTOR NAMED ON THE CONTRACT, DATE OF MANUFACTURE IN THE FORMAT MMYY, AND A UNIQUE 4-DIGIT NUMBER STARTING WITH 0001 IN NUMERICAL ORDER OF MANUFACTURE. THE HRI APPEAR AS “SN 9874701040001”. THE HEIGHT OF EACH ALPHANUMERIC CHARACTER IN THE HRI SHALL BE A MAXIMUM OF .125 INCHES. MARKINGS FOR BOTH THE MRI AND HRI SHALL BE TO SAE AS9132 WITH AN ALLOWABLE DEPTH OF .005 TO .030 INCHES. THE LOCATION OF THE UID SHALL BE ______________.

THE METHOD OF MARKING FOR BOTH THE MRI AND HRI SHALL BE _______________.

8. THIS IS AN AIRCRAFT PART. USE THE APPROPRIATE PORTION OF MIL-STD-2000 THAT APPLIES TO AIRCRAFT SOLDERING FOR ALL SOLDERING REQUIREMENTS. *NOTE: J-STD-001 MAY BE USED IN LIEU OF MIL-STD-2000, IF SPECIFICATION MEETS OR

EXCEEDS MIL-STD-2000.

8.1 EFFECTIVE 9 MAY 2005 THE DEPARTMENT OF THE AIR FORCE ISSUED AN AIR WORTHINESS ADVISORY (M-05-01) REGARDING THE USE OF LEAD-FREE SOLDER IN ELECTRICAL AND ELECTRONIC MILITARY PRODUCTS. TO DATE, NO LEAD-FREE SOLDER FORMULATION HAS MATCHED THE RELIABILITY AND PERFORMANCE QUALITIES OF THE STANDARD LEADED SOLDERS. THEREFORE, UNTIL SUCH TIME AS A SUITABLE, RELIABLE LEAD-FREE SOLDER REPLACEMENT IS IDENTIFIED, ALL ELECTRONIC EQUIPMENT SUPPLIERS SHALL CONTINUE TO PROVIDE THE DEPARTMENT OF THE AIR FORCE WITH ITEMS WHICH MEET ALL PERFORMANCE, COMPATIBILITY, AND RELIABILITY STANDARDS PREVIOUSLY ESTABLISHED WITH LEADED SOLDERS.

FAILURE TO DO SO, COULD ADVERSELY IMPACT THE PERFORMANCE AND RELIABILITY OF WEAPON SYSTEMS AFFECTING

NATIONAL SECURITY.

8.2 THE USE OF LEAD-FREE SOLDER OR LEAD-FREE PLATED COMPONENTS IN MILITARY ELECTRONIC PRODUCTS IS CONSIDERED A FLIGHT SAFETY AND NATIONAL SECURITY CONCERN. FOR THIS REASON THE US AIR FORCE WANTS TO BE NOTIFIED WHEN LEAD-FREE COMPONENTS AND MANUFACTURING PROCESSES HAVE BEEN IMPLEMENTED. AS PART OF SATISFACTORY COMPLIANCE WITH THE REQUIREMENTS OF THIS CONTRACT THE US AIR FORCE REQUIRES NOTIFICATION ON A

NO-COST BASIS WHEN ANY OF THE FOLLOWING CONDITIONS EXIST:

1. COMMERCIAL OFF-THE-SHELF (COTS) OR ANY OTHER ELECTRICAL COMPONENTS THAT CONTAIN LEAD-

FREE SOLDER OR LEAD-FREE PLATED COMPONENTS ARE USED IN THE END-ITEM.

2. ANY LEAD-FREE COMPONENT OR PART USED TO MANUFACTURE THE END ITEM THAT IS NOT IDENTIFIED

WITH A SEPARATE PART NUMBER OR DESIGNATION.

8.3 IF NO LEAD-FREE, LEAD-FREE PLATED COTS OR ANY OTHER LEAD-FREE ELECTRICAL OR ELECTRONICS COMPONENTS EXIST IN THE MANUFACTURED END-ITEM, THE CONTRACTOR SHALL PROVIDE WRITTEN CERTIFICATION OF COMPLIANCE AS A

DELIVERABLE WITH THE CONTRACT.

1. USE INDUSTRY STANDARD IPC-1066, "MARKING, SYMBOLS AND LABELS FOR IDENTIFICATION OF LEAD- FREE AND OTHER REPORTABLE MATERIALS IN LEAD-FREE ASSEMBLIES, COMPONENTS AND DEVICES,"

2. INCLUDE THE PROGRAM ENGINEER'S EVALUATION OF THE PURCHASING/REPAIR ITEM FOR ANY "LEAD- FREE" MILITARY PART(S) IN REFERENCE TO ITS' RELIABILITY, PERFORMANCE AND COMPATIBILITY FOR

THE SYSTEM.

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