DARPA-BAA-14-56_Modification_1.pdf
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- Attached to
- Atoms to Product (A2P) Federal contract opportunity
- Solicitation number
- DARPA-BAA-14-56
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Modification 1 to DARPA-BAA-14-56
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Other files for this federal contract opportunity
| File | Type | Posted |
|---|---|---|
| DARPA-BAA-14-56_Attachment_4_-_Grant_Cost_Element_Summary_Sheet.docx | DOCX document | |
| DARPA-BAA-14-56_Attachment_1_Executive_Summary_Slide_Template.pptx | PPTX presentation | |
| DARPA-BAA-14-56_Attachment_2_Cost_Volume_Checklist.docx | DOCX document | |
| DARPA-BAA-14-56_Attachment_3_-_Contract__Cost_Element_Summary_Sheet.docx | DOCX document | |
| DARPA-BAA-14-56.pdf |
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Modification 1 to DARPA-BAA-14-56, Atoms to Product (A2P)
The Atoms to Product (A2P) BAA (DARPA-BAA-14-56) is hereby modified to reflect the following changes. The text highlighted in yellow has been added to the BAA as described below. No other changes have been made to DARPA-BAA-14-56.
• Part II, Section I.C., “Program Structure, Schedule and Milestones,” third paragraph, second sentence is amended to add optical interfaces. The revised sentence shall be: “A significant program-level activity will be development of structural, mechanical, thermal, electrical, optical, and data interfaces for feedstock-to-substrate and feedstock-to-feedstock connections.”
• Part II, Section I.D.2., “Technical Area 2 – Micron to Millimeter Assembly,” fourth bullet is amended to add optical, data, or other appropriate interfaces. The revised bulleted sentence shall be: “A technology development plan to develop feedstock-to-substrate and feedstock-to-feedstock interface technology that will enable structural, mechanical, thermal, optical, data, electrical connections, or other appropriate interfaces.”
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