Code665-TechnicalSupportSoW_20210817232846.734_X.pdf

Background

Robust, high sensitivity kilopixel format arrays with large focal plane filling factors and low cosmic ray cross sections that operate over the entire far‐IR regime are required for future

NASA missions, such as the Far‐Infrared Surveyor (now called the Origins Space Telescope, OST).

Our kilopixel Backshort Under Grid (BUG) detectors are designed to meet all those requirements: By bump‐bonding two‐dimensional detector arrays to readout multiplexers, these arrays are tileable, and with the integration of the multiplexer scalable beyond wafer sizes; they provide high filling factors (>90% at 1mm pixel pitch), and are designed to have low

Cosmic ray cross sections. Individual BUG detectors have been demonstrated in the HAWC+ camera on SOFIA to provide background‐limited performance for suborbital far‐IR applications.

The major missing technology for future FIR Space Based missions are detector array architectures with n~105 individual pixels and integrated readout multiplexers. In this proposal we mainly address this need by maturation and streamlining of the processing required to produce arrays with large pixel numbers of npixel~104 that can be tiled to deliver the desired pixel counts of npixel ~105.

Requirements

The Contractor shall provide systems engineering and assembly integration and test (AI&T) support to the Large Kilopixel Arrays project in support of science instrumentation life‐cycle engineering activities to include trade studies, analysis, design, integration and testing of the detector assembly unit.

The Contractor will report directly to the Principal Investigator (PI) while performing the following duties.

Develop detector assembly integration procedures. The contractor shall develop assembly procedures for the detector assembly based on existing engineering documentation and specifications. The procedures shall address handing, integration and testing activities.

Ultra‐sensitive electrostatic sensitive devices (ESD) management. The Contractor shall manage ultra‐sensitive Electrostatic Sensitive Devices (ESD) within a class 1000 clean room environment. All contractor personnel shall have clean room certificates of compliance training. Required experience also must include a history of following all guidance and regulations.

Package Integration: The Contractor shall place and install major test package components in correct orientation and location per design drawings and assist in the performance of full functionality testing of the package, using existing GSFC facilities and equipment when directed.

a. The Contractor shall use GSFC die attach machine to place and integrate SQUID read out read out and amplifier chips onto printed circuit boards per GSFC provided drawings.

b. The Contractor shall perform wire bonding activities using specified wire (i.e.

0.00125” diameter, 99.9% Al, 0.01% silicone) to integrate read out electronics to detector arrays and any devices needed for testing and calibration when directed.

c. In the eventuality that a new detector assembly package is created or a new read out is identified, the Contractor shall design, fabricate and assemble new cabling or harnesses as directed. The Contractor shall be familiar with different

AWG wire as well as its composition (i.e. manganin wire, NbTi Copper Clad wire, bare copper wire, etc.)

Package testing: The Contractor shall test the detector package under high vacuum conditions and at ultra‐low cryogenic temperatures using GSFC provided facilities and detector read out electronics when directed. The Contractor shall analyze the acquired data as required.

Deliverables

• Detector assembly integration procedures.