Attachment 2 - LOMs.docx

Attachment 2 – List of Materials (LOM) This document will provide a list of all items requested under solicitation FA875122R0013 – THIN FILM DEPOSITION SYSTEM as well as their minimum specifications. ALL additional accessories must be compatible and interoperable with the main system that is quoted.

THIN FILM DEPOSITION SYSTEM comparative to Kurt J. Lesker Co. model: PRO Line PVD 75* with the following minimum specifications as broken down:

· Must have both an electron beam source and 2 x 3” magnetron sputtering sources in a single chamber

· The process chamber

· Must be at least 15.25” wide x 16.50” deep x 24” tall

· Must have a viewport with viewport shutter

· Modular design to allow for addition of future capabilities/equipment

· Zero length vacuum pumping nipple so that the high vacuum pump can be mounted directly to the chamber to promote rapid pump down times and low (below 10-7 Torr) chamber pressures

· The vacuum pumping

· Chamber base temperatures below 10-7 Torr must be achievable

· High throughput (1500 L/s or more) cryo pump with variable position gate valve

· Water cooled compressor

· Variable position gate valve

· Automatic regeneration capability through integrated PC control

· Cryo compressor located remotely from system frame at a distance of at least 20 ft

· Dry scroll roughing pump with at least 7.5 cubic feet per minute pump speed, located remotely from the system frame

· The substrate load lock

· Single substrate load lock capable of accommodating 150 mm substrates or larger

· Low profile design

· Dedicated load lock turbo pump; can share roughing pump with chamber roughing pump

· Pump speed at least 63 L/s

· Load lock base pressure of 5 x10-6 Torr or lower

· Manual or automatic motion control transfer arm

· The substrate fixture

· O2 compatible

· Heating up to at least 550 degrees C

· Load lock compatible

· Variable speed rotation up to 20 rpm

· PID control of temperature

· Pneumatically activated substrate shutter

· Accommodates substrate size 150 mm or larger

· Multi-site substrate holder

· 100 W RF power supply for substrate bias

· The magnetron sputter system must have

· 3” sources accommodating up to at least 0.375” thick targets

· Pneumatically actuated dome shutters on the sources to prevent cross-contamination

· Source to substrate distance of 4” to 6”, manually adjustable

· At least 1kW Pulsed DC power supply

· Switch to allow for powering of multiple sputter cathodes using single power supply

· <= +/-5% uniformity across 150 mm substrate

· The electron beam evaporation source and power supply must have

· 5 kW or larger power supply with programmable sweep and automatic crucible indexing

· 8 pocket (12 cc crucible) source (crucibles provided with the source)

· <= +/-5% uniformity across 150 mm substrate

· Pneumatically activated shutter

· No dynamic water-to-vacuum o-ring connections

· The system must have the following for upstream pressure control

· At least three mass flow controllers, PID upstream control electronics, capacitance manometer pressure transducer, and all cables feedthroughs for implementing upstream control; integrated with system software control platform

· The film thickness monitor must have the following

· Quartz crystal sensor and controller/monitor

· Independent shutter for the crystal sensor

· System control package must include

· Provides for automated process control (recipe)

· Graphical Recipe Builder generates a recipe via mouse or touchscreen selectable user interface components

· Recipe Database Screen provides selection & editing of stock recipes, with copy functionality for modification of existing & saving of new recipes

· Programming/control via a keyboard/touch pad or pop-up window on touch screen

· User Interface via .NET application run on Windows PC platform

· Standalone Real Time Controller (RTC) executes equipment automation

· RTC provides uninterrupted operation, independent of the Windows Computer and User Interface status

· All In One (AIO) PC, full HD touch-screen monitor, keyboard with touch pad

· PC provides supervisory interface to RTC, facilitates actuation of vacuum, transfer, maintenance, and deposition process components

· UI Navigation and Title Panel: Visual display and control of System status messages, user login/logout, operation mode, and system abort

· Vacuum Screen: Visual display of valve position, pump status and vacuum status

· Deposition Screen: Indication of shutter position, deposition source status, source material

· Gas Screen: Mass flow controller modes, gas valve status, pressure measurement and control display

· Motion Screen: Display/input of position and velocity as well as control of motors

· Cooling Screen: Water flow switch status for all cooling channels

· Heating Screen: Temperature set points & control parameters, PID and Auto Tuning features

· Standard Chart Recorder (plots up to 10 signals or “pens” simultaneously) and data logging (.csv file)

· Supports multiple user accounts and password levels with custom security access for recipes and screens

· System event log captures all user login/logout events, all recipes executed, and system status messages

· Open system framework must include the following

· Fully enclosed system base cabinet

· Open access to the chamber

· Leveling pads and caster wheels

· Removable enclosure panels

· The vacuum gauges for the complete system must include the following:

· Wide range vacuum gauge reads from atmosphere to 10-9 Torr (Ion gauge and Pirani)

· Wide range gauge in load lock chamber

· Pirani gauge in Cryo / foreline

· Readout is displayed on system control panel

· All mounting and connection hardware, adapters, etc.

· Water system framework

· Manual shut off valves

· Interlocked flow switches to critical components

· Cryopump compressor requires separate water connection when applicable

· NPT connections (inlet and outlet), adapters supplied when appropriate

· Gas and pneumatic controls/distribution

· Inert Vent/Purge gas, Swagelok compression fitting inlet

· Compressed air (pneumatics), compression fitting inlet

· Process gas, male VCR inlet(s), adapters supplied when appropriate

· Power distribution

· Single service drop, 208VAC, 60Hz, three phase as required

· And/or 120 VAC 60 Hz as required

· Component wiring is routed to a centralized power distribution module

· EMO protection

· Appropriate safety interlocks

· NRTL Certification must be included

· A field inspection and certification is performed at customer site by Intertek (ITNSA) in accordance with the requirements of NFPA79 and also referencing UL508A

· System must be tested to verify specifications in factory before delivery

· Minimum 12 month warranty must be included

· Packaging, shipping, and handling

· Installation and training at Air Force Research Lab, Rome, NY

* Kurt J. Lesker Company is a manufacturer whose commercial offerings are known to satisfy the Government’s requirement. Accordingly, their model number is provided here for reference, only. The identified items reflect the salient physical, functional, or performance characteristics that reflect the characteristics and level of quality that will satisfy the minimum Government requirement; however, the offeror may provide a solution equivalent to or exceeding the functional and performance characteristics of the identified items and it will be considered for technical acceptability.

Offerors must provide technical information in sufficient detail to allow adequate and thorough technical evaluation of the proposed equal solution. The Government will evaluate products on the basis of information furnished by the offeror or identified in the offer and reasonably available to the Government. The Government is not responsible for obtaining technical information in support of a proposed equivalent solution.