SOW_for_Furnace_System__7_12_18.pdf

STATEMENT OF WORK

4 Tube Furnace System

PCN:

Background

The Goddard Space Flight Center (GSFC) Detector Development Laboratory (DDL) has a requirement to procure a Furnace System with 4 individual tubes. The system is used to anneal films or create oxide films, on wafers up to 200mm in diameter, in fabrication of detector arrays, components or similar devices. The system should be suitable for a variety of wafer sizes, specifically including 100mm, 150mm and 200mm wafers. The system shall include all necessary equipment and hardware to enable automatic loading, gas control and temperature control. The vendor shall provide technical support of the equipment.

Objectives

The objective of this project is to procure a tool for furnace oxidation, growth and anneal.

Scope

The scope of this work includes production and delivery of a 4 tube, horizontal stack of furnace tubes for annealing and oxidation growth on silicon wafers. The furnace, which consists of 4 horizontal tubes, heaters, automatic loading arm, gas delivery system, and control system is used to grow silicon dioxide on silicon wafers as well as anneal films at high temperatures such as alumina. This tool will enable an increased yield as well as production of large focal plane devices, in addition to new capabilities for improved performance of products manufactured in the DDL. With our existing furnace tool, we can only accommodate 150mm wafers and the system is prone to particles and cross contamination. The procurement of this tool is essential for many projects under development and in production in GSFC’s Detector System Branch. In particular, the equipment is needed to enable internal Research & Development (R&D) projects and realize future missions such as next generation Microshutters, WFIRST (Wide Far-Infrared

Space telescope), and next generation TIRS (Thermal Infrared Sensor) for Landsat, which are important to Goddard’s lines of business.

No prototypes or one-of-a-kind systems will be considered. The unit must be a production model with at least 5 similar units working in the field. The following milestones are expected.

a) Design of the Tool at the vendor location.

b) Approval of the design by the GSFC technical representative, communicating requirements to GSFC for installation including electrical power needs, gasses vacuum and other utilities as required.

c) Construction of the Tool at the vendor facility.

d) Crating and Shipping of the unit to GSFC.

e) Installing, demonstrating, and training, of approximately three GSFC personnel, on all functions of the Tool at GSFC.

f) Acceptance testing of the Tool at NASA.

Tasks or Requirements

The Supplier shall provide a new Furnace System. The Supplier shall insure that the

Tool is equipped with the following equipment and meet the following requirements prior to Acceptance of System:

Furnace System Tool Requirements

1. A brand new unit is required; no used equipment or accessories are acceptable.

2. The size of the tool user base along with the number of units in the field will be included in the selection criteria.

3. Production scale model preferred. Unproven equipment will not be accepted, no first design models or development models will be accepted. Customer may request up to

3 references of a similar tool being utilized in the field prior to selection.

4. Meets current industry standard (semi S2) requirements for safety including the use of

Emergency Off (EMO) panic buttons. Shielding, and interlocks for hazardous areas protecting the user and maintenance personnel from high voltages, pneumatics, and moving parts and the tool from potential service failures shall be provided.

5. Tool Requirements

The system will be configured with 4 horizontal tubes, stacked on top of each other, and will be configured in the following manner at a minimum.

- Each tube will be capable of processing 8” wafers.

- Each tube will be quartz or higher temperature resistance material.

- Each tube will have an automatic loading and unloading drive mechanism.

- Each tube will have a load station with automated and integrated non-contact cantilever loading.

- Each tube will have 3 zone precision heating elements.

- Each tube will have at least a 300mm flat zone.

- Each tube will be capable of reaching a maximum temperature of 1150°C.

- Quartz wafer carriers will be included as specified below.

- Each tube will be configured as outlined below.

Quartz Wafer Carriers/Tools

- Quantity 9, 4” boat 25 slots

- Quantity 12, 6” boat 25 slots

- Quantity 6, 8” boat 25 slots

- Quantity 4, 8” baffles

- Lifting Tool/Fork for each tube

Tube Configuration

The tubes shall be configured in the following way.

Top Tube: Optimized for 4” and 6” wafers, with appropriate quartz carriers for each wafer size, utilize pyrogenic oxidation with Trans LC (Trans 1,2-Dichloroethylene).

1. Second from Top: Optimized for 6” and 8” wafers, with appropriate quartz carriers for each wafer size, utilize pyrogenic oxidation with Trans LC

2. Third from Top: Atmospheric Anneal, 4”, 6” and 8” capable with appropriate quartz carriers.

3. Fourth from Top (Bottom): Optimized for 4” and 6” wafers, with appropriate quartz carriers for each wafer size, utilize wet/dry H2O bubbler oxidation with

Trans LC. In addition, this tube will be set-up to accommodate atmospheric annealing.

5.1. Process Uniformity

Below outlines the expected process results to be used for final acceptance testing from a process point of view.

5.1.1. Pyrogenic Wet Oxide with Trans-LC

1) Process Temperature 1000 °C

2) Target 4000Å thickness

3) Wafer to Wafer Uniformity

a) 100mm Diameter Wafer better than +/- 1.7Å

b) 150mm Diameter Wafer better than +/- 1.7Å

c) 200mm Diameter Wafer better than +/- 1.7Å

4) Within Wafer Uniformity

a) 100mm Diameter Wafer better than +/- 1.3Å

b) 150mm Diameter Wafer better than +/- 1.3Å

c) 200mm Diameter Wafer better than +/- 1.3Å

5) Run to Run Uniformity

a) 100mm Diameter Wafer better than +/- 1.7Å

b) 150mm Diameter Wafer better than +/- 1.7Å

c) 200mm Diameter Wafer better than +/- 1.7Å

5.1.2. Dry Oxide with Trans-LC

1) Process Temperature 1000 °C

2) Target 1000Å thickness

3) Wafer to Wafer Uniformity

a) 100mm Diameter Wafer better than +/- 2.0Å

b) 150mm Diameter Wafer better than +/- 2.0Å

c) 200mm Diameter Wafer better than +/- 2.0Å

4) Within Wafer Uniformity

a) 100mm Diameter Wafer better than +/- 2.0Å

b) 150mm Diameter Wafer better than +/- 2.0Å

c) 200mm Diameter Wafer better than +/- 2.0Å

5) Run to Run Uniformity

a) 100mm Diameter Wafer better than +/- 2.0Å

b) 150mm Diameter Wafer better than +/- 2.0Å

c) 200mm Diameter Wafer better than +/- 2.0Å

5.2. Space Requirements.

The tool must fit within our space requirements. This requirement will be used as selection criteria. The tool foot print, that includes load station, process tubes, electronics, plumbing and user interface computer shall fit within a 48” width x

210” length with a height not to exceed 118” with exhaust lines installed.

6. Computer and Tool interface

a) The Tool shall include an interface for control of the system and logging of all process parameters. The computer shall run Windows 10 operating system.

b) The Tool interface shall allow access to recipe creation and editing, display current conditions of facilities such as temperature and gas pressures, and access process data logging.

c) The software shall handle storage of at least 1000 user recipes.

d) The software interface shall incorporate advanced recipe creation with copy and editing of recipes in the graphical user interface.

e) The software shall have onboard statistical process control.

7. Tool Diagnostics and Logging

7.1 The Tool shall incorporate a comprehensive internal hardware diagnostics system encompassing all subsystems, complete with hardware/software self-test executed at user request. All faults, errors, and unusual conditions shall be logged by the control system.

7.2 Process data and parameters shall be logged as a function of time by the Tool software diagnostics system.

8. Facilities

8.1 The Tool and all required facilities shall be specified at the time of award and

GSFC shall be notified of these requirements.

8.2 Exterior surface parts shall be clean and free of grease or dust and compatible with operation in a Class 100 cleanroom environment.

9. Installation and Training

9.1 The price of the system will include installation at GSFC. Installation will include a demonstration that the tool is within compliance with the specifications.

9.2 The price of the system must include all crating and delivery of the tool to

Goddard Space Flight Center.

9.3 At the completion of installation and demonstration of final acceptance, the successful contractor will provide on-location training at GSFC.

10. Documentation and Warranty

10.1 Two (x2) full sets of all written documentation shall be provided on cleanroom paper. This will include user manuals or equivalent as well as copies of any software, and any manuals for the software included with the system, and third part manuals. This documentation should be received by GSFC with the system hardware.

10.2 The contractor will offer the GSFC at least the same warranty terms, including offers of extended warranties, offered to the general public in customary commercial practice. Warranty terms must be included in the system price. The period of warranty will begin upon acceptance of the system.

The Supplier shall install the system on-site at GSFC’s Detector Development Laboratory or another, designated, laboratory in Code 553 control and provide operator training of the system. Together with GSFC technical personnel, the Supplier shall review the system, demonstrate and confirm that the system functions properly based on the specifications above.

Supplier shall provide a Warranty of at least 12 Months (Parts and Labor), guaranteed to meet factory specifications.

Installation and training shall be performed by a factory trained technician at

NASA/GSFC.

Deliverables or Delivery Schedule

Deliver complete specified (as described above) system. Set up and install all components at GSFC Detector Development Laboratory.

1. Demonstrate system with specified performance/acceptance criteria (described above). Acceptance of system will be conditional upon successful demonstration of functions.

2. Provide user training for equipment operation.

3. Equipment warranty on parts and labor for at least one year.

4. Operational manuals and maintenance manuals with circuit schematics and layouts.

5. Spare parts.

Delivery Schedule

Within 22 weeks after receipt of order.

Government-Furnished Equipment and Government-Furnished Information

No Government-furnished equipment (GPE) and Government-furnished information

(GFI) will be required

Security

The Supplier Representative who will be installing the Furnace and Training NASA personnel must be a US Citizen.

Place of Performance

The Construction of the Tool shall be performed at the Supplier’s facilities.

The Installation and Training shall be performed at NASA/GSFC, Greenbelt, Maryland.