SOW-_FOR_RFP_80GSFC182869.pdf

SELFI-INST-SOW-0001

Initial Release – Jan 26th, 2018

SELFI Low Noise Amplifier (LNA) Statement of Work & Specification

Effective Date: 1/26/2018 Expiration Date: 1/26/2023

Prepared by:

Kevin Horgan/555

Goddard Space Flight Center Greenbelt, Maryland

National Aeronautics and Space Administration

Document Released on Jan 26th, 2018 by:

Microwave Instruments and Technology Branch (MITB) Technical Data Management System (TDMS) i

CM FOREWORD

This signature-controlled document is configured in NASA Goddard’s Microwave Instruments Technology Branch (MITB) Code 555 Technical Data Management System (TDMS). Changes to this document require prior approval of the SELFI Lead Systems Engineer or designee.

Proposed changes shall be submitted in MITB Code 555 TDMS justifying the proposed change.

In this document, a requirement is identified by “shall,” a good practice by “should,” permission by “may” or “can,” expectation by “will,” and descriptive material by “is.”

Check MITB Code 555 TDMS to verify that this is the correct, latest version prior to use.

ii

Prepared by:

Kevin Horgan SELFI RF Engineer GSFC-Code 555

Approval Signatures:

Dr. Negar Ehsan SELFI Spectrometer Front End (SFE) PDL GSFC-Code 555

Dr. Paul Racette SELFI Lead Systems Engineer GSFC-Code 555 iii

Document Change Log

DOC

REV

REQUIREMENT WAS IS NOW

APPROVAL /

DATE

- Initial Release N. Ehsan, P. Racette Jan-25-2018 iv

Table of Contents

v

APPENDIX A: ABBREVIATIONS AND ACRONYMS

1 Introduction

1.1 General Information

Submillimeter Enceladus Life Fundamentals Instrument (SELFI) is a three-year Maturation of Instruments for Solar System Exploration (MatISSE) project. SELFI will develop a flexible and power-efficient spectrometer to meet the requirements for a mission to Enceladus in order to 1) investigate the composition, abundance, thermal structure, and transport within the plumes, and 2) characterize the source region and processes from which the plumes emerge.

In order to accomplish mission science objectives, the project will develop a high sensitivity receiver, that includes submm-wave Low Noise Amplifiers (LNAs). This document defines the technical requirements and the work required to design, fabricate, and deliver the LNAs.

1.2 Executive Summary

Vendor will develop a submm-wave LNA. Detailed performance and interface requirements are provided in Sections 2 and 3 of this document. The complete deliverables list is provided in Section 7 however, the following list summarizes this contract:

- Vendor shall deliver 15 chip LNAs and four packaged LNAs.

- Vendor shall build and test LNAs in an Electro-Static Discharge (ESD) controlled work area.

- Vendor shall deliver an End Item Data Package (EIDP) with each LNA, as defined in Section 7.

- Reviews and meetings required for this contract are defined in Section 6.2.

- Contract cost shall include any/all shipping and tariffs

- Contract shall include options to purchase additional packaged LNAs, at increased cost.

1.3 Hardware Classification

The contractor shall deliver two classes of hardware:

1) Chip LNAs (Qty. 15)

2) Packaged LNAs (Qty. 4)

1.4 Hardware Delivery Schedule

The contractor shall deliver hardware between 12 and 18 months ARO, assuming contract award on April 1, 2018. LNAs shall be delivered no later than September 2019

1.5 Hardware Payment Milestones

The contract will feature payment milestones, with the amounts and milestone events finalized during the procurement process.

2 Performance Requirements

2.1 RF Performance Requirements

Table 1: RF Performance Requirements Parameter* Comments Min.

Limit Max Limit

Units

RF Passband Nominal Center Frequency: 565 GHz 530 600 GHz Gain Across RF passband 20 dB Gain Flatness Across RF passband 5 dB Noise Figure Across RF passband 12 dB Input Return Loss Across RF passband 10 dB Output Return Loss Across RF passband 10 dB

* Requirements shall be met over the performance temperature range defined in Section 4.1

2.2 DC Supply Requirements

2.2.1 LNA Power Consumption

The packaged LNA power consumption shall not exceed 1.0 W

2.2.2 LNA Biases

Chip LNAs: The government understands that chip LNAs will feature multiple different biases.

For delivered chip LNAs, vendor shall provide bias information such as drain and gate voltages, and optimum bias points for each chip.

Packaged LNAs shall operate from a single bias, +5 VDC or less. Within 60 days ARO award, the vendor shall define bias interface e.g. pins, connector, coaxial connector, etc.

2.2.3 Chip LNA Bias Sequencing

The vendor shall provide bias sequencing, including timing information, for the chip LNAs

2.2.4 LNA Power Supply Characteristics

The vendor shall provide a circuit model of the packaged LNA power conditioning circuits, to allow the government to tune their bias and telemetry circuits, and for potential diagnostic purposes.

Vendor shall provide turn-on characteristics (time versus gain) for packaged LNAs.

2.2.5 Short Circuit and Negative Voltage Protection

The government does not require short-circuit or negative voltage protection; however, vendor is welcome to consult with government engineers if they wish us to review their bias circuits and provide recommendations to update/improve their circuits to feature either of these protections.

3 Interface Requirements

3.1 Chip LNA Interfaces

The vendor shall clearly define the chip LNA RF and bias interfaces in documentation, to include a DXF file that defines chip dimensions and the locations of all bonding pads.

3.2 Packaged LNA Dimensions

The vendor shall clearly define the packaged LNA mechanical interface in documentation, to include a CAD solid model that describes the packaged LNA mechanical interface. The government understands that the CAD solid model will not feature vendor’s proprietary internal detail.

The waveguide flange specifications will be finalized after contract award, following discussions with other SELFI sub-system vendors.

3.3 Packaged LNA Package Material

The preferred LNA packaging shall be gold-plated aluminum or gold-plated brass; however, vendor may select other materials, upon consultation with the government.

3.4 Packaged LNA Telemetry

The packaged LNAs are not required to feature any telemetry monitoring circuits for voltage, current, or temperature. Other SELFI subsystems will handle telemetry monitoring.

4 Environmental Requirements and Screening

4.1 Operating Temperature Range

The Operating Temperature Range of the Packaged LNAs shall be 0 degC to +40 degC. The vendor shall test all packaged LNAs over this range, measured every 5 degC.

The vendor is only required to meet all Table 1 RF requirements over the more-narrow Performance Temperature Range, defined as 0 degC to +25 degC.

4.2 Non-operating Survival Temperature Range

Cold-Survival: The packaged LNAs shall be exposed to -20 °C for one-hour unpowered and suffer no degradation in performance when returned to the operating and performance temperature ranges.

Hot-Survival: The packaged LNA shall be designed to withstand +110 degC for 50-hours unpowered and suffer no degradation in performance when returned to the operating and performance temperature ranges.

At least one packaged LNA shall be tested as part of the base contract. This requirement is driven by NASA Planetary Protection Policy that will be levied upon the future mission for SELFI-based instrument.

5 Electrical, Electronic, and Electromechanical (EEE) Parts

5.1 EEE Parts Screening and Selection

Due to the development nature of the SELFI project, the government IS NOT imposing parts screening and selection requirements upon the vendor, as typically required for its spaceflight missions. The government does encourage the vendor to have government engineers review their parts list and circuits prior to prototype builds to improve part selection.

6 Management, Reporting, Documentation and Reviews

6.1 Management and Reporting

Vendor shall designate a single individual who has full responsibility and authority to manage and administer all phases of the work specified by the contract and ensure that all objectives are accomplished within schedule and cost constraints.

Vendor shall designate and identify by name a single individual who shall serve as a point of contact with the GSFC Contractor Officer’s Representative (COR) for all technical aspects of the SELFI LNA contract. The contractor single point of contact shall make themselves available for semi-monthly, informal phone conversations with the GSFC COR in order to discuss issues relating to the contract.

Vendor shall generate a list of significant milestones that will be included in SELFI’s master schedule to enable the NASA to ascertain program progress.

6.2 Reviews and Meetings

The following table summarizes reviews:

Date Location Description ARO + 1 week Video Conference Contract Kick-off TBD Video Conference Preliminary Design Review TBD Video Conference Chip Measured Results Review TBD Video Conference Pre-Ship Review

6.2.1 Preliminary Design Review

The Contractor shall organize and present an informal Preliminary Design Review (PDR) on a date finalized in the contract kick-off meeting. This PDR shall demonstrate overall conformance of the requirements specified herein. This review shall cover technical and programmatic topics.

This review shall also provide an opportunity to review drawings, schematics, and analyses that must be approved prior to the start of fabrication.

6.2.2 Chip Measured Results Review (CMRR)

The Contractor shall hold a review to provide measurement results of the chips LNAs, prior to the build of the Packaged LNAs.

6.2.3 Pre-Ship Review (PSR)

The Contractor shall organize and present a Pre-Ship Review at the completion of verification tests and prior to delivery of the hardware to GSFC. Engineering documentation, defined in Section 7, shall be presented for review at the PSR. If hardware deliveries are split, a PSR shall be held for each delivery. The contractor shall provide PSR review package(s), including test data, one week prior to the review(s).

7 Engineering Documentation

7.1 Mechanical Interfaces

The Contractor shall provide drawings and/or documents that define, in detail, all mechanical and thermal interfaces.

a. Chip LNAs shall be described by a PDF and DXF, showing the dimensions (including the thickness) of the chip and the locations of the RF and DC pads, with respect to the chip layout.

b. Packaged LNAs shall be described by a PDF and DXF, showing package outer dimensions (vendor-proprietary internal features may be hidden)

c. Packaged LNAs shall be described by a 3D model (format TBD) showing package outer dimensions (vendor-proprietary internal features may be hidden)

7.2 Electrical Bias Interfaces

The Contractor shall provide a schematic that defines the bias interface.

Note: The primary reason for this request is so that the government can best design compatible bias and telemetry circuits to interface with the vendor LNA. The secondary reason for this request is so that the government can perform a worst-case analysis of the bias circuit parts to ensure compatibility with NASA’s EEE-INST-002 requirements, which will be levied upon a future spaceflight version of the LNA.

7.3 Data Delivery Package

The Data Delivery Package shall be made available for review during inspections and pre-ship reviews for each of the different hardware deliverables. This data package shall also be delivered with each end item with the level of detail required of that item. The data package should be comprised of, but not limited to, the following data:

For Chip LNAs:

a. Measured s-parameter results in S2P format, to include Output-P1dB

b. Bias information for each chip

c. Simulated Noise Figure, as a function of frequency

d. Measured Noise Figure, as a function of frequency, if vendor has capability to measure at the chip level. Note: State in proposal whether or not chip-level noise figure measurements will be performed.

Packaged LNAs:

a. Measured s-parameter results in S2P format, to include Output-P1dB

b. Measured noise figure as a function of frequency

7.4 Verification Matrix

The verification matrix for each LNA shall show how compliance to each requirement was completed (signed off) and indicate the method used to verify it. Verification methods are:

Inspection: Designated as (I) and represents inspection of the physical hardware by a customer appointed qualified inspector for compliance.

Analysis: Designated as (A) and represents documentation of performance or function through detailed analysis using all applicable tools and techniques.

Test: Designated as (T) and represents a detailed test of performance and/or functionality throughout a properly configured test setup where all critical data taken during the test period is captured for review.

In-process production evaluation tests and environmental stress screening tests shall also be considered to be verification tests.

8 Quality Assurance

8.1 Workmanship Standards and Processes

GSFC recognizes that the contractor has an established workmanship program sufficient to build and test the LNA hardware described herein.

8.2 Electrostatic Discharge Control Requirements

The Contractor shall discuss their ESD Control Program with GSFC and if possible will modify this Program to be in accordance with the intents of ANSI/ESD S20.20.

8.3 Configuration Management

The contractor’s Configuration Management (CM) system shall configure and control the design and hardware/software documentation by means of drawings, specifications, and other documents. This system shall also capture all changes and shall ensure all applicable changes are reviewed in a systematic manner.

8.4 Certificate of Conformance

The LNAs shall be delivered with a manufacturer’s Certificate of Conformance (C of C). The C of C shall specify, as a minimum, the purchase part number, quantity delivered, lot/date/batch codes traceable to the delivered material, purchase order or contract number, manufacturer’s name and address, and signature of manufacturer’s authorized Quality Assurance representative.

APPENDIX A: Abbreviations and Acronyms

ABBREVIATION/

ACRONYM DEFINITION

ARO After Receipt of Order C of C Certificate of Conformance CAD Computer Aided Drawing CM Configuration Management CMMR Chip Measured Results Review CO Contracting Officer COR Contracting Officer Representative DXF Drawing Exchange Format (a CAD data file format by AutoDesk) EEE Parts Electrical Electronic and Electromechanical Parts EIDP End Item Data Package ESD Electrostatic-Discharge GSFC Goddard Space Flight Center ICD Interface Control Drawing or Interface Control Document LNA Low Noise Amplifier MatISSE Maturation of Instruments for Solar System Exploration MITB Microwave Instruments Technology Branch NASA National Aeronautics and Space Administration PDR Preliminary Design Review PSR Pre-Ship Review QA Quality Assurance SELFI Submillimeter Enceladus Life Fundamentals Instrument SOW Statement of Work TBC To Be Confirmed TBD To Be Determined TDMS Technical Data Management System