Thermal_Effusivity_Analyzer_Specifications.pdf

Thermal Effusivity Analyzer (ASTM D7984)

• It should measure thermal effusivity and thermal conductivity of fabric/textiles directly.

• It should conform to ASTM D7984.

• Thermal Effusivity Range: 5 to 1,600 Ws½/m²K, ability to add up to 19,500 Ws½/m²K.

• Thermal Conductivity Range: 0.025 to 0.65 W/mK; ability to add up to 500 W/mK.

• It can be used for testing unlimited sample size and unlimited sample thickness.

• It should not require any sample preparation.

• It should use non-destructive method.

• It should use test method: Modified Transient Plane Source (MTPS) with Guard Ring.

• It should require only a single side of the sample for measurement; double-sided method is not permitted.

• The sensor should be factory calibrated; it should not need developing of any timing or power parameters.

• Sensor Element: should be stainless steel housing, alumina substrate, active sensing component should be made of platinum alloy, and coated with dielectric glass, must be 17mm in diameter.

• It should have the ability to instantaneously monitor ambient temperature.

• Due to sample compatibility issues: Teflon, Mica or Kapton-coated (or polyimide substitutes) materials are NOT permissible as materials of construction to sensor.

• The sensor should be able to operate in various environments, including thermal chambers, high pressure vessels and glove boxes.

• Test Time: 0.8 to 2 seconds

• Maximum Sample Testing Size: unlimited

• Minimum Sample Testing Size: 17 mm

• Maximum Thickness: unlimited

• Minimum Thickness: 0.5 mm

• Precision: better than 1%

• Accuracy: better than 5%

• It should be supplied with windows-based software. Easy export to Microsoft Excel.

• It should be supplied with constant pressure applicator as described in ASTM D7984.

• It should be supplied with calibration reference material Polyfelt.

• It should have the ability to be upgraded in the future with the following options:

to be used in testing at non-ambient temperature from -50 to 200 DegC, to be used in testing under controlled pressure environments up to 2000 PSI, thermal conductivity measurements between 0 to 500 W/mK, thermal effusivity measurements between 0 to 19,500 Ws½/m²K ability to be connected to dilatometer for thermal expansion and shrinkage measurements.