This $550,000 Partnerships for Innovation - Technology Translation (PFI-TT) project grant awarded by the National Science Foundation (CFDA 47.084 - NSF Technology, Innovation, and Partnerships) focuses on developing and commercializing high-performance, nanostructured thermal pads to improve heat dissipation in electronics.
The objective is to create scalable, cost-effective manufacturing processes for these nanostructured thermal pads that can substantially reduce thermal interface resistance and enhance system reliability in electronics. The project investigates integrating the new thermal pads with existing products to enable their full commercialization potential. The research aims to address critical heat dissipation challenges in electronics, contribute to industrial decarbonization, and enhance the performance and reliability of electronic systems. Carnegie Mellon University, the prime awardee, will lead this collaborative effort from July 2024 through June 2026.
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