North Dakota State University received a $174,948 Project Grant award from the National Science Foundation Division of Computing and Communication Foundations on July 15, 2021 to enable metal inter-layer via device utilization for on-chip memory in monolithic three-dimensional integrated circuits. The award is funded through the Computer and Information Science and Engineering program (CFDA #47.070), which supports investigator-initiated research and education in all areas of computing, communications, and information science and engineering.
Under this award, North Dakota State University will conduct research to advance the development of three-dimensional integrated circuits with a focus on enabling metal inter-layer via device utilization to improve on-chip memory functionality. The research is expected to be completed by June 30, 2023. The $174,948 in funding will support the University's work over the two-year period to help advance this area of computing technology.
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