This Project Grant from the National Science Foundation's Division of Electrical, Communications and Cyber Systems provides $408,546 to Washington State University from October 1, 2021 to September 30, 2024. The funding supports fundamental investigation on flexible high temperature devices under the NSF's Engineering program (CFDA #47.041). This program seeks to improve quality of life and economic strength by fostering innovation and excellence in engineering research. Specifically, the grantee will conduct research at its location in Vancouver, WA on developing flexible devices capable of withstanding high temperatures, advancing engineering innovation in areas such as electronics and energy technologies. The award amount and period of performance indicate a substantial research effort aimed at generating new knowledge with long term applications.
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