Purchase Order DOCSB134116SU0391
Award Date 7/8/16
Potential Completion Date 1/31/17
Potential Value $118K
Federal Agency
Awardee
Ultimate Awardee
Not listed NAICS Category
PSC Category
Federal Contract Vehicle
- Not listed
Set-Aside Type
Total Small Business
Extent Competed
Competed under SAP
Major Defense Program
Not listed Pricing Type
Firm Fixed Price
Place of Performance
Anaheim, CA 92806, USA
Solicitation Procedures
Simplified Acquisition
Number Of Offers Received
3
Legislative Mandate
Not listed National Interest Action
Not listed Research Type
Not listed Primary Consortia Member
Not listed Similar Awards
- The National Institute of Standards and Technology (NIST) awarded a $46,000.00 firm fixed price purchase order contract to Cook And Weil, Inc., doing business as Cook & Weil Inc., for a manual wedge/ball wire bonder. The contract is a total small business set-aside and has an ultimate completion date of November 17, 2025. The wire bonder is required to support NIST's Physical Measurement Laboratory's Quantum Measurement Division in the development and repair of single-photon devices used...
- <p>The Department of Commerce National Institute of Standards and Technology (NIST) awarded a firm-fixed-price purchase order contract to Tresky Corp, a for-profit organization, for a Semi-Automatic Die Bonder Station. The contract has a potential value of $158,565.00 and a completion date of March 22, 2024. The contract does not have a set-aside designation. The award was made on September 15, 2023.</p>
- <p>This is a firm fixed-price purchase order awarded by the National Institute of Standards and Technology (NIST), a civilian government agency, to PVD Products, Inc., a small business contractor. The contract is for the delivery of a suite of epitaxial material deposition systems, with a total ceiling value of $1,474,750.00 and a completion date of November 28, 2016. The contract was set aside for small businesses.</p>
- This federal contract award to Finetech, a for-profit organization based in Mesa, Arizona, is for the purchase of an automated flip-chip die bonder and extended warranty, valued at $643,110.00. The contract was awarded by the National Institute of Standards and Technology (NIST), a civilian agency within the Department of Commerce. The original solicitation, NIST-SS24-CHIPS-0021, sought proposals for an automated flip-chip die bonder capable of precision placement and bonding of silicon dies...
- This is a firm fixed-price purchase order awarded by the National Aeronautics and Space Administration (NASA) Shared Services Center to Nordson Dage, Inc. for a Wirebond Pull Tester, valued at $60,786.60. The contract has a performance period that runs through April 26, 2023. The Wirebond Pull Tester is being procured as a commercial item under FAR Part 12 and FAR Part 13 procedures, as Nordson Dage is the sole provider of the required equipment and accessories. The contract does not have a...
- This firm-fixed-price purchase order was awarded by the National Institute of Standards and Technology (NIST), a civilian agency under the U.S. Department of Commerce, to Semiprobe, Inc., a small business manufacturer of probing and inspection systems for the semiconductor industry. The $128,035.00 contract is for the procurement of a wafer probing system, including installation and training, to be delivered by November 28, 2017. The award has a total small business set-aside designation....
- The National Institute of Standards and Technology awarded a $85,875 firm fixed-price purchase order to V-Tek Inc., a small business manufacturer based in Mankato, Minnesota, for a CHIPS Research & Development bond strength tester under the Total Small Business set-aside program. The contract, issued on March 31, 2026, calls for delivery of a bench-top bond testing unit by July 3, 2026, to support NIST's Physical Measurement Laboratory in Boulder, Colorado. The equipment must meet specific...
- The Department of Commerce's National Institute of Standards and Technology awarded a $946,837 firm fixed price purchase order to Suss Microtec Inc. of Germany. The contract calls for delivery and installation of a wafer bonder capable of substrates from 10mm to 150mm and a lithography aligner compatible with the bonder and achieving sub-micron resolution. Installation at NIST's Center for Nanoscale Science and Technology user facility is required within 60 days of each delivery, along with...
- This is a firm fixed-price purchase order awarded by the National Institute of Standards and Technology (NIST), a civilian federal agency, to Washington International Partners LTD, a self-certified small disadvantaged business. The contract is for $126,886.41 to provide scientist and engineering support for NIST's Measurement Science for Additive Manufacturing Program. The contract has a total small business set-aside designation and was awarded on May 3, 2016 with a final completion date of...
- This is a $558,362.46 firm fixed-price purchase order awarded by the National Institute of Standards and Technology (NIST) to Formfactor, Inc. to provide a fully autonomous wafer probing system up to 110 GHz for NIST's microwave materials lab. The award supports NIST's CHIPS program to develop and disseminate measurement best practices. The contract includes Wincal software, on-wafer and DC probes, a capacitor sensor, an autoprober system, installation, training, and a 3-year warranty and...