Purchase Order 80GRC022P0004
- Not listed
- This is a $65,500 firm-fixed-price purchase order awarded by the National Aeronautics and Space Administration (NASA) Shared Services Center to Sienna Technologies, Inc., a for-profit manufacturer of specialized technology solutions, for the multi-chip module packaging of silicon carbide (SiC) pressure sensors and electronics. The contract is a sole-source award under the authority of FAR 13.106-1(b)(1)(i) and does not have a set-aside designation. The required services will be performed at...
- The U.S. National Aeronautics and Space Administration (NASA) awarded a $68,845 firm-fixed-price purchase order contract to Cook & Weil Inc., a for-profit organization based in Morganville, New Jersey. The contract is for the provision of a TPT Semi-Automatic Heavy Wire Bonder, a specialized piece of semiconductor manufacturing equipment, to be delivered by October 9, 2025. This procurement was originally posted as a Total Small Business set-aside, but was ultimately awarded to Cook &...
- The National Aeronautics and Space Administration (NASA) Goddard Space Center awarded a firm fixed price purchase order to F & K Delvotec Inc., a foreign-owned for-profit organization, to procure a wire bonder capable of fully automatic wire bonding of devices at a high rate. The system must be capable of ball bonding and wedge-wedge bonding, both 45 degree and 90 degree, and be convertible by the end user between different types of bonding. The potential value of the contract is...
- This $160,427 firm fixed-price purchase order was awarded by the Shared Services Center, a civilian federal agency, to General Electric Company (GE) for the development of back-end-of-line (BEOL) silicon carbide (SiC) integrated circuit processing. The contract has a completion date of November 30, 2024. This award was made under a competitive solicitation issued by the NASA Glenn Research Center, which did not use a small business set-aside. The statement of work for this procurement...
- This is a $278,753 firm fixed-price contract awarded by the NASA Glenn Research Center to General Electric Company (GE) for the fabrication of small-feature extreme environment durable 4H-silicon carbide (SiC) junction field effect integrated circuits on 100 mm diameter SiC wafers. The contract has an ultimate completion date of October 17, 2025 and was not set aside for any specific business type. This contract is likely part of NASA's broader research and development efforts focused on...
- This is a $249,999.00 firm fixed price purchase order contract awarded by the National Aeronautics and Space Administration (NASA) Langley Research Center to Frequency Management International, Inc., a small business. The purpose is to design single-event effect (SEE) and total ionizing dose (TID) hardened silicon carbide power metal-oxide-semiconductor field effect transistors (SiC power MOSFETs) for use in next-generation aerospace power systems, including high-temperature boost power...
- This federal contract award, with an ID of 80NSSC25PA254, was issued by the National Shared Services Center (NSSC) of NASA to MSE Supplies LLC, a minority-owned and Asian-Pacific American-owned limited liability company based in Tucson, Arizona. The contract, valued at $70,033.97, is for the procurement of homoepitaxially grown N-type and P-type 4H-silicon carbide (4H-SiC) on semi-insulated 4H-SiC substrates. The original solicitation was issued as a Special Notice by NASA's NSSC, indicating...
- This is a firm fixed-price purchase order contract awarded by the National Aeronautics and Space Administration (NASA) Shared Services Center to Technical Glass Products, Inc. of Painesville, Ohio. The contract is for the procurement of replacement parts for an ISO 5 semiconductor processing furnace system, with a ceiling value of $54,698.05 and a performance period ending on December 2, 2025. The original solicitation was a special notice issued by NASA, seeking to award a sole-source...
- Micro-Precision Technologies, Inc., doing business as Aerospace Semiconductor, has been awarded a $149,969 firm fixed price purchase order by the National Aeronautics and Space Administration (NASA) Shared Services Center to conduct research under Phase I of the Small Business Innovation Research (SBIR) program. The contract calls for Aerospace Semiconductor to perform work on nonplanar spaceborne additively manufactured electronics in support of NASA's efforts to advance additive...
- The National Aeronautics and Space Administration (NASA) Shared Services Center awarded a Firm Fixed Price, Definitive Contract to Coolcad Electronics, LLC, a small business, for the "INTEGRATED ON-CHIP POWER FOR HARSH ENVIRONMENTS" project under the SBIR Program Phase II Action. The $949,960.00 contract, which has a completion date of May 13, 2023, is for research and development of specialized electronics and semiconductor devices, including silicon carbide integrated circuits,...
The U.S. National Aeronautics and Space Administration (NASA) Glenn Research Center awarded a $254,591 firm-fixed-price purchase order contract to Hesse Mechatronics, Inc., a for-profit manufacturer of wire-bonders and automation solutions. The contract is for an automated wire-bonder to package high-temperature silicon carbide (SiC) integrated circuits (ICs) for aerospace applications. This contract was not set-aside for any small business category. The contract stems from a sources sought notice NASA issued in October 2021 to determine competition and small business subcontracting goals for this requirement. NASA plans to update information about any future solicitation on SAM.gov, and interested parties are responsible for monitoring the website.
Name | Description | Solicitation Number | FederalAgency | Type | PostedDate |
|---|---|---|---|---|---|
Automated Wire Bonder | 80GRC022P0004 | National Aeronautics and Space Administration Glenn Research Center | Award Notice 3/3 | 1/5/22, 12:03 PM | |
Automated Wire Bonder | 80GRC022Q0002 | National Aeronautics and Space Administration Glenn Research Center | Solicitation 2/3 | 11/4/21, 10:26 AM | |
Automated Wire Bonder | 80GRC022AWB2 | National Aeronautics and Space Administration Glenn Research Center | Pre-Solicitation 1/3 | 10/4/21, 4:17 PM |
Mod # | Description | ReasonForModification | Federal Obligation | Date |
|---|---|---|---|---|
| P00001 | Other Administrative Action | $0 | 2/3/22 | |
| Not listed | Not listed | $254.6k | 12/29/21 |